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FXLC95000CLR1

NXP Semiconductors

FXLC95000CLR1 by NXP Semiconductors

FXLC95000CLR1 by NXP Semiconductors is a CMOS microprocessor circuit with 24 terminals and a rectangular package shape. It operates at a min supply voltage of 1.71V and has an industrial temperature grade of -40 to 85°C. This peripheral IC is suitable for various applications requiring low voltage and compact size.

Median Price

$3.915

Lifecycle Status

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8

In-Stock Inventory

1k+

FXLC95000CLR1 by NXP Semiconductors
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Rochester

USA . 1,806 parts In-Stock

1+ parts

-

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$3.480

1k+ parts

$3.110

10k+ parts

$2.930

1,806

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$3.480

$3.110

$2.930

Verical

USA . 950 parts In-Stock

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$4.350

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$3.888

10k+ parts

$3.663

950

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$4.350

$3.888

$3.663

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Digiode

USA . 3,424 parts In-Stock

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$3.202

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Nova Conductors

Japan . 47 parts In-Stock

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$4.729

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Flip Electronics

USA . 1,792 parts In-Stock

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Anansix

USA . 1,781 parts In-Stock

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Cyclops Electronics Ltd

UK . 512 parts In-Stock

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Vyrian

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One Stop Electronics

USA . 14 parts In-Stock

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$2.860

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14

$2.860

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Ampacity Inc.

Singapore . 14 parts In-Stock

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$2.860

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14

$2.860

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Semicontronic

India . 14 parts In-Stock

1+ parts

$2.860

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$2.788

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$2.774

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14

$2.860

$2.788

$2.774

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Corphita

USA . 2,283 parts In-Stock

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$3.033

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$3.033

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Continental Prestige Electronics

USA . 1,089 parts In-Stock

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$4.729

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$4.635

1,089

$4.729

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$4.635

Netroflash

USA . 1,000 parts In-Stock

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$4.729

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$4.635

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$4.729

$4.635

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AZTECH Wire

Italy . 296 parts In-Stock

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$15.058

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Aztec Data Supply Inc.

USA . 134 parts In-Stock

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$17.019

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$17.019

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Corohmni

South Africa . 2,962 parts In-Stock

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$18.923

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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UNI Independent Distributors

Spain . 8,320 parts In-Stock

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Argo Parts USA

USA . 3,404 parts In-Stock

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Perfect Parts

USA . 3,212 parts In-Stock

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Metaverse IC Inc.

Canada . 567 parts In-Stock

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Kepictronics

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Overview

Discover the exceptional FXLC95000CLR1 by NXP Semiconductors, a high-quality microprocessor circuit that is revolutionizing the world of Other Function uPs,uCs & Peripheral ICs. With its advanced technology and industrial-grade performance, this product offers unparalleled value to customers. Whether you're looking to enhance your electronic devices or optimize your system's functionalities, the FXLC95000CLR1 delivers unmatched benefits and advantages. Its compact package design, wide operating temperature range, and reliable surface mount feature ensure seamless integration and durability. Trust NXP Semiconductors for cutting-edge solutions that push boundaries in the industry. Elevate your projects with the FXLC95000CLR1 and experience excellence like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the internal components, making this product a reliable choice.

Surface Mount: YES

With the surface mount feature, this product can be easily mounted onto circuit boards, saving space and facilitating efficient assembly.

Maximum Supply Voltage: 1.89 V

The high maximum supply voltage allows for compatibility with a wide range of power sources, providing flexibility in various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space and easy integration into electronic systems, making this product suitable for compact designs.

No. of Terminals: 24

The ample number of terminals expands the connectivity options for the product, enhancing its versatility and enabling complex functionality.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style ensures high density packaging, enabling multiple components to be placed in a confined space, which is advantageous for compact designs.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage requirement allows for compatibility with low-power sources, making this product energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliable performance even in demanding environmental conditions, enhancing the product's durability and usability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance enables usage in extreme cold environments, making this product suitable for a wide range of applications.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and allows for straightforward connection to other components, streamlining the manufacturing process and reducing assembly time.

Maximum Seated Height: 1.1 mm

The low maximum seated height contributes to the product's compactness, enabling it to be integrated into tight spaces, which is advantageous for miniaturized designs.

Width: 3 mm

The narrow width dimension allows for compact placement on PCBs, optimizing space utilization and facilitating efficient circuit board design.

Maximum Time At Peak Reflow Temperature (s): 40

The relatively short time at peak reflow temperature optimizes the soldering process, minimizing the risk of thermal damage to the product during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures stable solder joints and reliable connections during the assembly process, contributing to the product's overall robustness.

Length: 5 mm

The short length dimension provides flexibility in designing compact electronic systems, allowing for efficient space utilization and versatility.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating indicates the product's reliability and suitability for operation in harsh operating conditions, making it an ideal choice for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit within this product expands its capabilities and functionality, enabling it to perform complex tasks, making it a versatile and high-performing choice.

Technology: CMOS

The CMOS technology employed in this product ensures low power consumption, high noise immunity, and compatibility with various voltage levels, making it an energy-efficient and versatile solution.

Terminal Form: BUTT

The butt terminal form simplifies the connection and integration of the product with other components, facilitating easy assembly and reducing the risk of connection errors.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage provides a suitable operating range for the product, ensuring consistent performance and compatibility with common power sources.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density integration, enabling more connections and components within a limited space, enhancing the product's versatility and capabilities.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level rating ensures that the product can withstand exposure to typical levels of moisture during storage and handling, maintaining its performance and reliability over time.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs FXLC95000CLR1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PBGA-B24

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Peripheral IC Type:

Trade Compliance

FXLC95000CLR1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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