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MCIMX7D3EVK10SD

NXP Semiconductors

MCIMX7D3EVK10SD by NXP Semiconductors

MCIMX7D3EVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating b/w -20 to 105°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.

Median Price

$28.810

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 117 parts In-Stock

1+ parts

$23.820

100+ parts

$15.990

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117

$23.820

$15.990

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Arrow

USA . 479 parts In-Stock

1+ parts

$27.800

100+ parts

$19.300

1k+ parts

$17.670

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479

$27.800

$19.300

$17.670

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Chip1Stop

Japan . 702 parts In-Stock

1+ parts

$28.810

100+ parts

$17.020

1k+ parts

$16.850

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702

$28.810

$17.020

$16.850

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DigiKey

USA . 294 parts In-Stock

1+ parts

$34.820

100+ parts

$24.972

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$23.913

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294

$34.820

$24.972

$23.913

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Mouser Electronics

USA . 142 parts In-Stock

1+ parts

$37.370

100+ parts

$25.680

1k+ parts

$25.030

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142

$37.370

$25.680

$25.030

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Element14

Singapore . 5 parts In-Stock

1+ parts

$40.550

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$30.340

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5

$40.550

$30.340

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Newark

USA . 5 parts In-Stock

1+ parts

$40.840

100+ parts

$31.830

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$31.180

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5

$40.840

$31.830

$31.180

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EBV Elektronik

Germany . 2,888 parts In-Stock

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Verical

USA . 502 parts In-Stock

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$25.587

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$22.900

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$21.550

502

-

$25.587

$22.900

$21.550

Rochester

USA . 502 parts In-Stock

1+ parts

-

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$20.470

1k+ parts

$18.320

10k+ parts

$17.240

502

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$20.470

$18.320

$17.240

Avnet

USA . 304 parts In-Stock

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Flip Electronics (Authorized)

USA . 142 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 4,536 parts In-Stock

1+ parts

$18.012

100+ parts

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4,536

$18.012

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$23.364

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150

$23.364

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J2 Sourcing AB

Sweden . 15,960 parts In-Stock

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Chip Stock

USA . 3,700 parts In-Stock

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3,700

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Vyrian

USA . 3,321 parts In-Stock

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Anansix

USA . 1,083 parts In-Stock

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1,083

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Flip Electronics

USA . 142 parts In-Stock

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142

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Bristol Electronics

USA . 106 parts In-Stock

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106

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ComSIT Distribution GmbH

Germany . 43 parts In-Stock

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ComSIT USA

USA . 43 parts In-Stock

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43

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

iBuyXS LLC

. 15,200 parts In-Stock

1+ parts

$11.420

100+ parts

-

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15,200

$11.420

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Semicontronic

India . 301 parts In-Stock

1+ parts

$16.120

100+ parts

$15.717

1k+ parts

$15.636

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301

$16.120

$15.717

$15.636

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Ampacity Inc.

Singapore . 242 parts In-Stock

1+ parts

$16.120

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242

$16.120

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Corphita

USA . 2,363 parts In-Stock

1+ parts

$17.064

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2,363

$17.064

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Continental Prestige Electronics

USA . 175 parts In-Stock

1+ parts

$20.420

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$20.420

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Corohmni

South Africa . 159 parts In-Stock

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$23.282

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159

$23.282

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Netroflash

USA . 50 parts In-Stock

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$23.364

100+ parts

$22.897

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50

$23.364

$22.897

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$24.466

100+ parts

$22.264

1k+ parts

$20.062

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2,000

$24.466

$22.264

$20.062

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Aztec Data Supply Inc.

USA . 3,355 parts In-Stock

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$42.860

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$42.860

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Microchip USA

USA . 2,009 parts In-Stock

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$73.186

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$73.186

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BidChips

USA . 15,200 parts In-Stock

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Lixinc

USA . 7,987 parts In-Stock

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7,987

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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UNI Independent Distributors

Spain . 4,789 parts In-Stock

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4,789

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 1,383 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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950

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Lucentia Tech

USA . 950 parts In-Stock

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$7.005

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$7.005

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$7.005

950

-

$7.005

$7.005

$7.005

GreenTree Electronics

Israel . 304 parts In-Stock

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304

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ChipTracer

USA . 106 parts In-Stock

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106

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Overview

Unlock the potential of your next project with the MCIMX7D3EVK10SD by NXP Semiconductors. As a trusted manufacturer in the industry, NXP delivers top-quality products that exceed expectations. This versatile system-on-chip offers endless possibilities for applications in various industries. With its cutting-edge technology and reliable performance, the MCIMX7D3EVK10SD provides unmatched value, benefits, and advantages to customers looking to push the boundaries of innovation. Experience the difference with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 1.25 V

The high maximum supply voltage of 1.25 V provides flexibility in power supply options, accommodating a wide range of power sources.

Package Shape: SQUARE

The square package shape ensures efficient use of space on the PCB, allowing for compact and densely populated designs.

No. of Terminals: 488

The large number of terminals (488) offers extensive connectivity options, enabling complex functionality and communication capabilities.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style allows for high-density mounting on the PCB, maximizing component integration and reducing footprint.

Minimum Supply Voltage: 1.2 V

The low minimum supply voltage of 1.2 V helps in reducing power consumption and improving energy efficiency of the product.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105 °C, the product can withstand elevated temperature environments, ensuring reliability in various operating conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20 °C allows the product to operate effectively in cold environments, providing versatility in usage.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easier PCB layout and assembly, optimizing space utilization on the board.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1 mm contributes to a slim profile of the product, enabling compact designs and space-saving solutions.

Width: 12 mm

The width of 12 mm provides a balance between compactness and ease of handling, making the product suitable for various applications.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures quick and efficient soldering during assembly, reducing production time.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering connections, ensuring robust mechanical strength and electrical conductivity.

Length: 12 mm

The length of 12 mm contributes to a compact form factor of the product, enabling space-efficient designs and layouts.

Peripheral IC Type: SYSTEM ON CHIP

The integration of multiple functions into a single System on Chip (SoC) design enhances efficiency, reduces component count, and simplifies system implementation.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making the product energy-efficient and versatile.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections, enabling easy and secure attachment to the PCB, enhancing overall product reliability.

Nominal Supply Voltage: 1.225 V

The nominal supply voltage of 1.225 V ensures stable and consistent power distribution to the product, enhancing performance and reliability.

Terminal Pitch: 0.4 mm

The fine terminal pitch of 0.4 mm allows for high-density mounting, enabling compact designs and efficient use of PCB real estate.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates the level of sensitivity to moisture during storage and assembly, ensuring proper handling and storage practices to maintain product integrity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX7D3EVK10SD attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B488

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

488

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA488,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.225 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Peripheral IC Type:

Trade Compliance

MCIMX7D3EVK10SD Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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