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AM6232ASGGHAALW

Texas Instruments

AM6232ASGGHAALW by Texas Instruments

AM6232ASGGHAALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w -40°C to 105°C, with supply voltage ranging from 0.715V to 0.79V. This IC is ideal for applications requiring a very thin profile and fine pitch grid array package style.

Median Price

$19.450

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,476 parts In-Stock

1+ parts

$14.000

100+ parts

$12.229

1k+ parts

$8.434

10k+ parts

-

1,476

$14.000

$12.229

$8.434

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Mouser Electronics

USA . 51 parts In-Stock

1+ parts

$24.900

100+ parts

$18.610

1k+ parts

$15.690

10k+ parts

-

51

$24.900

$18.610

$15.690

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,046 parts In-Stock

1+ parts

$13.300

100+ parts

-

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-

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3,046

$13.300

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-

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Vyrian

USA . 6,809 parts In-Stock

1+ parts

-

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-

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6,809

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-

-

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VNN

France . 806 parts In-Stock

1+ parts

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806

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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100

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 514 parts In-Stock

1+ parts

$11.900

100+ parts

$11.602

1k+ parts

$11.543

10k+ parts

-

514

$11.900

$11.602

$11.543

-

Ampacity Inc.

Singapore . 357 parts In-Stock

1+ parts

$11.900

100+ parts

-

1k+ parts

-

10k+ parts

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357

$11.900

-

-

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Corphita

USA . 316 parts In-Stock

1+ parts

$12.600

100+ parts

-

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316

$12.600

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-

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Parana Technologies

USA . 2,306 parts In-Stock

1+ parts

$67.510

100+ parts

-

1k+ parts

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2,306

$67.510

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-

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DigiPath Technology Company

USA . 3 parts In-Stock

1+ parts

$74.337

100+ parts

$68.390

1k+ parts

-

10k+ parts

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3

$74.337

$68.390

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-

Corohmni

South Africa . 987 parts In-Stock

1+ parts

$75.354

100+ parts

-

1k+ parts

-

10k+ parts

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987

$75.354

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-

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ChromeModa Solutions

Germany . 5,370 parts In-Stock

1+ parts

$75.854

100+ parts

$62.200

1k+ parts

-

10k+ parts

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5,370

$75.854

$62.200

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IDEA Electronic Components Group

UK . 574 parts In-Stock

1+ parts

$75.854

100+ parts

$72.061

1k+ parts

$68.269

10k+ parts

-

574

$75.854

$72.061

$68.269

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Argo Parts USA

USA . 2,758 parts In-Stock

1+ parts

-

100+ parts

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2,758

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Continental Prestige Electronics

USA . 997 parts In-Stock

1+ parts

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997

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Unlock endless possibilities with the AM6232ASGGHAALW by Texas Instruments. Crafted with precision and expertise, this cutting-edge product belongs to the category of Other Function uPs,uCs & Peripheral ICs, offering unmatched quality and reliability. Designed for a wide range of applications, this versatile device provides exceptional value and benefits to customers. Experience seamless performance and innovative solutions with Texas Instruments' AM6232ASGGHAALW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and cost-effective, ideal for applications where weight and cost are important factors.

Surface Mount: YES

Surface mount technology allows for easy installation on PCBs, saving time and reducing assembly costs.

Maximum Supply Voltage: 0.79V

Efficient power consumption with a low maximum supply voltage, suitable for energy-sensitive applications.

Package Shape: SQUARE

Square package shape provides a compact footprint, maximizing space efficiency on the PCB.

No. of Terminals: 425

Higher number of terminals offer more connectivity options, making the product versatile for a wide range of applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch terminals allows for high-density mounting, enabling more functionality in a limited space.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the product to function in extreme environmental conditions, increasing its reliability and durability.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, optimizing signal integrity and reducing EMI interference.

Peripheral IC Type: SoC

System-on-Chip design integrates multiple functions into a single chip, reducing overall system complexity and cost while improving performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, making the product energy-efficient and versatile.

Nominal Supply Voltage: 0.75V

Stable nominal supply voltage ensures consistent performance and reliable operation of the product.

Terminal Pitch: 0.5mm

Fine terminal pitch allows for high-density mounting and more compact PCB designs, enabling smaller and lighter end products.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6232ASGGHAALW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.89 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

AM6232ASGGHAALW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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