Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Octavo Systems' OSD3358-1G-ISM is a 256-terminal SoC with CMOS technology, operating b/w -40°C to 85°C. Its grid array package style and 1.27mm terminal pitch make it suitable for compact embedded systems requiring low power consumption and high processing capabilities. Ideal for IoT devices, robotics, and industrial automation applications.
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PLASTIC/EPOXY material provides good durability and resistance to impact, making the product long-lasting and reliable.
Surface mount technology allows for easy installation and soldering onto PCBs, saving space and making the product suitable for compact designs.
Square package shape helps in easy and efficient placement on the PCB, optimizing space and ensuring a neat layout.
Having 256 terminals allows for a high level of connectivity and flexibility in the circuit design, making the product versatile and suitable for complex applications.
Grid array package style provides uniform spacing and alignment of the terminals, facilitating easy assembly and reducing the risk of errors during installation.
With a maximum operating temperature of 85°C, the product can perform reliably in a wide range of environmental conditions, enhancing its suitability for various applications.
The product can operate effectively even at low temperatures down to -40°C, ensuring stability and performance in challenging environments.
Bottom terminal position simplifies the PCB layout and ensures efficient heat dissipation, contributing to the overall reliability of the product.
The low maximum seated height allows for a slim profile and compact design of the product, making it suitable for applications with space constraints.
A width of 21 mm provides a balanced size for the product, ensuring compatibility with standard PCB design practices and facilitating integration into various systems.
With a length of 21 mm, the product offers a square form factor that simplifies the layout and placement on the PCB, enhancing the overall efficiency of the design.
System-on-Chip (SoC) integration enhances the functionality and performance of the product, making it a versatile solution for diverse applications requiring complex processing capabilities.
CMOS technology offers low power consumption and high noise immunity, contributing to the efficiency and reliability of the product.
Ball terminal form provides reliable electrical connections and easy soldering, ensuring a secure and robust interface between the product and the PCB.
With a nominal supply voltage of 1.1 V, the product offers compatibility with low-power applications and enables energy-efficient operation.
The small terminal pitch of 1.27 mm allows for high-density mounting of components on the PCB, optimizing space and enabling the design of compact and efficient systems.
Other Function uPs,uCs & Peripheral ICs OSD3358-1G-ISM attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Octavo Systems
JESD-30 Code:
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Maximum Operating Temperature:
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Package Body Material:
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OSD3358-1G-ISM Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Octavo Systems, LLC was founded by three former Texas Instruments senior leaders. It all started in 2013 over a discussion between two of the founders of how they could impact the semiconductor industry. They believed that Moore’s law, as it was interpreted was missing a major transition of which the semiconductor industry was in the midst. What they realized was that Moore’s Law was taking on a new interpretation, moving from the concept of integrating on silicon (SoC) to integrating with silicon (SiP). As we have grown, we have strengthened our team and built a world class organization. To improve the capability and value of our customers’ electronic systems by delivering innovative, high-quality System-in-Package solutions. Pursuit of our mission will bring new technologies and new integration paths to innovative companies around the globe. By creating SiP devices we are allowing the idea behind Moore’s law to continue as the industry transitions from System on Chip (SoC) as the system integration method to System in Package (SiP) technology as the solution of choice. Through our technology and design innovations we are making this technology more accessible to all, allowing for the continued development of smaller, more cost effective, and more innovative products. The transition to System in Package will provide system designers a host of advantages including: Quicker Time to Market Smaller Size Lower Total Cost of Ownership We want to make sure this new era of integration is available to everyone and we strive to do everything we can to make sure you achieve your mission. Everything from the design of our products, to our sales channel, to our support has been developed to make this technology accessible and to ensure your success.
2N2222A
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
LM358D-T
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
ABS06-32.768KHZ-T
Abracon
Abracon's ABS06-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 90000 ohm series resistance, and -40 to 85 °C operating temperature range. Ideal for applications requiring precise timing in compact designs like IoT devices and wearables.
BAV99
Comchip Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2227UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
AH180-WG-7
Diodes Incorporated
AH180-WG-7 by Diodes Inc. is a magnetic field sensor with 1.5mT hysteresis, 0.30V output range, and 9mA max operating current. Ideal for applications requiring non-inverting analog voltage output in a compact rectangular package suitable for surface mount installations.
2N7002,215
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 30; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
NE555D
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
Taitron Components
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
LM317AEMP/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: SOP; Terminal Form: GULL WING; Qualification Status: Not Qualified; Width: 3.56 mm;
Space Power Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Silicon Standard
SMBJ18CA
Alpha & Omega Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
MCP25050-I/P
Microchip Technology
MCP25050-I/P by Microchip Tech: 8-bit microprocessor circuit with CMOS tech. Operates at -40 to 85°C, supply voltage of 2.7-5.5V. Ideal for industrial applications requiring TS16949 screening and dual-terminal finish in a rectangular package style.
SCANSTA111MTX/NOPB
Texas Instruments
SCANSTA111MTX/NOPB by Texas Instruments is a 48-terminal microprocessor circuit with CMOS technology. It operates at 3.3V, suitable for industrial applications with an operating temperature range of -40 to 85°C. This rectangular package IC is surface-mountable and has a max supply voltage of 3.6V, making it ideal for various embedded system designs.
EFR32MG21A020F768IM32-B
Silicon Labs
EFR32MG21A020F768IM32-B by Silicon Labs is a 32-terminal, square-shaped chip carrier with a supply voltage range of 1.71V to 3.8V. Operating b/w -40°C to 125°C, it's an automotive-grade System on Chip (SoC) with CMOS technology suitable for various IoT applications requiring compact and low-power solutions.
NHS3100/A1Z
NXP Semiconductors
MICROPROCESSOR CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
BM83SM1-00TA
BM83SM1-00TA by Microchip Tech is a 50-terminal IC with max supply voltage of 4.2V and min of 3.2V. It operates b/w -40 to 85°C, ideal for PROGRAMMABLE RFSoC applications due to its CMOS technology and compact rectangular package style.
5CSEBA6U23I7SN
Intel
SoC;
TW8804-LC3-GRSH
Renesas Electronics
Other uPs/uCs/Peripheral ICs; JESD-609 Code: e3; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 3;
SE050C1HQ1/Z01SCZ
SE050C1HQ1/Z01SCZ by NXP Semiconductors is a cryptographic authenticator IC with CMOS technology. It operates b/w -25 to 85 °C, with supply voltage range of 1.62V to 3.6V. This quad-terminal chip carrier is ideal for secure applications requiring high-level authentication and encryption.
SLB9665XT20FW563XUMA2
SLB9665XT20FW563XUMA2 by Infineon: 3.6V max supply, -40 to 85°C temp range, cryptographic authenticator for secure applications. Small outline package with 28 terminals, CMOS technology, suitable for surface mount designs.
MIMXRT1061CVL5B
NXP Semiconductors' MIMXRT1061CVL5B is a SoC with CMOS technology, featuring 196 terminals in a low-profile grid array package. Operating b/w -40 to 105°C, it has a supply voltage range of 1.15-1.26V and peak reflow temp of 260°C. Ideal for applications requiring high-performance microcontrollers in compact form factors.
ATMXT224S-MAUR043
ATMXT224S-MAUR043 by Microchip Technology is a 56-terminal, surface mount IC with a square package shape. It operates at a voltage range of 3V to 3.47V and has a max seated height of 0.6mm. This capacitive touch screen controller is suitable for various applications requiring precise touch input.
M1A3P600L-1FGG484I
SoC; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30;
SE050B2HQ1/Z01SFZ
SE050B2HQ1/Z01SFZ by NXP Semiconductors is a cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.62V to 3.6V, making it ideal for industrial applications requiring secure authentication.
FT245BL-T/R
FTDI
FT245BL-T/R by FTDI is a 32-terminal peripheral IC with a supply voltage range of 4.35V to 5.25V. It operates in temperatures from 0°C to 70°C, making it suitable for commercial applications requiring a microprocessor circuit with CMOS technology. The package style is flatpack, low profile, and it features gull wing terminal form for easy surface mounting at a compact size of 7mm x 7mm.
MCIMX6U7CVM08AC
MCIMX6U7CVM08AC by NXP Semiconductors is a System on Chip with 624 terminals, operating temperature range of -40 to 105 °C. It features a low profile grid array package style and uses CMOS technology. Ideal for industrial applications requiring high performance in compact form factor.
14450R-500
XCZU4EV-1SFVC784I
Xilinx
XCZU4EV-1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.
DA14531MOD-00F01002
SoC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250;
CC1310F32RSMT
CC1310F32RSMT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C, with a supply voltage range of 1.8-3.8 V. This MICROPROCESSOR CIRCUIT is ideal for industrial applications requiring low power consumption and compact design.
XAZU7EV-1FBVB900Q
Xilinx XAZU7EV-1FBVB900Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in automotive grade temperature range (-40 to 125 °C) and supports CAN, I2C, SPI, UART bus compatibility. The package has 900 terminals in a GRID ARRAY style suitable for surface mount applications.
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Octavo Systems
Supply Digital Components
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