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CC1310F128RSMT

Texas Instruments

CC1310F128RSMT by Texas Instruments

CC1310F128RSMT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85°C, with a supply voltage range of 1.8-3.8V. Ideal for industrial applications requiring a microprocessor circuit in a compact chip carrier package.

Median Price

$8.010

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 50,279 parts In-Stock

1+ parts

$6.832

100+ parts

$5.986

1k+ parts

$3.382

10k+ parts

-

50,279

$6.832

$5.986

$3.382

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DigiKey

USA . 839 parts In-Stock

1+ parts

$8.010

100+ parts

$6.069

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-

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839

$8.010

$6.069

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Mouser Electronics

USA . 152 parts In-Stock

1+ parts

$8.010

100+ parts

$5.660

1k+ parts

$4.910

10k+ parts

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152

$8.010

$5.660

$4.910

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$5.009

100+ parts

-

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300

$5.009

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Digiode

USA . 2,524 parts In-Stock

1+ parts

$6.490

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2,524

$6.490

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Chip Stock

USA . 75,111 parts In-Stock

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75,111

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Vyrian

USA . 16,899 parts In-Stock

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16,899

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LIBRA Elektronik GmbH

Germany . 11 parts In-Stock

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11

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Bristol Electronics

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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Continental Prestige Electronics

USA . 381 parts In-Stock

1+ parts

$5.009

100+ parts

-

1k+ parts

-

10k+ parts

$4.908

381

$5.009

-

-

$4.908

Netroflash

USA . 100 parts In-Stock

1+ parts

$5.009

100+ parts

-

1k+ parts

$4.758

10k+ parts

$4.658

100

$5.009

-

$4.758

$4.658

Ampacity Inc.

Singapore . 16,911 parts In-Stock

1+ parts

$5.810

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-

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16,911

$5.810

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Semicontronic

India . 16,789 parts In-Stock

1+ parts

$5.810

100+ parts

$5.665

1k+ parts

$5.636

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16,789

$5.810

$5.665

$5.636

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Corphita

USA . 3,008 parts In-Stock

1+ parts

$6.149

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3,008

$6.149

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Component Stockers USA

USA . 37,131 parts In-Stock

1+ parts

$7.920

100+ parts

$5.940

1k+ parts

$3.610

10k+ parts

$3.610

37,131

$7.920

$5.940

$3.610

$3.610

Advanced Electronics

New Zealand . 84 parts In-Stock

1+ parts

$16.005

100+ parts

$15.205

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$15.205

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84

$16.005

$15.205

$15.205

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Corohmni

South Africa . 364 parts In-Stock

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$30.443

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364

$30.443

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Parana Technologies

USA . 679 parts In-Stock

1+ parts

$30.742

100+ parts

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$69.331

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679

$30.742

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$69.331

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ChromeModa Solutions

Germany . 1,418 parts In-Stock

1+ parts

$34.542

100+ parts

$28.324

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1,418

$34.542

$28.324

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IDEA Electronic Components Group

UK . 611 parts In-Stock

1+ parts

$34.542

100+ parts

$32.815

1k+ parts

$31.088

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611

$34.542

$32.815

$31.088

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Perfect Parts

USA . 2,241 parts In-Stock

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Argo Parts USA

USA . 2,076 parts In-Stock

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DigiPath Technology Company

USA . 1,240 parts In-Stock

1+ parts

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$31.143

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1,240

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$31.143

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A-Z Elektronik GmbH

Germany . 117 parts In-Stock

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Futuretech Components

Singapore . 108 parts In-Stock

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Overview

Discover the Texas Instruments CC1310F128RSMT, a cutting-edge microprocessor circuit with a plethora of applications in various industries. With its high-quality design and innovative technology, this chip carrier offers unmatched performance and reliability. Whether you're looking to enhance your IoT devices, improve energy efficiency, or streamline communication systems, the CC1310F128RSMT is the perfect solution. Trust in Texas Instruments' expertise and invest in a product that guarantees value, efficiency, and endless possibilities for your projects. Elevate your creations with this industrial-grade microprocessor circuit today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 3.8 V

A higher supply voltage allows for more power to be delivered to the device, increasing its performance capabilities.

Package Shape: SQUARE

The square shape makes it easy to integrate this product into a variety of design layouts, providing flexibility in application.

No. of Terminals: 32

With a sufficient number of terminals, this product can accommodate various connections and peripherals, enhancing its functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design allows for efficient heat dissipation, ensuring optimal performance even in industrial settings.

Minimum Supply Voltage: 1.8 V

A low minimum supply voltage helps to conserve power and extend the product's battery life, making it energy-efficient.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes this product suitable for use in a wide range of environments, including industrial settings.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family is known for its efficiency and reliability, ensuring smooth operation and high performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function reliably even in extreme cold conditions, expanding its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of multiple high-quality finishes on the terminals enhances connectivity, prevents corrosion, and ensures long-term durability.

Terminal Position: QUAD

The quad terminal position offers easy integration and better stability in the circuit, improving overall performance.

Maximum Seated Height: 1 mm

The low seated height enables a compact and slim design, making it suitable for space-constrained applications.

Width: 4 mm

The compact width allows for easy integration into various product designs, maximizing space efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature ensures that the components are properly soldered, improving the product's reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures that the solder joints are strong and durable, enhancing the product's longevity.

Length: 4 mm

The compact length contributes to a small footprint, making it ideal for portable and space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature tolerance ensures that this product can withstand harsh conditions and operate reliably in demanding environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit enhances the product's processing power and capability, making it suitable for advanced applications.

RAM Bytes: 28672

The large RAM capacity allows for efficient data processing and multitasking, improving the product's overall performance.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, making this product energy-efficient and reliable.

Terminal Form: NO LEAD

The lead-free terminal form complies with environmental regulations and ensures a safe and eco-friendly product.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is commonly used in many applications, ensuring compatibility and versatility.

Terminal Pitch: 0.4 mm

The small terminal pitch allows for high-density mounting of components, saving space and enabling compact designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that this product can withstand a moderate amount of moisture exposure, suitable for most environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC1310F128RSMT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

28672

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

CC1310F128RSMT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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