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MPFS250T-1FCSG536E

Microchip Technology

MPFS250T-1FCSG536E by Microchip Technology

MPFS250T-1FCSG536E by Microchip: Programmable SoC with CMOS tech, 536 terminals in grid array package. Operates b/w 0-100°C, voltage range of 0.97-1.03V. Ideal for applications requiring low profile and fine pitch components.

Median Price

$339.485

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 35 parts In-Stock

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$325.270

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DigiKey

USA . 35 parts In-Stock

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$353.700

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$353.700

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Nova Conductors

Japan . 200 parts In-Stock

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$458.899

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200

$458.899

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Vyrian

USA . 2,564 parts In-Stock

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AZTECH Wire

Italy . 794 parts In-Stock

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$11.192

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Ampacity Inc.

Singapore . 8 parts In-Stock

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$389.360

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Argo Parts USA

USA . 3,514 parts In-Stock

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$458.899

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$454.310

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$449.721

10k+ parts

$445.132

3,514

$458.899

$454.310

$449.721

$445.132

Continental Prestige Electronics

USA . 2,050 parts In-Stock

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$458.899

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$449.721

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$458.899

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Microchip USA

USA . 1,831 parts In-Stock

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$745.995

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$745.995

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LOOK Integrated Logistics

Peru . 7,159 parts In-Stock

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LMD Electronica

Estonia . 4,124 parts In-Stock

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NIA Electronics

USA . 2,510 parts In-Stock

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Ledger Components

France . 2,510 parts In-Stock

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Montano Global Distributors

Canada . 2,123 parts In-Stock

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Overview

Discover the cutting-edge MPFS250T-1FCSG536E by Microchip Technology, setting new standards in quality and performance. Designed for a wide range of applications in Other Function uPs,uCs & Peripheral ICs, this innovative product boasts a package body material of PLASTIC/EPOXY and a terminal pitch of 0.5 mm. With a maximum supply voltage of 1.03 V and a minimum operating temperature of 0 °C, this Programmable SoC offers unrivaled value and benefits to customers seeking top-tier technology solutions. Experience the advantages of Microchip Technology's expertise in every aspect of this state-of-the-art device.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 1.03 V

Allows for operation at higher supply voltages, providing flexibility in power requirements.

Package Shape: SQUARE

The square shape of the package provides uniformity in design and layout.

No. of Terminals: 536

Having a high number of terminals allows for more connectivity options and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enables efficient signal transmission and thermal management.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage allows for operation in low power scenarios.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature indicates the ability to function in cold environments.

Terminal Position: BOTTOM

The terminal position at the bottom facilitates easy connections and soldering on the PCB.

Maximum Seated Height: 1.4 mm

The low seated height allows for a compact overall design in electronic devices.

Width: 16 mm

The 16mm width provides a standard form factor that can fit well in various applications.

Length: 16 mm

The 16mm length contributes to a square shape, aiding in layout optimization on the PCB.

Peripheral IC Type: PROGRAMMABLE SoC

A programmable System on Chip allows for customization and versatility in functionality.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology ensures low power consumption and high noise immunity.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections for improved signal integrity.

Nominal Supply Voltage: 1 V

The 1V nominal supply voltage is a common standard in electronic systems, simplifying power management.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density packaging and fine-pitch interconnects on the PCB.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MPFS250T-1FCSG536E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B536

Length:

16 mm

No. of Terminals:

536

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA536,30X30,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

MPFS250T-1FCSG536E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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