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XC7Z007S-2CLG400E

Xilinx

XC7Z007S-2CLG400E by Xilinx

The Xilinx XC7Z007S-2CLG400E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components.

Median Price

$70.690

Lifecycle Status

Suppliers In-Stock

9

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Farnell

UK . 60 parts In-Stock

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$67.020

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DigiKey

USA . 187 parts In-Stock

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$70.680

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Mouser Electronics

USA . 66 parts In-Stock

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Newark

USA . 10 parts In-Stock

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$75.830

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$75.830

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Element14

Singapore . 60 parts In-Stock

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$121.790

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Digiode

USA . 183 parts In-Stock

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$63.669

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VNN

France . 920 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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$84.110

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Vyrian

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AZTECH Wire

Italy . 643 parts In-Stock

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$14.964

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Continental Prestige Electronics

USA . 20 parts In-Stock

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$44.310

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Corohmni

South Africa . 172 parts In-Stock

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$47.687

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MARBEL Systems

Belgium . 2,451 parts In-Stock

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$51.508

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$49.448

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Ampacity Inc.

Singapore . 90 parts In-Stock

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$56.970

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Semicontronic

India . 25 parts In-Stock

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$56.970

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$55.546

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$55.261

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Modulus Dynamics

Lithuania . 315 parts In-Stock

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$57.695

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$57.695

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Texas Native Microelectronics

USA . 16,542 parts In-Stock

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$59.205

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$56.837

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$55.061

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Corphita

USA . 171 parts In-Stock

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$60.318

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Vigor

Singapore . 394 parts In-Stock

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$63.630

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Kenton Components

USA . 2,948 parts In-Stock

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$71.046

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$62.520

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Aztec Data Supply Inc.

USA . 4,357 parts In-Stock

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$76.340

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$84.104

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Netroflash

USA . 100 parts In-Stock

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$84.110

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$82.428

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Lixinc

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Argo Parts USA

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Qasali Group International

UK . 1,000 parts In-Stock

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$140.671

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Supply Digital

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Perfect Parts

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Robosynatics

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Lucentia Tech

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Overview

Enhance your electronic designs with the cutting-edge XC7Z007S-2CLG400E by Xilinx. Known for its superior quality and innovative technology, Xilinx delivers exceptional products that cater to a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category. This versatile chip offers unmatched value, benefits, and advantages to customers looking to elevate their projects to the next level. With a focus on performance and reliability, Xilinx ensures that every design using the XC7Z007S-2CLG400E exceeds expectations. Elevate your creations today with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer product lifespan.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and labor costs during production.

Maximum Supply Voltage: 1.05 V

Operates efficiently within a safe voltage range, minimizing the risk of damage to the product or other connected devices.

Package Shape: SQUARE

Square shape allows for compact and efficient placement on circuit boards, optimizing space usage.

No. of Terminals: 400

High number of terminals enable complex connections and functionalities, making the product versatile for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a low profile design with fine pitch, enhancing thermal performance and allowing for high-density mounting.

Minimum Supply Voltage: 0.95 V

Operates efficiently even at low voltage levels, providing flexibility and compatibility with different power sources.

Maximum Operating Temperature: 100 °C

Capable of operating at high temperatures without compromising performance, suitable for demanding industrial applications.

Minimum Operating Temperature: 0 °C

Capable of functioning in cold environments, ensuring reliability and stability under various temperature conditions.

Terminal Position: BOTTOM

Bottom terminal position allows for easier soldering and connections during installation, improving overall user experience.

Maximum Seated Height: 1.6 mm

Low seated height profile saves space and reduces interference with other components on the circuit board.

Width: 17 mm

Compact width allows for efficient placement in tight spaces, suitable for applications with limited board real estate.

Length: 17 mm

Symmetrical length design complements the square shape package, offering uniformity in placement and alignment.

Peripheral IC Type: SYSTEM ON CHIP

Integration of various functions into a single chip simplifies design complexity, reduces component count, and enhances overall system efficiency.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, ensuring reliable operation.

Terminal Form: BALL

Ball terminals provide a secure connection and facilitate signal transmission, enhancing overall performance and reliability.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent and reliable operation, preventing voltage fluctuations that may affect performance.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting, enabling compact board design and precise signal routing for efficient functionality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z007S-2CLG400E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B400

Length:

17 mm

No. of Terminals:

400

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

XC7Z007S-2CLG400E Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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