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AM6232ATCGGAALW

Texas Instruments

AM6232ATCGGAALW by Texas Instruments

AM6232ATCGGAALW by Texas Instruments is a SoC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring high-speed processing and low power consumption.

Median Price

$23.600

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,568 parts In-Stock

1+ parts

$15.641

100+ parts

$13.662

1k+ parts

$9.422

10k+ parts

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14,568

$15.641

$13.662

$9.422

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Mouser Electronics

USA . 833 parts In-Stock

1+ parts

$23.600

100+ parts

$17.740

1k+ parts

$15.630

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-

833

$23.600

$17.740

$15.630

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DigiKey

USA . 1,714 parts In-Stock

1+ parts

$25.750

100+ parts

$19.427

1k+ parts

$17.161

10k+ parts

-

1,714

$25.750

$19.427

$17.161

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,305 parts In-Stock

1+ parts

$14.859

100+ parts

-

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4,305

$14.859

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Nova Conductors

Japan . 10 parts In-Stock

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$16.394

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10

$16.394

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Vyrian

USA . 5,146 parts In-Stock

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5,146

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VNN

France . 3,621 parts In-Stock

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3,621

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,507 parts In-Stock

1+ parts

$13.290

100+ parts

-

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5,507

$13.290

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Semicontronic

India . 5,155 parts In-Stock

1+ parts

$13.290

100+ parts

$12.958

1k+ parts

$12.891

10k+ parts

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5,155

$13.290

$12.958

$12.891

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Corphita

USA . 4,830 parts In-Stock

1+ parts

$14.077

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4,830

$14.077

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Continental Prestige Electronics

USA . 3,058 parts In-Stock

1+ parts

$15.028

100+ parts

-

1k+ parts

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$14.728

3,058

$15.028

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$14.728

Corohmni

South Africa . 351 parts In-Stock

1+ parts

$73.336

100+ parts

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351

$73.336

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Argo Parts USA

USA . 3,436 parts In-Stock

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3,436

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Overview

Experience the cutting-edge technology of the AM6232ATCGGAALW by Texas Instruments, a versatile peripheral IC that promises top-notch quality and reliability. With a wide range of applications in various industries, this product showcases the superior craftsmanship of its manufacturer. Offering exceptional value and benefits to customers, this IC delivers unparalleled performance and efficiency. Trust Texas Instruments to provide you with the best solutions for your technological needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making it a cost-effective choice for electronic components.

Surface Mount: YES

Surface mounting allows for easy installation and is ideal for compact designs.

Maximum Supply Voltage: 0.79 V

This high maximum supply voltage ensures stable performance even under high loads.

Package Shape: SQUARE

The square shape allows for efficient use of space on a circuit board.

No. of Terminals: 425

With a high number of terminals, this product can accommodate a wide range of connections.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers high density and excellent electrical performance.

Minimum Supply Voltage: 0.715 V

The low minimum supply voltage helps to conserve power and reduce energy costs.

Maximum Operating Temperature: 105 °C

This high operating temperature range ensures reliability in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in extreme cold conditions.

Terminal Position: BOTTOM

Bottom terminal placement can simplify the design and routing of the circuit board.

Maximum Seated Height: 0.89 mm

The low seated height makes this product suitable for slim and compact devices.

Width: 13 mm

The compact width allows for easy integration into tight spaces.

Peak Reflow Temperature: 250 C

This high peak reflow temperature ensures a strong and secure solder connection.

Length: 13 mm

The small length makes this product ideal for applications with limited space.

Peripheral IC Type: SoC

The integration of multiple functions into a single chip offers efficiency and cost savings.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminals offer reliable connections and are suitable for high-speed data transmission.

Nominal Supply Voltage: 0.75 V

The stable nominal supply voltage ensures consistent performance over the product's lifespan.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for high-density connections and a compact design.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this product can withstand limited exposure to moisture during handling and storage.

Speed: 1400 rpm

The high speed rating makes this product suitable for applications requiring quick data processing.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6232ATCGGAALW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

.89 mm

Speed:

1400 rpm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

AM6232ATCGGAALW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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