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XC7Z010-1CLG400C

Xilinx

XC7Z010-1CLG400C by Xilinx

XC7Z010-1CLG400C by Xilinx is a 400-terminal, low-profile, fine-pitch grid array package with a max supply voltage of 1.05V. It is a system-on-chip (SoC) peripheral IC that operates in temperatures ranging from 0 to 85°C. This versatile device is commonly used in various applications requiring high-performance computing and integrated functionality.

Median Price

$81.350

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DigiKey

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Farnell

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Mouser Electronics

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Element14

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Digiode

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Bristol Electronics

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VNN

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Nova Conductors

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Cyclops Electronics Ltd

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Avant Electronics Limited

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Sunrise Surplus Inc.

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LIBRA Elektronik GmbH

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First Choice Components Inc.

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ComSIT Distribution GmbH

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Modulus Dynamics

Lithuania . 1,875 parts In-Stock

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Corohmni

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Semicontronic

India . 270 parts In-Stock

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Ampacity Inc.

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Vigor

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Corphita

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Continental Prestige Electronics

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Aztec Data Supply Inc.

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Component Stockers USA

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Aranea Global

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Microchip USA

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Texas Native Microelectronics

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Advanced Electronics

New Zealand . 642 parts In-Stock

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Qasali Group International

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Lixinc

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Supply Digital

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Robosynatics

Brazil . 1,089 parts In-Stock

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Lucentia Tech

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GreenTree Electronics

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iodParts Technologies Inc.

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RC Electronics

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Kenton Components

USA . 95 parts In-Stock

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ChipstoGo Electronic ltd

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Overview

Experience powerful performance and unparalleled versatility with the XC7Z010-1CLG400C by Xilinx. As a leader in the industry, Xilinx is known for their exceptional quality and reliability. This cutting-edge product falls under the category of Other Function uPs,uCs & Peripheral ICs, making it ideal for a wide range of applications. With its compact square shape and surface mount capability, it offers easy integration into any project. But what truly sets the XC7Z010-1CLG400C apart is the value it brings to customers. Its low profile design, high operating temperature, and wide supply voltage range ensure optimal performance even in challenging environments. Whether you're working on embedded systems, industrial automation, or wireless communication, this system-on-chip solution delivers the power and efficiency you need. Unlock your potential with the XC7Z010-1CLG400C and experience the Xilinx advantage today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and protection for the integrated circuits, making this product suitable for rugged environments.

Surface Mount: YES

This product can be easily mounted on a circuit board using surface mount technology, allowing for efficient and compact designs.

Maximum Supply Voltage: 1.05 V

With a high maximum supply voltage, this product can handle a wide range of power requirements, providing flexibility in different applications.

Package Shape: SQUARE

The square package shape offers efficient use of space on the circuit board, enabling a more compact design and better overall system integration.

No. of Terminals: 400

With a large number of terminals, this product enables complex connectivity and supports a wide range of input and output signals, making it suitable for advanced functionalities.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style allows for high-density circuitry, reducing the overall size of the system and improving signal integrity.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures energy efficiency and extends battery life, making this product ideal for portable and battery-powered applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environments with elevated temperatures, ensuring reliable performance in extreme conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows this product to operate in cold environments, making it suitable for a wide range of applications, including outdoor and industrial settings.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The use of tin/silver/copper terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring optimal performance and long-term reliability.

Terminal Position: BOTTOM

The terminal position at the bottom of the package simplifies the PCB layout and allows for easy integration into the circuit board assembly process.

Maximum Seated Height: 1.6 mm

With a low maximum seated height, this product offers a compact form factor, allowing for space-saving designs in applications with limited vertical clearance.

Width: 17 mm

The 17 mm width of this product provides compatibility with standard PCB dimensions, facilitating seamless integration into various electronic systems.

Length: 17 mm

With a length of 17 mm, this product offers a balanced footprint, enabling efficient board space utilization and enhanced layout flexibility.

Peripheral IC Type: SYSTEM ON CHIP

The integration of various peripherals into this system on chip IC enhances functionality, simplifies system design, and reduces the overall component count, making it an efficient solution for a wide range of applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption, high noise immunity, and wide signal swing, making this product suitable for battery-powered devices and noise-sensitive applications.

Terminal Form: BALL

The ball terminal form allows for reliable connections, improved thermal dissipation, and easy rework or replacement, enhancing the overall reliability and ease of use of this product.

Nominal Supply Voltage: 1 V

With a nominal supply voltage of 1 V, this product offers compatibility with common power sources, simplifying the power management design and reducing overall system complexity.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch provides compatibility with standard PCB manufacturing processes and ensures reliable electrical connections, making this product compatible with a wide range of electronic assemblies.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this product can withstand exposure to moderate moisture levels during handling and assembly, ensuring the reliability and quality of the final product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z010-1CLG400C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

XC7Z010-1CLG400C Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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