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AM6411BKCGHAALV

Texas Instruments

AM6411BKCGHAALV by Texas Instruments

AM6411BKCGHAALV by Texas Instruments is a System on Chip with 441 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715 to 0.79 V. Ideal for applications requiring fine pitch and ball terminal form technology.

Median Price

$16.202

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,866 parts In-Stock

1+ parts

$12.115

100+ parts

$10.582

1k+ parts

$7.298

10k+ parts

-

2,866

$12.115

$10.582

$7.298

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DigiKey

USA . 721 parts In-Stock

1+ parts

$20.290

100+ parts

$14.178

1k+ parts

$13.198

10k+ parts

-

721

$20.290

$14.178

$13.198

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Distributors (In-Stock)

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Digiode

USA . 201 parts In-Stock

1+ parts

$11.509

100+ parts

-

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201

$11.509

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-

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$13.484

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600

$13.484

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Vyrian

USA . 6,131 parts In-Stock

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VNN

France . 4,006 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 1,454 parts In-Stock

1+ parts

$10.300

100+ parts

$10.042

1k+ parts

$9.991

10k+ parts

-

1,454

$10.300

$10.042

$9.991

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Corphita

USA . 2,873 parts In-Stock

1+ parts

$10.904

100+ parts

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2,873

$10.904

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Continental Prestige Electronics

USA . 3,167 parts In-Stock

1+ parts

$12.955

100+ parts

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10k+ parts

$12.696

3,167

$12.955

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-

$12.696

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$13.484

100+ parts

$13.215

1k+ parts

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1,000

$13.484

$13.215

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Ampacity Inc.

Singapore . 1,674 parts In-Stock

1+ parts

$22.410

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1,674

$22.410

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Corohmni

South Africa . 525 parts In-Stock

1+ parts

$47.712

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525

$47.712

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Argo Parts USA

USA . 2,070 parts In-Stock

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2,070

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

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300

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Overview

Unlock the power of cutting-edge technology with the AM6411BKCGHAALV by Texas Instruments. Designed with precision and quality in mind, this product offers unparalleled performance in a variety of applications. Whether you're looking to enhance your industrial systems or streamline your consumer electronics, this innovative solution delivers value, reliability, and efficiency. Trust Texas Instruments to provide the tools you need to stay ahead of the curve and elevate your projects to new heights. Elevate your designs with the AM6411BKCGHAALV today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into PCB designs, saving space and streamlining production processes.

Maximum Supply Voltage: 0.79 V

With a maximum supply voltage of 0.79 V, this product is suitable for low-power applications, helping to conserve energy and reduce heat dissipation.

Package Shape: SQUARE

The square package shape offers a compact and symmetrical design, making it easy to layout on a PCB and optimize space usage.

No. of Terminals: 441

With 441 terminals, this product offers ample connectivity options for a wide range of functions and interfaces.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style provides high density packaging, allowing for more components in a smaller footprint.

Minimum Supply Voltage: 0.715 V

The low minimum supply voltage of 0.715 V makes this product efficient and suitable for battery-powered devices or low voltage systems.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, this product can withstand high temperature environments and extended use.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable performance in cold climates or industrial settings.

Terminal Position: BOTTOM

Bottom terminal position offers easy access for soldering and connection, simplifying the assembly process.

Maximum Seated Height: 2.652 mm

The low maximum seated height of 2.652 mm enables a slim profile and allows for compact designs in space-constrained applications.

Width: 17.2 mm

The width of 17.2 mm provides a balance between space efficiency and ease of handling during assembly and integration.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, this product can withstand high-temperature soldering processes without damage.

Length: 17.2 mm

The length of 17.2 mm offers a square shape, promoting symmetry in layout and ensuring efficient use of PCB space.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip peripheral IC type combines multiple functions into a single integrated circuit, reducing component count and complexity in designs.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this product energy-efficient and reliable for various applications.

Terminal Form: BALL

The ball terminal form offers reliable connection and soldering, ensuring secure and lasting electrical connections.

Nominal Supply Voltage: 0.75 V

The nominal supply voltage of 0.75 V allows for stable and consistent operation, ensuring reliable performance across a range of operating conditions.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, this product offers precise and compact terminal spacing, ideal for high-density PCB designs.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that this product requires specific handling to prevent moisture-related damage, ensuring long-term reliability in humid environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6411BKCGHAALV attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

441

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.652 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6411BKCGHAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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