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AM6442BSDGHAALV

Texas Instruments

AM6442BSDGHAALV by Texas Instruments

AM6442BSDGHAALV by Texas Instruments is a CMOS system-on-chip with 441 terminals in a square grid array package. It operates at temperatures ranging from -40 to 105 °C and has a max supply voltage of 0.79 V. This IC is commonly used in applications requiring high-speed processing, such as data centers or telecommunications equipment.

Median Price

$33.360

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,682 parts In-Stock

1+ parts

$20.899

100+ parts

$18.256

1k+ parts

$12.590

10k+ parts

-

1,682

$20.899

$18.256

$12.590

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Mouser Electronics

USA . 92 parts In-Stock

1+ parts

$33.360

100+ parts

$24.440

1k+ parts

$23.330

10k+ parts

-

92

$33.360

$24.440

$23.330

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DigiKey

USA . 417 parts In-Stock

1+ parts

$33.600

100+ parts

$24.065

1k+ parts

$23.040

10k+ parts

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417

$33.600

$24.065

$23.040

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$18.243

100+ parts

-

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10

$18.243

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Digiode

USA . 939 parts In-Stock

1+ parts

$19.854

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939

$19.854

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VNN

France . 24,064 parts In-Stock

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24,064

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Vyrian

USA . 8,879 parts In-Stock

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8,879

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 730 parts In-Stock

1+ parts

$17.760

100+ parts

$17.316

1k+ parts

$17.227

10k+ parts

-

730

$17.760

$17.316

$17.227

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Ampacity Inc.

Singapore . 460 parts In-Stock

1+ parts

$17.760

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-

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460

$17.760

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$18.243

100+ parts

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1k+ parts

$17.331

10k+ parts

$16.966

2,000

$18.243

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$17.331

$16.966

Corphita

USA . 3,239 parts In-Stock

1+ parts

$18.809

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3,239

$18.809

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Microchip USA

USA . 1,245 parts In-Stock

1+ parts

$55.890

100+ parts

$54.920

1k+ parts

$54.430

10k+ parts

$53.950

1,245

$55.890

$54.920

$54.430

$53.950

Corohmni

South Africa . 254 parts In-Stock

1+ parts

$70.585

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254

$70.585

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Continental Prestige Electronics

USA . 3,198 parts In-Stock

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Argo Parts USA

USA . 2,020 parts In-Stock

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2,020

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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900

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Overview

Experience the cutting-edge technology and exceptional quality of the AM6442BSDGHAALV by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments offers unparalleled advantages and reliability. This product falls under the category of Other Function uPs,uCs & Peripheral ICs, providing endless possibilities for various applications. With its square package shape and surface mount capability, it offers convenience and flexibility in installation. Boasting a wide operating temperature range, this product guarantees optimal performance even in extreme conditions. Discover the value and benefits that the AM6442BSDGHAALV brings to your projects, ensuring efficiency, accuracy, and seamless functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This choice of material ensures durability and reliability of the product, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy integration and soldering, making the product suitable for modern PCB manufacturing processes.

Maximum Supply Voltage: 0.79 V

The low maximum supply voltage ensures energy efficiency and helps preserve the lifespan of the product.

Package Shape: SQUARE

The square shape offers space-saving benefits in designs, providing efficiency in the utilization of board real estate.

No. of Terminals: 441

Having a high number of terminals allows for versatile connectivity options, making this product suitable for complex circuitry needs.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch design enables higher density mounting, leading to efficient utilization of space on the circuit board.

Minimum Supply Voltage: 0.715 V

The low minimum supply voltage allows for operation in low power scenarios, reducing power consumption and extending battery life.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance in demanding environments, making it ideal for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation even in cold environments, making it suitable for outdoor and automotive applications.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and allows for more compact designs, providing space-saving advantages.

Maximum Seated Height: 2.652 mm

The low maximum seated height allows for slim and compact designs, making this product suitable for space-constrained applications.

Width: 17.2 mm

The moderate width ensures compatibility with standard PCB design guidelines, facilitating easy integration into various systems.

Peak Reflow Temperature °C: 250

The high peak reflow temperature ensures compatibility with lead-free soldering processes, making it suitable for modern manufacturing requirements.

Length: 17.2 mm

The moderate length ensures compatibility with standard PCB design guidelines, facilitating easy integration into various systems.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip design integrates multiple functions into a single chip, reducing system complexity and making it a cost-effective solution.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it an efficient choice.

Terminal Form: BALL

The ball terminal form simplifies soldering and ensures reliable electrical connections, making this product suitable for automated assembly processes.

Nominal Supply Voltage: 0.75 V

The low nominal supply voltage allows for low power operation, making this product suitable for battery-powered applications.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting, enabling compact and space-efficient designs.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates a moderate level of moisture sensitivity, ensuring the product's reliability during storage and handling.

Speed: 1000 rpm

The high speed capability of this product makes it suitable for applications that require fast data processing, such as communication systems or data centers.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6442BSDGHAALV attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

441

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.652 mm

Speed:

1000 rpm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6442BSDGHAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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