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SCANSTA112VS

Texas Instruments

SCANSTA112VS by Texas Instruments

The Texas Instruments SCANSTA112VS is a 100-terminal microprocessor circuit IC with a supply voltage range of 3-3.6V, operating temperature from -40 to 85°C, and terminal pitch of 0.5mm. It is used in industrial applications requiring thin profile, fine pitch packages for surface mount assembly.

Median Price

$14.014

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 44 parts In-Stock

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$15.430

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Chip Stock

USA . 5,276 parts In-Stock

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Digiode

USA . 3,686 parts In-Stock

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Vyrian

USA . 3,368 parts In-Stock

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Anansix

USA . 1,635 parts In-Stock

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NexGen Digital

USA . 110 parts In-Stock

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R&J Components

USA . 10 parts In-Stock

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10

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LWI Electronics Inc

India . 5 parts In-Stock

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5

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Inventory MP

USA . 3 parts In-Stock

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Bristol Electronics

USA . 3 parts In-Stock

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EMSNET

USA . 2 parts In-Stock

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Sensible Micro Corp

USA . 1 parts In-Stock

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$12.597

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$11.628

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1

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Prism Electronics

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 662 parts In-Stock

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$15.084

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662

$15.084

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Aranea Global

USA . 2,000 parts In-Stock

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$15.121

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$14.517

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$15.121

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Corohmni

South Africa . 909 parts In-Stock

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$15.164

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$15.164

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Continental Prestige Electronics

USA . 955 parts In-Stock

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$15.430

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$15.121

955

$15.430

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$15.121

Ampacity Inc.

Singapore . 789 parts In-Stock

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$24.000

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One Stop Electronics

USA . 549 parts In-Stock

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$26.000

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$26.000

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Parana Technologies

USA . 2,233 parts In-Stock

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$32.103

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$97.947

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$32.103

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Semicontronic

India . 1,516 parts In-Stock

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$33.000

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$32.175

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$32.010

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DigiPath Technology Company

USA . 2,237 parts In-Stock

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$35.350

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ChromeModa Solutions

Germany . 1,344 parts In-Stock

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$36.071

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$29.578

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$36.071

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IDEA Electronic Components Group

UK . 1,085 parts In-Stock

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$36.071

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$34.267

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$32.464

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$36.071

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$32.464

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A-Z Elektronik GmbH

Germany . 6,222 parts In-Stock

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Argo Parts USA

USA . 4,912 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Corphita

USA . 3,904 parts In-Stock

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Perfect Parts

USA . 1,036 parts In-Stock

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Lixinc

USA . 997 parts In-Stock

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Kepictronics

USA . 281 parts In-Stock

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Overview

Experience unparalleled quality and innovation with the Texas Instruments SCANSTA112VS. As a leader in the industry, Texas Instruments has crafted this state-of-the-art product to provide unmatched performance and reliability. With a wide range of applications in Other Function uPs, uCs & Peripheral ICs, this product offers customers exceptional value and benefits. Elevate your projects with the superior technology and precision of the SCANSTA112VS, setting a new standard for excellence in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the product.

Surface Mount: YES

Surface mount technology allows for compact and efficient mounting of the IC, saving space on the circuit board.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

The square shape makes it easier to align and place the IC on the circuit board accurately.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SCANSTA112VS attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e0

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SCANSTA112VS Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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