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AM6251ATGGHAALW

Texas Instruments

AM6251ATGGHAALW by Texas Instruments

AM6251ATGGHAALW by Texas Instruments is a SoC with 425 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715V to 0.79V. Ideal for applications requiring very thin profile and fine pitch components.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,736 parts In-Stock

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VNN

France . 1,802 parts In-Stock

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Digiode

USA . 318 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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AZTECH Wire

Italy . 429 parts In-Stock

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$6.791

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429

$6.791

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Ampacity Inc.

Singapore . 902 parts In-Stock

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$10.000

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One Stop Electronics

USA . 1,183 parts In-Stock

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$13.000

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Corohmni

South Africa . 105 parts In-Stock

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$22.289

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$22.289

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Semicontronic

India . 610 parts In-Stock

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$29.000

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$28.275

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$28.130

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Parana Technologies

USA . 1,343 parts In-Stock

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$48.874

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$4,538.725

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$43.987

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DigiPath Technology Company

USA . 322 parts In-Stock

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$53.817

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IDEA Electronic Components Group

UK . 560 parts In-Stock

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$54.915

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$52.169

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$49.424

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ChromeModa Solutions

Germany . 193 parts In-Stock

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$54.915

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$45.030

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Continental Prestige Electronics

USA . 3,600 parts In-Stock

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Corphita

USA . 2,131 parts In-Stock

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Argo Parts USA

USA . 2,022 parts In-Stock

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Bastille Electronics

Australia . 30 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the AM6251ATGGHAALW by Texas Instruments. Designed with precision and expertise, this innovative product falls under the category of Other Function uPs, uCs & Peripheral ICs. With a package body material made of high-quality plastic/epoxy and a surface mount feature, this device offers unparalleled reliability and performance. Its applications range from consumer electronics to industrial automation, providing endless possibilities for customization and integration. Experience unmatched value and efficiency with Texas Instruments' AM6251ATGGHAALW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easy to handle and budget-friendly.

Surface Mount: YES

Surface mount technology allows for the efficient and compact assembly of electronic components, saving space and reducing production costs.

Maximum Supply Voltage: 0.79 V

The maximum supply voltage of 0.79 V indicates that the product is designed to operate efficiently with low power consumption, making it ideal for battery-powered devices.

Package Shape: SQUARE

The square package shape allows for easy and precise placement on a circuit board, simplifying the manufacturing process.

No. of Terminals: 425

With a high number of terminals, this product offers extensive connectivity options, enhancing its versatility in various applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style provides a compact and efficient layout, enabling a high density of components on the circuit board for enhanced performance.

Minimum Supply Voltage: 0.715 V

The low minimum supply voltage of 0.715 V ensures reliable operation even with lower power sources, increasing the product's flexibility.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, the product can withstand high-temperature environments, ensuring durability and reliability.

Minimum Operating Temperature: -40 °C

The product's ability to operate at temperatures as low as -40°C makes it suitable for use in diverse environmental conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure soldering during assembly, ensuring a reliable connection between the product and the circuit board.

Maximum Seated Height: 0.89 mm

The low maximum seated height allows for a slim and compact design, ideal for space-constrained applications.

Width: 13 mm

The product's width of 13 mm offers a balance between compact size and ease of handling, making it suitable for various installation requirements.

Length: 13 mm

With a length of 13 mm, the product's dimensions are optimized for space efficiency without compromising on performance.

Peripheral IC Type: SoC

The integration of peripheral functions into a System-on-Chip (SoC) architecture enhances the product's functionality, reducing the need for additional external components.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology enables low power consumption and high noise immunity, contributing to the product's efficiency and reliability.

Terminal Form: BALL

Ball terminal form ensures reliable electrical connections and facilitates high-density mounting, enhancing the product's performance in compact electronic designs.

Nominal Supply Voltage: 0.75 V

The nominal supply voltage of 0.75 V indicates the typical operating voltage of the product, optimizing performance and efficiency under standard conditions.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for densely packed terminals on the package, enabling high connectivity and integration in electronic systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6251ATGGHAALW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.89 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

AM6251ATGGHAALW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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