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AM6234ASGGHAALW

Texas Instruments

AM6234ASGGHAALW by Texas Instruments

AM6234ASGGHAALW by Texas Instruments is a CMOS SoC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring very thin profile and fine pitch, such as advanced electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,603 parts In-Stock

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VNN

France . 4,677 parts In-Stock

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Digiode

USA . 2,525 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Ampacity Inc.

Singapore . 213 parts In-Stock

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$10.000

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213

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AZTECH Wire

Italy . 669 parts In-Stock

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One Stop Electronics

USA . 324 parts In-Stock

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$18.000

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Corohmni

South Africa . 737 parts In-Stock

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Parana Technologies

USA . 2,322 parts In-Stock

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$76.774

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ChromeModa Solutions

Germany . 6,204 parts In-Stock

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$86.263

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$70.736

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IDEA Electronic Components Group

UK . 1,810 parts In-Stock

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$86.263

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$81.950

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$77.637

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Continental Prestige Electronics

USA . 5,179 parts In-Stock

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Argo Parts USA

USA . 2,939 parts In-Stock

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DigiPath Technology Company

USA . 1,330 parts In-Stock

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Corphita

USA . 666 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Elevate your electronic projects with the AM6234ASGGHAALW by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments guarantees top-notch quality and reliability in every product they create. This versatile IC falls under the category of Other Function uPs,uCs & Peripheral ICs, making it suitable for a wide range of applications. With a compact package style and advanced CMOS technology, this IC offers unparalleled performance and efficiency. Trust in Texas Instruments to deliver cutting-edge solutions for your innovative designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, ensuring the product can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing production time and cost.

Maximum Supply Voltage: 0.79 V

Having a high maximum supply voltage rating ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

Square package shape helps in optimizing PCB layout and space utilization, making it ideal for compact designs.

No. of Terminals: 425

A high number of terminals provide flexibility in connecting various components and peripherals, enhancing functionality.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a thin profile and fine pitch enables high density mounting of components, increasing overall performance.

Minimum Supply Voltage: 0.715 V

Low minimum supply voltage requirement allows for energy-efficient operation, contributing to extended battery life in portable devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature range ensures reliable performance in demanding industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range enables the product to function in extreme cold conditions without any compromise in performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and assembly, simplifying the manufacturing process.

Maximum Seated Height: 0.89 mm

Low maximum seated height allows for a more compact and space-saving design, ideal for applications with size constraints.

Width: 13 mm

Narrow width dimensions enable integration into smaller form factor devices, enhancing the product's versatility.

Length: 13 mm

Compact length dimensions contribute to a space-efficient design, suitable for applications where size is a critical factor.

Peripheral IC Type: SoC

System-on-Chip (SoC) integration simplifies the design and reduces the overall component count, leading to cost and power efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable operation in various applications.

Terminal Form: BALL

Ball terminal form provides secure and reliable electrical connections, minimizing the risk of signal loss or interference.

Nominal Supply Voltage: 0.75 V

Stable nominal supply voltage ensures consistent performance, making the product suitable for a wide range of applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, enabling more functionality in a compact form factor.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6234ASGGHAALW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.89 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

AM6234ASGGHAALW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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