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XC7Z012S-1CLG485C

Xilinx

XC7Z012S-1CLG485C by Xilinx

The Xilinx XC7Z012S-1CLG485C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring 485 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.

Median Price

$109.635

Lifecycle Status

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DigiKey

USA . 56 parts In-Stock

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Mouser Electronics

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Digiode

USA . 442 parts In-Stock

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$108.480

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VNN

France . 732 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 813 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

South Africa . 318 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 77 parts In-Stock

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Semicontronic

India . 30 parts In-Stock

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Vigor

Singapore . 363 parts In-Stock

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Corphita

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Modulus Dynamics

Lithuania . 272 parts In-Stock

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Texas Native Microelectronics

USA . 525 parts In-Stock

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$108.695

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Continental Prestige Electronics

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Netroflash

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Microchip USA

USA . 1,106 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Argo Parts USA

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Qasali Group International

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Kenton Components

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Overview

Elevate your electronic designs with the XC7Z012S-1CLG485C by Xilinx, a cutting-edge System on Chip (SoC) that promises top-notch performance and reliability. As a trusted leader in the industry, Xilinx delivers superior quality products that cater to a wide range of applications, ensuring seamless integration and optimal functionality. Whether you're working on IoT devices, automotive systems, or industrial automation, this innovative solution offers unparalleled value, benefits, and advantages to meet your project needs. Upgrade your projects today with the XC7Z012S-1CLG485C and experience the difference Xilinx can make for you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product resistant to physical damage and easy to handle.

Surface Mount: YES

Surface mount technology allows for easy installation and integration into circuit boards, saving space and reducing overall manufacturing costs.

Maximum Supply Voltage: 1.05 V

Higher maximum supply voltage ensures stable operation and flexibility in various power supply configurations.

Package Shape: SQUARE

Square package shape is versatile and easy to work with in circuit design and layout.

No. of Terminals: 485

Higher number of terminals provide more connectivity options and functionality in the device.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array packaging with low profile and fine pitch design allows for high density integration and improved performance.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage ensures efficient power consumption and operation in low power environments.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures device functionality in a wide range of temperature settings.

Terminal Position: BOTTOM

Bottom terminal position allows for convenient placement and connection within a circuit board setup.

Maximum Seated Height: 1.6 mm

Low maximum seated height allows for slim and compact device designs, suitable for space-constrained applications.

Width: 19 mm

Standard width size provides compatibility with common PCB layouts and design practices.

Length: 19 mm

Standard length size provides compatibility with common PCB layouts and design practices.

Peripheral IC Type: SYSTEM ON CHIP

Integrated System on Chip design offers multiple functions in a single component, reducing overall system complexity and cost.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with various digital systems.

Terminal Form: BALL

Ball terminal form offers reliable connections and easy soldering during assembly processes.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent performance and reliability in operation.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density interconnections and compact design layout, suitable for advanced electronic applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z012S-1CLG485C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B485

Length:

19 mm

No. of Terminals:

485

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA485,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

19 mm

Peripheral IC Type:

Trade Compliance

XC7Z012S-1CLG485C Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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