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AM6234ATGGHAALW

Texas Instruments

AM6234ATGGHAALW by Texas Instruments

AM6234ATGGHAALW by Texas Instruments is a 425-terminal SoC IC with CMOS technology. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715V to 0.79V. This very thin profile, fine pitch grid array package is ideal for applications requiring high performance in compact spaces.

Median Price

$24.554

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,591 parts In-Stock

1+ parts

$17.938

100+ parts

$15.669

1k+ parts

$10.806

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-

1,591

$17.938

$15.669

$10.806

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Mouser Electronics

USA . 109 parts In-Stock

1+ parts

$31.170

100+ parts

$23.290

1k+ parts

$19.500

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109

$31.170

$23.290

$19.500

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Distributors (In-Stock)

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Digiode

USA . 467 parts In-Stock

1+ parts

$17.041

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467

$17.041

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VNN

France . 4,447 parts In-Stock

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4,447

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Vyrian

USA . 2,493 parts In-Stock

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2,493

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Parana Technologies

USA . 1,644 parts In-Stock

1+ parts

$14.899

100+ parts

-

1k+ parts

$15.324

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1,644

$14.899

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$15.324

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Ampacity Inc.

Singapore . 575 parts In-Stock

1+ parts

$15.250

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575

$15.250

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Corphita

USA . 907 parts In-Stock

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$16.144

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907

$16.144

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IDEA Electronic Components Group

UK . 1,924 parts In-Stock

1+ parts

$16.740

100+ parts

$15.903

1k+ parts

$15.066

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1,924

$16.740

$15.903

$15.066

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ChromeModa Solutions

Germany . 236 parts In-Stock

1+ parts

$16.740

100+ parts

$13.727

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236

$16.740

$13.727

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Corohmni

South Africa . 51 parts In-Stock

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$40.339

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51

$40.339

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Continental Prestige Electronics

USA . 6,534 parts In-Stock

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Argo Parts USA

USA . 2,597 parts In-Stock

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2,597

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DigiPath Technology Company

USA . 651 parts In-Stock

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$15.093

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$15.093

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Aranea Global

USA . 500 parts In-Stock

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Overview

Discover the cutting-edge AM6234ATGGHAALW by Texas Instruments, a top-of-the-line peripheral IC that boasts exceptional quality and reliability. Manufactured by the renowned Texas Instruments, this product is designed for various applications in Other Function uPs,uCs & Peripheral ICs category. With a sleek square package body made of durable plastic/epoxy material, this IC offers customers unmatched value and benefits. Experience superior performance with a maximum supply voltage of 0.79 V and a wide temperature range from -40 to 105°C. Upgrade your electronics with the AM6234ATGGHAALW and unlock endless possibilities in technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good thermal stability and protection for the internal components of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 0.79 V

With a maximum supply voltage of 0.79V, this product is suitable for low power applications.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy mounting.

No. of Terminals: 425

With a large number of terminals, this product can support a wide range of connections and functionalities.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with a thin profile and fine pitch allows for high density mounting and efficient signal routing.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product is suitable for use in harsh environmental conditions.

Maximum Seated Height: 0.89 mm

Low seated height allows for compact and slim designs.

Peripheral IC Type: SoC

System on Chip (SoC) integration reduces component count and simplifies system design.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Nominal Supply Voltage: 0.75 V

Nominal supply voltage of 0.75V ensures compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for high density mounting and efficient use of board space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6234ATGGHAALW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.89 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

AM6234ATGGHAALW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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