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CC1310F64RHBT

Texas Instruments

CC1310F64RHBT by Texas Instruments

CC1310F64RHBT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 28672 RAM Bytes, operating at -40 to 85 °C. It features a CORTEX-M3 CPU Family, 32 terminals in a SQUARE package style, and supports supply voltages from 1.8V to 3.8V. Ideal for industrial applications requiring low power consumption and high performance in compact designs.

Median Price

$7.060

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,250 parts In-Stock

1+ parts

$6.135

100+ parts

$5.375

1k+ parts

$3.037

10k+ parts

-

2,250

$6.135

$5.375

$3.037

-

Mouser Electronics

USA . 245 parts In-Stock

1+ parts

$7.060

100+ parts

$5.350

1k+ parts

$4.330

10k+ parts

-

245

$7.060

$5.350

$4.330

-

DigiKey

USA . 111 parts In-Stock

1+ parts

$7.060

100+ parts

$5.341

1k+ parts

$4.776

10k+ parts

$4.566

111

$7.060

$5.341

$4.776

$4.566

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.426

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$4.426

-

-

-

Digiode

USA . 1,410 parts In-Stock

1+ parts

$5.828

100+ parts

-

1k+ parts

-

10k+ parts

-

1,410

$5.828

-

-

-

Vyrian

USA . 5,098 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,098

-

-

-

-

ComSIT Distribution GmbH

Germany . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,852 parts In-Stock

1+ parts

$4.426

100+ parts

-

1k+ parts

-

10k+ parts

$4.338

5,852

$4.426

-

-

$4.338

Argo Parts USA

USA . 4,253 parts In-Stock

1+ parts

$4.426

100+ parts

-

1k+ parts

-

10k+ parts

-

4,253

$4.426

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$4.426

100+ parts

$4.338

1k+ parts

-

10k+ parts

-

2,000

$4.426

$4.338

-

-

Semicontronic

India . 443 parts In-Stock

1+ parts

$5.210

100+ parts

$5.080

1k+ parts

$5.054

10k+ parts

-

443

$5.210

$5.080

$5.054

-

Ampacity Inc.

Singapore . 428 parts In-Stock

1+ parts

$5.210

100+ parts

-

1k+ parts

-

10k+ parts

-

428

$5.210

-

-

-

Corphita

USA . 2,226 parts In-Stock

1+ parts

$5.522

100+ parts

-

1k+ parts

-

10k+ parts

-

2,226

$5.522

-

-

-

Corohmni

South Africa . 334 parts In-Stock

1+ parts

$15.500

100+ parts

-

1k+ parts

-

10k+ parts

-

334

$15.500

-

-

-

Parana Technologies

USA . 1,430 parts In-Stock

1+ parts

$34.490

100+ parts

-

1k+ parts

-

10k+ parts

-

1,430

$34.490

-

-

-

DigiPath Technology Company

USA . 2,323 parts In-Stock

1+ parts

$37.978

100+ parts

$34.940

1k+ parts

-

10k+ parts

-

2,323

$37.978

$34.940

-

-

ChromeModa Solutions

Germany . 4,084 parts In-Stock

1+ parts

$38.753

100+ parts

$31.777

1k+ parts

-

10k+ parts

-

4,084

$38.753

$31.777

-

-

IDEA Electronic Components Group

UK . 1,996 parts In-Stock

1+ parts

$38.753

100+ parts

$36.815

1k+ parts

$34.878

10k+ parts

-

1,996

$38.753

$36.815

$34.878

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$52.515

100+ parts

$47.789

1k+ parts

$43.062

10k+ parts

-

2,000

$52.515

$47.789

$43.062

-

Lixinc

USA . 11,299 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,299

-

-

-

-

A-Z Elektronik GmbH

Germany . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the CC1310F64RHBT by Texas Instruments. Designed with precision and quality in mind, this innovative microprocessor circuit offers a wide range of applications for various industries. From industrial automation to IoT devices, this chip carrier with a very thin profile provides unmatched performance and reliability. With a nominal supply voltage of 3.3V and a maximum operating temperature of 85°C, this product delivers optimum functionality while ensuring durability. Elevate your projects with the CC1310F64RHBT and experience the seamless integration and exceptional value that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the integrated circuit, making it suitable for various applications and environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on printed circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 3.8 V

The high maximum supply voltage allows for flexibility in power input, accommodating a wide range of voltage sources.

Package Shape: SQUARE

The square shape of the package provides a compact and efficient design, optimizing space on the PCB.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers high performance and energy efficiency, making it ideal for a variety of embedded applications.

RAM Bytes: 28672

With a large RAM capacity, this product can handle complex programs and data processing efficiently.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows this product to function reliably in extreme cold conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the integrated circuit.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is commonly used in many electronic devices, ensuring compatibility with existing systems.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this product has a moderate sensitivity to moisture, allowing for proper handling and storage procedures to maintain quality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC1310F64RHBT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

28672

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Trade Compliance

CC1310F64RHBT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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