Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Xilinx XA7Z030-1FBV484Q is a CMOS microprocessor circuit with 484 ball terminals. It operates in automotive-grade temperatures (-40 to 125 °C) and is AEC-Q100 screened. This square grid array package is ideal for automotive applications requiring high-performance processing capabilities.
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The plastic/epoxy material used for the package body provides durability and protection for the internal components of the product, making it suitable for automotive applications.
The surface mount feature makes the product easier to install and reduces the overall size of the assembly, saving valuable space on the PCB.
The AEC-Q100 screening level ensures that the product meets automotive industry standards for quality and reliability, making it a reliable choice for automotive applications.
The square package shape allows for better heat dissipation and efficient use of space on the PCB, contributing to the overall reliability and performance of the product.
The high number of terminals provides a wide range of connectivity options and flexibility for integrating the product into complex electronic systems.
The grid array package style offers high density mounting and improved electrical performance, making it ideal for applications where space is limited and signal integrity is critical.
The high maximum operating temperature of 125°C ensures the product can withstand harsh environmental conditions commonly found in automotive applications.
The low minimum operating temperature of -40°C allows the product to function reliably in cold weather conditions, making it suitable for a wide range of automotive applications.
The use of a microprocessor circuit in the peripheral IC provides advanced processing capabilities and enables efficient communication with other components, enhancing the overall functionality of the product.
The CMOS technology used in the product offers low power consumption and high noise immunity, making it suitable for reliable operation in automotive systems where power efficiency is crucial.
The ball terminal form provides reliable electrical connections and improved thermal performance, ensuring the product can maintain stable operation under demanding conditions in automotive applications.
Other Function uPs,uCs & Peripheral ICs XA7Z030-1FBV484Q attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx
JESD-30 Code:
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XA7Z030-1FBV484Q Peripheral ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
SS14
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CN
Texas Instruments
LM555CN by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V. It operates b/w 0°C to 70°C, making it suitable for commercial applications. This rectangular package IC has dual terminals and uses bipolar technology for pulse generation in various electronic circuits.
MBR0520LT1G
Onsemi
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
LM317T
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Package Shape: RECTANGULAR; Minimum Input-Output Voltage Differential: 3 V;
BAV99
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Samsung
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel; Maximum Line Regulation (%/V): .07;
M39029/58-360
Tri-star Electronics International
CONNECTOR ACCESSORY; Material: COPPER ALLOY; MIL Conformity: YES; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; MIL-Connector Accessory Name: CONTACT; Terminal Type: CRIMP;
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
1N4148WS
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Renesas Electronics
1N4148W-T
Micro Commercial Components
1N4148W-T by Micro Commercial Components is a single rectifier diode with a max reverse recovery time of 0.004 us. It operates b/w -55 to 150 °C and has a max output current of 0.15 A. Ideal for applications requiring fast switching speeds in small outline packages.
SDR0604-101KL
Bourns
SDR0604-101KL by Bourns is a surface mount fixed inductor with a nominal inductance of 100 uH. It is a general purpose inductor suitable for power applications, with a max rated current of 0.52 A and a self-resonance frequency of 9 MHz.
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
Formosa Microsemi
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
LM358N
Kec
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LL4148
Rfe International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
RC0805FR-0710KL
Yageo
Yageo's RC0805FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. Ideal for applications requiring resistance to operate b/w -55°C to 155°C, such as in automotive electronics or industrial control systems. Features metal glaze/thick film technology and matte tin finish with nickel barrier.
MCIMX6X3EVN10AB
MCIMX6X3EVN10AB by NXP Semiconductors is a SoC with 400 terminals in a low profile, fine pitch grid array package. It operates b/w -20 to 105 °C with supply voltage range of 1.35V to 1.5V. Ideal for commercial extended temperature grade applications requiring CMOS technology and surface mount compatibility.
ATECC608A-SSHCZ-T
Microchip Technology
Microchip ATECC608A-SSHCZ-T is a cryptographic authenticator IC with 2-5.5V supply, -40 to 85°C temp range, and TS16949 screening. Ideal for secure applications in industrial settings due to its small size and CMOS technology.
A5000R2HQ1/Z016UZ
NXP Semiconductors A5000R2HQ1/Z016UZ is a cryptographic authenticator IC with 20 terminals, CMOS technology, and 1.8V nominal voltage. It operates b/w -40 to 105 °C and has a max supply voltage of 3.6V. Ideal for secure applications requiring high-level encryption in compact designs.
CY8C6347BZI-BLD53
Infineon Technologies
PROGRAMMABLE SoC; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3;
ESP32-C3FH4
Espressif Systems (Shanghai)
ESP32-C3FH4 by Espressif Systems (Shanghai) is a 32-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 3-3.6 V. Ideal for applications requiring low-profile, surface-mount chips in compact designs.
CY8C6137BZI-F34
CY8C6137BZI-F34 by Infineon is a 124-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V. With a grid array package style, it's ideal for applications requiring fine pitch and thin profile designs.
XCZU9EG-2FFVB1156I
Xilinx
XCZU9EG-2FFVB1156I by Xilinx is a CMOS MICROPROCESSOR CIRCUIT with 1156 terminals in a GRID ARRAY package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This industrial-grade IC is ideal for applications requiring high-performance processing capabilities.
MCIMX6X1AVO08AB
MCIMX6X1AVO08AB by NXP Semiconductors is a System on Chip with 400 terminals, operating at -40 to 125 °C. It has a supply voltage range of 1.275V to 1.5V and uses CMOS technology. Ideal for automotive applications due to its low profile, fine pitch grid array package style.
AR1100-I/MQ
Microchip Technology's AR1100-I/MQ is a CMOS microprocessor circuit with 20 terminals in a square chip carrier package. It operates b/w -40 to 85 °C with supply voltage range of 3.135V to 3.465V, suitable for industrial applications requiring very thin profile and surface mount capability.
CYAT827AZA59-2200A
PSoC;
XCZU1EG-2SFVA625E
MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);
XAZU5EV-1SFVC784Q
Xilinx XAZU5EV-1SFVC784Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. The package is GRID ARRAY, FINE PITCH with 784 terminals and measures 23x23 mm in size.
CY8C4146LQI-S422T
PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Finish: PURE TIN; Moisture Sensitivity Level (MSL): 3;
NRF52810-QFAA-R7
Nordic Semiconductor Asa
NRF52810-QFAA-R7 by Nordic Semiconductor Asa is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and supports supply voltage range of 1.7V to 3.6V. Ideal for industrial applications requiring low-profile, square-shaped chips with 48 terminals in a QUAD position.
XCZU9EG-1FFVB1156I
XCZU9EG-1FFVB1156I by Xilinx is a CMOS MICROPROCESSOR CIRCUIT with 1156 terminals in a GRID ARRAY package. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high-performance processing capabilities.
CY8CPLC10-28PVXI
Cypress Semiconductor
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;
LTC4263IDE-1#PBF
Linear Technology
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVSON; Package Shape: RECTANGULAR;
14255R-100
SoC;
PN7120A0EV/C10801E
NXP Semiconductors' PN7120A0EV/C10801E is a 49-terminal IC with 1.8V supply voltage, operating b/w -30°C to 85°C. It features a grid array package style, ball terminal form, and tin silver copper finish. Ideal for applications requiring fine pitch surface mount technology in plastic/epoxy packages.
SLB9665XQ20FW563XUMA2
Infineon's SLB9665XQ20FW563XUMA2 is a 32-terminal cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 3-3.6 V. Ideal for applications requiring secure authentication in compact spaces due to its very thin profile and square shape package design.
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XA7Z020-1CLG484Q
XA7Z020-1CLG484Q by Xilinx is a MICROPROCESSOR CIRCUIT with 484 terminals in a GRID ARRAY package. Operating b/w -40 to 125 °C, it's AEC-Q100 compliant for AUTOMOTIVE use. Features include 1.8V power supply, 0.8mm terminal pitch, and TIN SILVER COPPER finish.
XA7Z020-1CLG400Q
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
XA7Z020-1CLG400I
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B400;
XA7Z010-1CLG400Q
XA7Z010-1CLG225Q
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;
XA7Z010-1CLG225I
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE; Width: 13 mm;
XA7Z010-1CLG400I
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA400,20X20,32;
XA7Z020-1CLG484I
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 484; Package Code: LFBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
XA7Z030-1FBG484I
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Ultraviolet Erasable: N;
XA7Z030-1FBG484Q
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XA7Z030-1FBV484I
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
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