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CC1310F128RSMR

Texas Instruments

CC1310F128RSMR by Texas Instruments

CC1310F128RSMR by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. Operating at -40 to 85 °C, it has a supply voltage range of 1.8-3.8 V and comes in a square chip carrier package style for industrial applications requiring microprocessor circuits.

Median Price

$6.060

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 87,000 parts In-Stock

1+ parts

$4.444

100+ parts

$3.894

1k+ parts

$2.200

10k+ parts

-

87,000

$4.444

$3.894

$2.200

-

Mouser Electronics

USA . 2,835 parts In-Stock

1+ parts

$6.060

100+ parts

$3.960

1k+ parts

$3.570

10k+ parts

$3.510

2,835

$6.060

$3.960

$3.570

$3.510

DigiKey

USA . 12,881 parts In-Stock

1+ parts

$6.160

100+ parts

$4.657

1k+ parts

$4.096

10k+ parts

-

12,881

$6.160

$4.657

$4.096

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,100 parts In-Stock

1+ parts

$4.222

100+ parts

-

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-

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4,100

$4.222

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Nova Conductors

Japan . 30 parts In-Stock

1+ parts

$4.362

100+ parts

-

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30

$4.362

-

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Chip Stock

USA . 75,122 parts In-Stock

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75,122

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Vyrian

USA . 30,940 parts In-Stock

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-

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30,940

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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3,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 30,691 parts In-Stock

1+ parts

$3.780

100+ parts

$3.686

1k+ parts

$3.667

10k+ parts

-

30,691

$3.780

$3.686

$3.667

-

Ampacity Inc.

Singapore . 30,664 parts In-Stock

1+ parts

$3.780

100+ parts

-

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30,664

$3.780

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Corphita

USA . 1,821 parts In-Stock

1+ parts

$4.000

100+ parts

-

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-

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1,821

$4.000

-

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Argo Parts USA

USA . 3,314 parts In-Stock

1+ parts

$4.362

100+ parts

-

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10k+ parts

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3,314

$4.362

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-

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Continental Prestige Electronics

USA . 1,093 parts In-Stock

1+ parts

$4.362

100+ parts

-

1k+ parts

-

10k+ parts

$4.275

1,093

$4.362

-

-

$4.275

Netroflash

USA . 100 parts In-Stock

1+ parts

$4.362

100+ parts

-

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100

$4.362

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Corohmni

South Africa . 42 parts In-Stock

1+ parts

$30.815

100+ parts

-

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42

$30.815

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-

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$57.550

100+ parts

$52.371

1k+ parts

$47.191

10k+ parts

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500

$57.550

$52.371

$47.191

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Parana Technologies

USA . 786 parts In-Stock

1+ parts

$76.981

100+ parts

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786

$76.981

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DigiPath Technology Company

USA . 2,174 parts In-Stock

1+ parts

$84.765

100+ parts

$77.984

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-

10k+ parts

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2,174

$84.765

$77.984

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IDEA Electronic Components Group

UK . 1,633 parts In-Stock

1+ parts

$86.495

100+ parts

$82.170

1k+ parts

$77.846

10k+ parts

-

1,633

$86.495

$82.170

$77.846

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ChromeModa Solutions

Germany . 735 parts In-Stock

1+ parts

$86.495

100+ parts

$70.926

1k+ parts

-

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735

$86.495

$70.926

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Epart123

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

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$2.450

10k+ parts

$2.450

20,000

-

-

$2.450

$2.450

GreenTree Electronics

Israel . 15,000 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 9,000 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Infinite Electronics LLP (Excess)

. 3,740 parts In-Stock

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3,740

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A-Z Elektronik GmbH

Germany . 3,420 parts In-Stock

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Lixinc

USA . 2,726 parts In-Stock

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2,726

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

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1,200

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Perfect Parts

USA . 230 parts In-Stock

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230

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Futuretech Components

Singapore . 108 parts In-Stock

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108

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Overview

Elevate your projects with the CC1310F128RSMR by Texas Instruments, a top-tier manufacturer known for cutting-edge technology. This versatile microprocessor circuit offers unmatched quality and reliability in a compact package, perfect for a wide range of applications. From smart home devices to industrial automation, this powerhouse delivers seamless performance and efficiency. Experience the value of advanced features and benefits tailored to meet your needs. Upgrade to the CC1310F128RSMR and unlock a world of possibilities for your next innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy installation and space-saving on circuit boards.

Maximum Supply Voltage: 3.8 V

Can handle a higher voltage input, providing flexibility in power supply options.

Package Shape: SQUARE

Compact shape that optimizes space utilization on a circuit board.

No. of Terminals: 32

Sufficient number of terminals for connectivity and functionality.

Minimum Supply Voltage: 1.8 V

Can operate at a low voltage, saving power consumption.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial applications.

CPU Family: CORTEX-M3

High-performance processor family for efficient processing tasks.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme low-temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

Provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position for stable and secure connections.

Maximum Seated Height: 1 mm

Low profile design for compact installations.

Width: 4 mm

Slim and narrow width for space-saving on circuit boards.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for a reliable reflow process during manufacturing.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance for robust manufacturing processes.

Length: 4 mm

Compact length for space-efficient circuit board layouts.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with reliable performance in tough conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

High-quality peripheral IC for enhanced functionality and processing capabilities.

RAM Bytes: 28672

Ample RAM capacity for efficient data processing and multitasking.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly manufacturing.

Nominal Supply Voltage: 3.3 V

Standardized supply voltage for compatibility with various power sources.

Terminal Pitch: 0.4 mm

Fine terminal pitch for precise connections and compact design.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for safe handling and storage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC1310F128RSMR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

28672

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

CC1310F128RSMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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