Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Microchip Technology's MPFS250TFCVG484I is a 484-terminal SoC with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.97V to 1.03V. The grid array package is square-shaped, measuring 19mm x 19mm, suitable for various uPs and uCs applications.
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Plastic/Epoxy body material provides a good balance of durability and cost-effectiveness.
Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly.
High maximum supply voltage allows for flexibility in power supply options.
Square shape helps in optimizing space on the PCB and ensuring efficient component placement.
Large number of terminals allows for versatile connectivity and functionality.
Grid array with fine pitch layout enables high-density mounting and reliable connections.
Low minimum supply voltage helps in reducing power consumption and optimizing energy efficiency.
High maximum operating temperature ensures reliable performance in varying environmental conditions.
Low minimum operating temperature allows for operation in extreme cold environments.
Bottom terminal position facilitates easy soldering and efficient connection to the PCB.
Low maximum seated height helps in achieving a compact and slim profile for the product.
Standard width allows for easy integration into standard PCB layouts.
Standard length ensures compatibility with common PCB dimensions.
System-on-Chip (SoC) design integrates multiple functions onto a single chip, reducing component count and increasing efficiency.
CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.
Ball terminal form provides reliable connections and ease of soldering.
Stable nominal supply voltage ensures consistent and reliable operation of the product.
Small terminal pitch allows for high-density mounting and compact PCB design.
Other Function uPs,uCs & Peripheral ICs MPFS250TFCVG484I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology
Additional Features:
JESD-30 Code:
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MPFS250TFCVG484I Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - Mult Dev 31/Jan/2023
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
BSS138
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: TIN LEAD; Package Body Material: PLASTIC/EPOXY;
1N4148WT
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Invensys Sensor Systems
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Repetitive Peak Reverse Voltage: 100 V;
LL4148
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358N
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
CRCW080510R0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510R0FKEA is a fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V. Operating temperature range from -55 to 155 °C ensures reliability in various environments.
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V; Terminal Finish: Tin/Lead (Sn/Pb);
2N2222A
Fairchild Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
LM317TG
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Minimum Input-Output Voltage Differential: 3 V; Qualification Status: Not Qualified; No. of Functions: 1;
BAV99
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Plessey Semiconductors Discrete Components Div
Other Transistors;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
Silicon Group
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SMBJ18CA
KYOCERA AVX
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRGCQ0805F10K
TE Connectivity
TE Connectivity's CRGCQ0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance.
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
XC7Z100-1FFG1156I
Xilinx
The Xilinx XC7Z100-1FFG1156I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With a grid array package style and 1156 terminals, it's ideal for applications requiring high-performance computing in compact spaces.
BGM13P32F512GA-V2
Silicon Labs
SoC;
FT245BL-REEL
FTDI
FT245BL-REEL by FTDI is a 32-terminal peripheral IC with a supply voltage range of 4.35V to 5.25V, operating temperature of 0-70°C, and peak reflow temp of 260°C. Ideal for microprocessor circuits, it features CMOS technology and Gull Wing terminal form in a low-profile flatpack package style.
C8051F064-GQ
Silicon Labs' C8051F064-GQ is an SoC with 3V power supply, matte tin finish, and industrial temperature grade. Ideal for applications requiring high reliability in harsh environments.
AM6442BSEFHAALV
Texas Instruments
AM6442BSEFHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.715V to 0.79V. With 441 terminals in a GRID ARRAY package, it's ideal for high-speed applications requiring fine pitch components.
AM6234ATCGGAALW
AM6234ATCGGAALW by Texas Instruments is a SoC peripheral IC with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.715V to 0.79V. With 425 terminals in a grid array package, it's ideal for applications requiring high-speed processing in compact spaces.
SLB9670XQ20FW763XUMA2
SLB9670XQ20FW763XUMA2 by Infineon: 32-terminal chip carrier IC with cryptographic authenticator technology. Operates b/w -40 to 85 °C, with supply voltage range of 1.65V to 1.95V. Ideal for secure authentication applications due to its compact square package and surface-mount capability.
XC7Z020-1CLG400C
The Xilinx XC7Z020-1CLG400C is a System on Chip with 400 terminals in a low profile, fine pitch grid array package. Operating b/w 0°C to 85°C, it has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high-performance processing in compact spaces.
MCIMX6X4CVM08AB
NXP Semiconductors
MCIMX6X4CVM08AB by NXP Semiconductors is a 529-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V. Ideal for industrial applications, it features a low-profile grid array package with fine pitch terminals for surface mounting.
LS1021AXN7KQB
Freescale Semiconductor
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
KSZ8463MLI
Micrel
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;
CY8C4146LQI-S432T
PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Finish: PURE TIN; Moisture Sensitivity Level (MSL): 3;
MFRC52201HN1,115
The NXP Semiconductors MFRC52201HN1,115 is a microprocessor circuit with 32 terminals in a square chip carrier package. It operates at temperatures ranging from -25 to 85°C and requires a power supply of 3/3.3V. This IC is commonly used in applications requiring contactless communication and RFID technology.
MCP25020-I/P
MCP25020-I/P by Microchip: 8-bit peripheral IC, operates at -40 to 85 °C, with supply voltage of 2.7-5.5 V. Ideal for industrial applications requiring microprocessor circuits in a rectangular package style with dual terminals.
MCIMX6QP7CVT8AB
MCIMX6QP7CVT8AB by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.275V to 1.5V. Ideal for applications requiring high performance in compact form factors.
XC7Z012S-1CLG485C
The Xilinx XC7Z012S-1CLG485C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring 485 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.
MPFS250T-FCG1152E
MPFS250T-FCG1152E by Microchip: Programmable SoC with 1152 terminals, CMOS tech, 1V nominal supply. Square GRID ARRAY package for surface mount applications. Operates b/w 0-100°C, ideal for various uP & uC functions.
EFR32MG12P432F1024GM48-C
SYSTEM ON CHIP;
NRF52805-CAAA-R
Nordic Semiconductor Asa
NRF52805-CAAA-R by Nordic Semiconductor Asa is a 28-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.7V to 3.6V. Ideal for applications requiring a compact GRID ARRAY package with very thin profile and fine pitch terminals.
XC7Z030-2FBG484I
The Xilinx XC7Z030-2FBG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, suitable for various applications requiring high-performance processing capabilities.
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MPFS250T-FCSG536I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.03 V;
MPFS250T-1FCVG484E
SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.03 V;
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
MPFS250T-FCG1152I
MPFS250T-FCG1152I by Microchip Tech is a 1152-terminal programmable SoC with CMOS tech. Operates b/w -40 to 100 °C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring high-density integration in compact spaces.
MPFS250TS-1FCVG484I
SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Minimum Supply Voltage: .97 V;
MPFS250T-1FCSG536E
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE; Width: 16 mm;
MPFS250T-1FCG1152E
Microchip Technology's MPFS250T-1FCG1152E is a programmable SoC with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.97-1.03V. This square GRID ARRAY package has 1152 terminals and is suitable for various Other Function uPs,uCs applications.
MPFS250T-1FCG1152I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA1152,34X34,40;
MPFS250TS-FCG1152I
MPFS250TS-FCG1152I by Microchip Technology is a programmable SoC with a package style of grid array and 1152 terminals. It operates at a voltage range of 0.97V to 1.03V and has a max seated height of 2.99mm. This IC is commonly used in applications requiring other function uPs, uCs, and peripheral devices.
MPFS250T-1FCSG536I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE; Terminal Pitch: .5 mm;
MPFS250T-1FCVG784I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;
MPFS250TFCVG484E
MPFS250TFCVG484E by Microchip Tech features 484 terminals, operates b/w 0-100°C, and has a supply voltage range of 0.97-1.03V. This SoC peripheral IC in a grid array package is ideal for applications requiring fine pitch technology and CMOS design.
MPFS095TLS-FCSG325I
MPFS095TLS-FCSG325I by Microchip Tech is a 325-terminal IC with CMOS tech. Operates b/w -40 to 100°C, voltage range of 0.97-1.03V. Ideal for SoC programming applications due to its rectangular shape and bottom terminal position.
MPFS095TLS-FCVG484I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA484,22X22,32;
MPFS095T-1FCVG784I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
MPFS025T-1FCSG325E
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 325; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Position: BOTTOM;
MPFS025T-1FCVG484E
MPFS025T-1FCVG484E by Microchip Tech is a 484-terminal IC with CMOS tech. Operates b/w 0-100°C, voltage range of 0.97-1.03V. Ideal for applications requiring a programmable SoC in a compact 19x19mm grid array package.
MPFS025T-1FCVG484I
Microchip Technology's MPFS025T-1FCVG484I is a 484-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.97V to 1.03V. This square-shaped IC in grid array package is ideal for various applications requiring fine pitch surface mount technology.
MPFS025T-FCSG325E
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 325; Package Shape: RECTANGULAR; Surface Mount: YES; JESD-30 Code: R-PBGA-B325;
MPFS250T-FCVG784E
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE; Surface Mount: YES;
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