Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Xilinx XC7Z100-1FFG1156I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With a grid array package style and 1156 terminals, it's ideal for applications requiring high-performance computing in compact spaces.
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Plastic/Epoxy material makes the package lightweight and durable, ideal for portable or handheld devices.
Surface mount design makes it easy to mount on PCBs, saving space and allowing for automated assembly.
Higher maximum supply voltage ensures stable performance and protection against overvoltage.
Square shape allows for efficient use of space on the PCB and easy alignment during assembly.
High number of terminals provides versatility and compatibility with different circuit configurations.
Grid array package style offers better heat dissipation and electrical performance compared to other styles.
Lower minimum supply voltage allows for energy-efficient operation and extends battery life in portable devices.
High maximum operating temperature ensures reliable performance in various environmental conditions.
Wide operating temperature range allows for use in extreme conditions without compromising performance.
Bottom terminal position simplifies PCB layout and improves heat dissipation for efficient operation.
Low seated height saves space on the PCB and allows for compact design in space-constrained applications.
Compact width dimensions make the product suitable for small form factor devices.
Square shape with equal length and width dimensions simplifies PCB layout and ensures uniform thermal distribution.
System on Chip integration reduces component count, lowers power consumption, and enhances overall system performance.
CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices.
Ball terminal form provides reliable electrical connections and simplifies the mounting process on PCBs.
Stable nominal supply voltage ensures consistent performance and compatibility with various power sources.
Narrow terminal pitch allows for high-density mounting and miniaturization, suitable for compact electronic devices.
Other Function uPs,uCs & Peripheral ICs XC7Z100-1FFG1156I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx
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XC7Z100-1FFG1156I Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Cross-Ship Lead-Free Notice 31/Oct/2016 Mult Dev Material Chg 16/Dec/2019
PCN Packaging - Mult Devices 26/Jun/2017
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
LM358N
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
SS14
Hy Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Intertechnology
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
1N4148WS
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555D
Philips Semiconductors
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SS495ASP
Micro Switch
The Micro Switch SS495ASP is an analog circuit IC with a supply voltage range of 4.5V to 10.5V, suitable for automotive applications. Its package body material is plastic/epoxy, and it has a rectangular shape with three terminals. Operating temperature ranges from -40°C to 125°C, making it ideal for various automotive sensor and control systems.
Daco Semiconductor
1N4148
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
LM107H
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
LM555CM
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
CDSOT23-SM712
Bourns
Bourns CDSOT23-SM712 is a bidirectional Transient Voltage Suppressor diode with 400W peak power dissipation and 20uA reverse current. Ideal for surge protection in applications requiring a max clamping voltage of 14V, such as IEC-61000-4-2 compliant systems. Operates b/w -55°C to 150°C with matte tin finish and Gull Wing terminals.
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
Samsung
LL4148
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Rugao Dachang Electronic
RECTIFIER DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 40 V; Maximum Forward Voltage (VF): .55 V; No. of Elements: 1; Technology: SCHOTTKY;
2N7002
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
XCZU7EV-1FFVC1156E
Xilinx
XCZU7EV-1FFVC1156E by Xilinx is a CMOS microprocessor circuit with 1156 terminals in a grid array package. Operating b/w 0 to 100°C, it has a supply voltage range of 0.825V to 0.876V. Ideal for applications requiring high-performance processing capabilities in various electronic systems.
ATWINC1500-MR210PB1140
Microchip Technology
ATWINC1500-MR210PB1140 by Microchip operates at 3-4.2V, with temp range -40 to 85°C. It's a CMOS microprocessor circuit with 28 terminals, ideal for industrial applications requiring surface mount technology in compact spaces.
NRF52810-QFAA-R
Nordic Semiconductor Asa
NRF52810-QFAA-R by Nordic Semiconductor Asa is a 48-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.7V to 3.6V. Ideal for industrial applications due to its compact square shape and surface mount compatibility.
XC7Z010-1CLG400I
The Xilinx XC7Z010-1CLG400I is a System on Chip with 400 terminals, operating b/w -40 to 100 °C. It features a low profile grid array package style and CMOS technology, suitable for various applications requiring high performance in a compact form factor. With a supply voltage range of 0.95V to 1.05V, it is ideal for projects demanding efficient power consumption and advanced processing capabilities.
CY8C4149AZI-S598
Infineon Technologies
PROGRAMMABLE SYSTEM ON CHIP; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3;
ATWINC1500-MR210PB1961-T
ATWINC1500-MR210PB1961-T by Microchip operates at 3-4.2V, with temp range -40 to 85°C. It is a CMOS microprocessor circuit in a rectangular package style for industrial applications. This surface-mount IC has 28 terminals and measures 21.72mm x 14.73mm x 2.113mm, suitable for various uP/uC functions.
5100
Auctor
Other uPs/uCs/Peripheral ICs; No. of Terminals: 144; JESD-609 Code: e4; Terminal Finish: SILVER;
MCIMX286CVM4BR2
Freescale Semiconductor
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
PEX8618-BA50BCG
Plx Technology
Other uPs/uCs/Peripheral ICs;
MCIMX6Q5EYM10AC
NXP Semiconductors
MCIMX6Q5EYM10AC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 105 °C and has a supply voltage range of 1.35V to 1.5V. With 624 terminals in a GRID ARRAY package, it's ideal for applications requiring low profile, fine pitch ICs.
MIMXRT1173CVM8A
NXP Semiconductors' MIMXRT1173CVM8A is a low-profile, fine-pitch SoC with 289 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.1V to 1.15V. Ideal for applications requiring high-performance uPs and uCs in compact designs.
CY8C3866AXI-039T
CY8C3866AXI-039T by Infineon is a 100-terminal, low-profile, fine-pitch FLATPACK IC with a CMOS technology and 524288 ROM bits. Operating at -40 to 85 °C, it has a supply voltage range of 1.71V to 5.5V making it ideal for industrial applications requiring a programmable SoC solution.
CY8CMBR3116-LQXIT
Cypress Semiconductor
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
CY8C4024AZI-S413T
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Terminal Finish: PURE TIN;
STSPIN32F0601TR
STMicroelectronics
MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
LS1021AXN7KQB
LS1021AXN7KQB by NXP Semiconductors is a MICROPROCESSOR CIRCUIT with 525 terminals in a GRID ARRAY package. It operates b/w 0.97V to 1.03V, featuring CMOS technology and a peak reflow temperature of 260°C. Ideal for applications requiring high performance and compact design.
AM6231ASGGHAALW
Texas Instruments
AM6231ASGGHAALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715V to 0.79V. This IC is ideal for applications requiring a very thin profile and fine pitch grid array package style.
MIMXRT1064CVJ5A
NXP Semiconductors' MIMXRT1064CVJ5A is a SoC with CMOS technology, featuring 196 terminals in a low-profile grid array package. Operating b/w -40 to 105°C, it has a voltage range of 1.15-1.26V and peak reflow temp of 260°C. Ideal for industrial applications requiring high-performance microcontrollers.
OSD3358-1G-ISM
Octavo Systems
Octavo Systems' OSD3358-1G-ISM is a 256-terminal SoC with CMOS technology, operating b/w -40°C to 85°C. Its grid array package style and 1.27mm terminal pitch make it suitable for compact embedded systems requiring low power consumption and high processing capabilities. Ideal for IoT devices, robotics, and industrial automation applications.
ESP32-WROOM-32E-N8R2
Espressif Systems (Shanghai)
ESP32-WROOM-32E-N8R2 by Espressif Systems is a 38-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 3-3.6 V. Ideal for IoT applications due to its compact size and surface mount capability.
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XC7Z020-1CLG400I
The Xilinx XC7Z020-1CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.
XC7Z010-1CLG400C
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
XC7Z020-2CLG484I
The Xilinx XC7Z020-2CLG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it is ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.
XC7Z020-1CLG484C
XC7Z020-1CLG484C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05 V. This low profile, fine pitch chip in a grid array package is ideal for various applications requiring high performance and integration.
XC7Z030-1SBG485C
XC7Z030-1SBG485C by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 0.95-1.05 V. With 485 terminals in a GRID ARRAY package, it's ideal for applications requiring high performance and integration in compact spaces.
XC7Z020-1CLG484I
XC7Z020-1CLG484I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. This low profile chip in grid array package is ideal for various applications requiring high performance and compact design.
XC7Z020-2CLG400I
XC7Z020-2CLG400I by Xilinx is a 400-terminal System on Chip with CMOS technology. Operating b/w -40 to 100 °C, it has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring low-profile, fine-pitch grid arrays in plastic/epoxy packages.
XC7Z020-1CLG400C
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; JESD-609 Code: e1;
XC7Z030-2FFG676I
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
XC7Z020-L1CLG484I
XC7Z020-L1CLG484I by Xilinx is a CMOS technology System on Chip (SoC) with 484 terminals. It operates at a voltage range of 0.95V to 1.05V and has a max seated height of 1.6mm. This versatile IC is commonly used in various applications requiring low profile, fine pitch grid array packages.
XC7Z010-1CLG225I
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
XC7Z010-2CLG400E
The Xilinx XC7Z010-2CLG400E is a System on Chip with 400 terminals in a low profile, fine pitch grid array package. It operates b/w 0-100°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact form factors.
XC7Z010-2CLG400I
XC7Z010-2CLG400I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.
XC7Z030-1SBG485I
XC7Z030-1SBG485I by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. With 485 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance processing capabilities.
XC7Z007S-1CLG400C
The Xilinx XC7Z007S-1CLG400C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch designs in the Other Function uPs,uCs & Peripheral ICs category.
XC7Z020-3CLG400E
The Xilinx XC7Z020-3CLG400E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.
XC7Z010-L1CLG400I
XC7Z010-L1CLG400I by Xilinx is a 400-terminal System on Chip with CMOS technology. It operates b/w -40°C to 100°C, with supply voltage ranging from 0.95V to 1.05V. This low-profile, fine-pitch IC is ideal for applications requiring high-performance computing in compact spaces.
XC7Z015-2CLG485I
Xilinx XC7Z015-2CLG485I is a CMOS System on Chip with 485 terminals in a low profile grid array package. Operating b/w -40 to 100 °C, it has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high-performance computing in compact spaces.
XC7Z020-L1CLG400I
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.05 V;
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