Loading...

SCANSTA112SM

Texas Instruments

SCANSTA112SM by Texas Instruments

SCANSTA112SM by Texas Instruments is a MICROPROCESSOR CIRCUIT with 100 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, with supply voltage of 3-3.6 V. Ideal for industrial applications requiring low profile and fine pitch components.

Median Price

$14.790

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,558 parts In-Stock

1+ parts

$15.729

100+ parts

$13.739

1k+ parts

$9.475

10k+ parts

-

12,558

$15.729

$13.739

$9.475

-

Rochester

USA . 11 parts In-Stock

1+ parts

-

100+ parts

$13.850

1k+ parts

$12.390

10k+ parts

$11.660

11

-

$13.850

$12.390

$11.660

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,123 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

-

10k+ parts

-

3,123

$3.500

-

-

-

Digiode

USA . 521 parts In-Stock

1+ parts

$12.502

100+ parts

-

1k+ parts

-

10k+ parts

-

521

$12.502

-

-

-

Chip Stock

USA . 4,580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,580

-

-

-

-

Anansix

USA . 1,142 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,142

-

-

-

-

LWI Electronics Inc

India . 75 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

75

-

-

-

-

Speed Components Ltd

Israel . 55 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

55

-

-

-

-

Semi Source

USA . 37 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

37

-

-

-

-

Bristol Electronics

USA . 33 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

33

-

-

-

-

PC Components Company LLC

USA . 28 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 280 parts In-Stock

1+ parts

$7.480

100+ parts

$7.450

1k+ parts

$7.450

10k+ parts

$7.430

280

$7.480

$7.450

$7.450

$7.430

Corphita

USA . 3,877 parts In-Stock

1+ parts

$11.844

100+ parts

-

1k+ parts

-

10k+ parts

-

3,877

$11.844

-

-

-

Corohmni

South Africa . 922 parts In-Stock

1+ parts

$13.740

100+ parts

-

1k+ parts

-

10k+ parts

-

922

$13.740

-

-

-

Parana Technologies

USA . 972 parts In-Stock

1+ parts

$71.400

100+ parts

-

1k+ parts

-

10k+ parts

-

972

$71.400

-

-

-

ChromeModa Solutions

Germany . 6,641 parts In-Stock

1+ parts

$80.225

100+ parts

$65.784

1k+ parts

-

10k+ parts

-

6,641

$80.225

$65.784

-

-

IDEA Electronic Components Group

UK . 1,815 parts In-Stock

1+ parts

$80.225

100+ parts

$76.214

1k+ parts

$72.202

10k+ parts

-

1,815

$80.225

$76.214

$72.202

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Perfect Parts

USA . 1,075 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,075

-

-

-

-

DigiPath Technology Company

USA . 591 parts In-Stock

1+ parts

-

100+ parts

$72.331

1k+ parts

-

10k+ parts

-

591

-

$72.331

-

-

ChipTracer

USA . 17 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17

-

-

-

-

iodParts Technologies Inc.

India . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3

-

-

-

-

Overview

Experience the cutting-edge performance of the SCANSTA112SM by Texas Instruments, a top-of-the-line microprocessor circuit that sets the standard for quality and reliability. Designed with precision and expertise, this innovative product offers unparalleled benefits in various applications. From industrial automation to consumer electronics, the SCANSTA112SM delivers exceptional value with its advanced technology and superior design. Trust Texas Instruments to provide you with the best solutions for your needs. Elevate your projects to new heights with the SCANSTA112SM today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and corrosion resistance, making the product suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly onto circuit boards, saving time and space.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, the product can handle a wide range of power input, increasing versatility.

Package Shape: SQUARE

Square package shape allows for compact placement on circuit boards, optimizing use of space.

Power Supplies (V): 3.3

Stable power supply of 3.3V ensures consistent performance of the product.

No. of Terminals: 100

Having 100 terminals allows for connecting to multiple components and peripherals, enhancing functionality.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures efficient power consumption and compatibility with a variety of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the product can function reliably even in warm environments or under heavy usage.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature means the product can operate in cold conditions without performance degradation.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and conductivity, ensuring stable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies the installation process and allows for easier access during assembly or maintenance.

Maximum Seated Height: 1.5 mm

Low maximum seated height helps in achieving a slim profile for the product, ideal for space-constrained applications.

Width: 10 mm

Narrow width of 10mm enables compact design and integration into tight spaces on circuit boards.

Peak Reflow Temperature °C: 235

High peak reflow temperature ensures stable solder connections during assembly and rework processes.

Length: 10 mm

Short length of 10mm contributes to the overall compactness of the product, suitable for small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of a microprocessor circuit expands the capabilities of the product, allowing for complex processing tasks and advanced features.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: BALL

Ball terminal form provides good electrical contact and heat dissipation properties, ensuring stable performance under demanding conditions.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable operation of the product.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm allows for high-density mounting, enabling more connections in a limited space.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates that the product has moderate sensitivity to moisture, suitable for standard handling and storage conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SCANSTA112SM attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e0

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

SCANSTA112SM Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20