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AM6231ATGGHAALW

Texas Instruments

AM6231ATGGHAALW by Texas Instruments

AM6231ATGGHAALW by Texas Instruments is a CMOS SoC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring high-density integration and low-profile design.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,285 parts In-Stock

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VNN

France . 2,492 parts In-Stock

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Digiode

USA . 2,384 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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One Stop Electronics

USA . 1,260 parts In-Stock

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$3.000

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$3.000

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Semicontronic

India . 1,399 parts In-Stock

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$10.000

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$9.750

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$9.700

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Ampacity Inc.

Singapore . 970 parts In-Stock

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$11.000

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$11.000

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AZTECH Wire

Italy . 627 parts In-Stock

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$18.799

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Parana Technologies

USA . 2,260 parts In-Stock

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$34.958

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DigiPath Technology Company

USA . 1,927 parts In-Stock

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$38.493

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ChromeModa Solutions

Germany . 1,494 parts In-Stock

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$39.279

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$32.209

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IDEA Electronic Components Group

UK . 1,471 parts In-Stock

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$37.315

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$35.351

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Corohmni

South Africa . 46 parts In-Stock

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Argo Parts USA

USA . 2,784 parts In-Stock

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Corphita

USA . 2,198 parts In-Stock

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Continental Prestige Electronics

USA . 1,226 parts In-Stock

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Bastille Electronics

Australia . 56 parts In-Stock

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Overview

Discover the innovative AM6231ATGGHAALW by Texas Instruments, a cutting-edge product in the category of Other Function uPs, uCs & Peripheral ICs. With a focus on quality and reliability, Texas Instruments is a trusted manufacturer known for delivering top-notch products. This versatile IC offers a wide range of applications, providing customers with exceptional value and performance. Step into the future of technology with the AM6231ATGGHAALW and experience the benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are commonly used in electronic components due to their durability and heat resistance, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic circuit boards, reducing production costs and potentially improving reliability.

Maximum Supply Voltage: 0.79 V

The low maximum supply voltage of 0.79 V makes this product suitable for low-power applications, helping to conserve energy and extend battery life.

Package Shape: SQUARE

Square packaging can help optimize the use of space on a circuit board, allowing for a more compact and efficient design.

No. of Terminals: 425

Having a high number of terminals provides ample connectivity options, allowing for versatile integration into a wide range of electronic systems.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a thin profile and fine pitch allows for high-density mounting, enabling the product to pack a lot of functionality into a small footprint.

Minimum Supply Voltage: 0.715 V

The low minimum supply voltage of 0.715 V indicates that this product is capable of operating efficiently even with low power input, making it suitable for battery-powered devices.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, this product can withstand high temperatures without sacrificing performance, ensuring reliability in challenging environments.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures from -40 to 105°C indicates the product's versatility and resilience in varying environmental conditions.

Terminal Position: BOTTOM

Bottom terminal positioning can facilitate easier inspection, maintenance, and replacement of the component, enhancing overall serviceability.

Maximum Seated Height: 0.89 mm

With a maximum seated height of 0.89 mm, this product is compact and low-profile, contributing to space-saving design considerations in electronic applications.

Width: 13 mm

The moderate width of 13 mm strikes a balance between size and functionality, offering sufficient space for terminal connections while still being relatively compact.

Length: 13 mm

The square shape and equal length of 13 mm further contribute to the product's space-efficient design, allowing for easy integration into various electronic systems.

Peripheral IC Type: SoC

An SoC (System on Chip) design integrates multiple functions into a single chip, reducing complexity, saving space, and potentially improving performance and power efficiency.

Technology: CMOS

CMOS technology is known for its low power consumption, high noise tolerance, and compatibility with a wide range of applications, making this product energy-efficient and versatile.

Terminal Form: BALL

Ball terminals provide reliable electrical connections with improved thermal performance, making this product suitable for demanding applications where heat dissipation is important.

Nominal Supply Voltage: 0.75 V

The nominal supply voltage of 0.75 V indicates the typical operating voltage of the product, offering a balance of performance and power efficiency for various applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting and precise connections, enabling the product to accommodate complex circuit designs in a small form factor.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6231ATGGHAALW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.89 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

AM6231ATGGHAALW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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