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CC1312R1F3RGZT

Texas Instruments

CC1312R1F3RGZT by Texas Instruments

The Texas Instruments CC1312R1F3RGZT is a MICROPROCESSOR CIRCUIT with 81920 RAM Bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring low power consumption and high processing capabilities. The package style is CHIP CARRIER with 48 terminals in a SQUARE shape, suitable for surface mount assembly in compact electronic devices.

Median Price

$8.887

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,905 parts In-Stock

1+ parts

$8.004

100+ parts

$6.525

1k+ parts

$4.350

10k+ parts

-

13,905

$8.004

$6.525

$4.350

-

DigiKey

USA . 252 parts In-Stock

1+ parts

$9.770

100+ parts

$7.416

1k+ parts

$6.643

10k+ parts

$6.468

252

$9.770

$7.416

$6.643

$6.468

Mouser Electronics

USA . 139 parts In-Stock

1+ parts

$9.770

100+ parts

$7.420

1k+ parts

$5.970

10k+ parts

-

139

$9.770

$7.420

$5.970

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Chip1Stop

Japan . 1,500 parts In-Stock

1+ parts

-

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-

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$5.199

10k+ parts

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1,500

-

-

$5.199

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$6.315

100+ parts

-

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-

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100

$6.315

-

-

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Digiode

USA . 2,242 parts In-Stock

1+ parts

$7.604

100+ parts

-

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-

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2,242

$7.604

-

-

-

Chip Stock

USA . 18,480 parts In-Stock

1+ parts

-

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18,480

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Vyrian

USA . 7,242 parts In-Stock

1+ parts

-

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7,242

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-

-

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Inventory MP

USA . 490 parts In-Stock

1+ parts

-

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-

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490

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Bristol Electronics

USA . 490 parts In-Stock

1+ parts

-

100+ parts

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490

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,621 parts In-Stock

1+ parts

$4.420

100+ parts

-

1k+ parts

-

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3,621

$4.420

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-

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Semicontronic

India . 3,596 parts In-Stock

1+ parts

$4.420

100+ parts

$4.310

1k+ parts

$4.287

10k+ parts

-

3,596

$4.420

$4.310

$4.287

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Continental Prestige Electronics

USA . 1,895 parts In-Stock

1+ parts

$6.315

100+ parts

-

1k+ parts

-

10k+ parts

$6.189

1,895

$6.315

-

-

$6.189

Advanced Electronics

New Zealand . 89 parts In-Stock

1+ parts

$6.441

100+ parts

$6.441

1k+ parts

$6.441

10k+ parts

-

89

$6.441

$6.441

$6.441

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Corphita

USA . 2,280 parts In-Stock

1+ parts

$7.204

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2,280

$7.204

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Parana Technologies

USA . 450 parts In-Stock

1+ parts

$23.890

100+ parts

-

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$24.523

10k+ parts

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450

$23.890

-

$24.523

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DigiPath Technology Company

USA . 1,591 parts In-Stock

1+ parts

$26.306

100+ parts

$24.202

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-

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1,591

$26.306

$24.202

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IDEA Electronic Components Group

UK . 1,476 parts In-Stock

1+ parts

$26.843

100+ parts

$25.501

1k+ parts

$24.159

10k+ parts

-

1,476

$26.843

$25.501

$24.159

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ChromeModa Solutions

Germany . 131 parts In-Stock

1+ parts

$26.843

100+ parts

$22.011

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131

$26.843

$22.011

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Corohmni

South Africa . 1,058 parts In-Stock

1+ parts

$72.849

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1,058

$72.849

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QUARKTWIN TECHNOLOGY LTD

USA . 13,568 parts In-Stock

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13,568

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Argo Parts USA

USA . 3,357 parts In-Stock

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Lixinc

USA . 2,220 parts In-Stock

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Benley Electronics

USA . 250 parts In-Stock

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250

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Overview

Experience cutting-edge technology with the CC1312R1F3RGZT by Texas Instruments, a top-tier manufacturer known for quality and innovation. This versatile microprocessor circuit offers endless possibilities in various applications, from IoT devices to industrial automation. With its advanced features and reliable performance, this product delivers exceptional value and benefits to customers seeking seamless integration and optimal efficiency. Upgrade your projects today with the CC1312R1F3RGZT and stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making this product a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.8 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, increasing its versatility in different systems.

Package Shape: SQUARE

The square shape of the package makes it easy to integrate into compact designs, optimizing space usage in electronic devices.

No. of Terminals: 48

With a high number of terminals, this product offers extensive connectivity options for connecting to other components in a circuit.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This versatile package style offers efficient heat dissipation and space-saving benefits, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage requirement ensures energy efficiency and compatibility with various power sources, enhancing the product's adaptability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in demanding environmental conditions, making this product suitable for industrial use.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can function effectively even in extreme cold environments, increasing its usability in various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the product.

Terminal Position: QUAD

The quad terminal position offers enhanced connectivity options, making it easier to interface with other components in a circuit.

Maximum Seated Height: 1 mm

The low maximum seated height enables a slim profile for the product, making it suitable for compact electronic device designs.

Width: 7 mm

The 7mm width of the product allows for easy integration into standard-sized circuit board layouts, simplifying installation in various systems.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time requirement of 30 seconds streamlines manufacturing processes, reducing production time and costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the product can withstand the soldering process without damage, ensuring a robust assembly.

Length: 7 mm

The 7mm length of the product offers a compact form factor, enabling space-efficient designs in electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating certifies the product's reliability in harsh operating conditions, making it suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit enables advanced control and processing capabilities, making this product ideal for applications requiring high computational power.

RAM Bytes: 81920

The large RAM capacity of 81920 bytes allows for efficient data storage and processing, enhancing the performance of the product in demanding applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it an energy-efficient and reliable choice for various applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and reduces the risk of solder joint failures, ensuring a durable and long-lasting connection.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage offers compatibility with standard power sources, making this product easy to integrate into existing electronic systems.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting on circuit boards, maximizing connectivity options in a limited space.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product's reliability under moderate humidity levels, ensuring stable performance in various environmental conditions.

No. of I/O Lines: 30

The high number of I/O lines provides extensive input and output options, enabling versatile connectivity and functionality in electronic systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC1312R1F3RGZT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

81920

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

CC1312R1F3RGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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