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SCANSTA112VSX/NOPB

Texas Instruments

SCANSTA112VSX/NOPB by Texas Instruments

SCANSTA112VSX/NOPB by Texas Instruments is a CMOS microprocessor circuit with 100 terminals in a square package. It operates b/w -40 to 85 °C, with a supply voltage of 3.3 V and terminal pitch of 0.5 mm. Ideal for industrial applications requiring precise temperature control and compact design.

Median Price

$11.162

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 63,285 parts In-Stock

1+ parts

$11.162

100+ parts

$9.750

1k+ parts

$6.724

10k+ parts

-

63,285

$11.162

$9.750

$6.724

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 35 parts In-Stock

1+ parts

$9.509

100+ parts

-

1k+ parts

-

10k+ parts

-

35

$9.509

-

-

-

Digiode

USA . 4,651 parts In-Stock

1+ parts

$10.604

100+ parts

-

1k+ parts

-

10k+ parts

-

4,651

$10.604

-

-

-

Vyrian

USA . 63,280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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63,280

-

-

-

-

Component Sense

UK . 9,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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9,800

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-

-

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Anansix

USA . 1,134 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,134

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-

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Sensible Micro Corp

USA . 399 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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399

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 63,224 parts In-Stock

1+ parts

$9.490

100+ parts

$9.253

1k+ parts

$9.205

10k+ parts

-

63,224

$9.490

$9.253

$9.205

-

Continental Prestige Electronics

USA . 3,199 parts In-Stock

1+ parts

$9.509

100+ parts

-

1k+ parts

-

10k+ parts

$9.318

3,199

$9.509

-

-

$9.318

Bastille Electronics

Australia . 20 parts In-Stock

1+ parts

$9.509

100+ parts

$9.034

1k+ parts

-

10k+ parts

$8.463

20

$9.509

$9.034

-

$8.463

Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$9.699

100+ parts

$9.699

1k+ parts

$9.699

10k+ parts

-

70

$9.699

$9.699

$9.699

-

Corohmni

South Africa . 131 parts In-Stock

1+ parts

$9.750

100+ parts

-

1k+ parts

-

10k+ parts

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131

$9.750

-

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Corphita

USA . 2,764 parts In-Stock

1+ parts

$10.046

100+ parts

-

1k+ parts

-

10k+ parts

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2,764

$10.046

-

-

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Parana Technologies

USA . 741 parts In-Stock

1+ parts

$70.092

100+ parts

-

1k+ parts

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10k+ parts

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741

$70.092

-

-

-

DigiPath Technology Company

USA . 72 parts In-Stock

1+ parts

$77.180

100+ parts

-

1k+ parts

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10k+ parts

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72

$77.180

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-

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IDEA Electronic Components Group

UK . 1,184 parts In-Stock

1+ parts

$78.755

100+ parts

$74.817

1k+ parts

$70.880

10k+ parts

-

1,184

$78.755

$74.817

$70.880

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ChromeModa Solutions

Germany . 1,078 parts In-Stock

1+ parts

$78.755

100+ parts

$64.579

1k+ parts

-

10k+ parts

-

1,078

$78.755

$64.579

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-

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,000

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Argo Parts USA

USA . 1,557 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,557

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Component Stockers USA

USA . 341 parts In-Stock

1+ parts

-

100+ parts

$20.790

1k+ parts

-

10k+ parts

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341

-

$20.790

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-

Overview

Elevate your technology game with the SCANSTA112VSX/NOPB by Texas Instruments, a cutting-edge peripheral IC that promises unmatched quality and performance. Designed with precision and innovation, this product boasts a range of applications in the realm of microprocessor circuits. From its sleek package body material to its state-of-the-art technology, this device offers unparalleled value and benefits to customers looking to enhance their projects. Trust in Texas Instruments to deliver excellence, choose the SCANSTA112VSX/NOPB for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, making it a good choice for portable devices.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly, making this product suitable for high-volume production.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, increasing its versatility.

Package Shape: SQUARE

The square package shape helps in optimizing PCB space utilization, making this product ideal for compact designs.

Power Supplies (V): 3.3

A stable power supply of 3.3V ensures reliable performance, making this product a dependable choice for various applications.

No. of Terminals: 100

The high number of terminals allows for extensive connectivity options, making this product suitable for complex circuit designs.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style offers space-saving benefits, making this product ideal for miniaturized electronics.

Minimum Supply Voltage: 3 V

With a low minimum supply voltage, this product can operate efficiently even in low-power scenarios, increasing its applicability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions, making this product versatile.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can function effectively even in extreme cold conditions, enhancing its resilience.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the product.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and placement on PCBs, making this product convenient for assembly processes.

Maximum Seated Height: 1.2 mm

The low maximum seated height helps in slimming down the overall profile of the product, making it suitable for sleek and compact designs.

Width: 14 mm

The width of 14mm strikes a balance between space-saving and compatibility, making this product versatile for different board layouts.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper solder reflow during assembly, ensuring strong and durable connections for the product.

Length: 14 mm

The length of 14mm complements the square package shape, optimizing space efficiency and layout flexibility for the product.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments, making this product suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

With a microprocessor circuit as the peripheral IC type, this product offers advanced processing capabilities, making it a high-performance option for complex tasks.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, making it an energy-efficient and reliable choice.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering, enhancing the durability and assembly efficiency of the product.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, this product aligns with standard power requirements, ensuring compatibility with common power sources.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density packaging, enabling more components to be integrated on a single board, enhancing the product's functionality.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during storage and assembly to maintain product integrity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SCANSTA112VSX/NOPB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SCANSTA112VSX/NOPB Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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