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XCZU11EG-1FFVC1760E

Xilinx

XCZU11EG-1FFVC1760E by Xilinx

XCZU11EG-1FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1760 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Suitable for applications requiring Other Function uPs,uCs & Peripheral ICs with supply voltage range of 0.825-0.876 V.

Median Price

$5,428.085

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Mouser Electronics

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Nova Conductors

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AZTECH Wire

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Kenton Components

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Aztec Data Supply Inc.

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Continental Prestige Electronics

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Argo Parts USA

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Netroflash

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Singapore . 2 parts In-Stock

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Overview

Unleash the power of innovation with the XCZU11EG-1FFVC1760E by Xilinx! As a leader in the industry, Xilinx delivers top-quality products that push boundaries and drive progress. This versatile microprocessor circuit offers endless possibilities in various applications, providing customers with unmatched value and performance. From cutting-edge technology to reliable components, the XCZU11EG-1FFVC1760E is the ultimate solution for those seeking excellence in their projects. Experience the difference with Xilinx and take your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective, lightweight, and provides good protection for the internal components of the IC, making it a durable and reliable choice.

Surface Mount: YES

Surface mount technology allows for easier assembly and smaller overall size of the product, making it suitable for compact electronic devices.

Maximum Supply Voltage: 0.876 V

Having a high maximum supply voltage ensures compatibility with a wide range of power sources, making it versatile for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on a circuit board, enabling a more compact and organized layout.

No. of Terminals: 1760

With a large number of terminals, this IC can support complex functions and interfaces, making it suitable for advanced electronic systems.

Package Style (Meter): GRID ARRAY

The grid array package style provides good thermal performance and reliability, making it ideal for applications that require efficient heat dissipation.

Minimum Supply Voltage: 0.825 V

Having a low minimum supply voltage allows the product to operate efficiently even with limited power sources, making it energy-efficient.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and deliver consistent performance in various settings.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of multiple finishes enhances the durability and conductivity of the terminals, ensuring reliable connections and long-term functionality.

Terminal Position: BOTTOM

Bottom terminal position allows for easier integration into circuit boards, facilitating efficient assembly and maintenance.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required for peak reflow temperature reduces the risk of component damage during soldering, ensuring product integrity.

Peak Reflow Temperature °C: 245

The high peak reflow temperature enables secure soldering and ensures the IC can withstand elevated temperatures without performance degradation.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this IC can perform complex calculations and tasks efficiently, making it suitable for high-performance applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, providing efficient and reliable operation for extended periods.

Terminal Form: BALL

The ball terminal form allows for secure connections and robust electrical contact, enhancing the overall reliability of the product.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage provides a stable operating point for the IC, ensuring consistent performance under varying load conditions.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates that this IC has a moderate level of moisture sensitivity, making it suitable for standard handling and storage practices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU11EG-1FFVC1760E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU11EG-1FFVC1760E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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