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XC7Z030-3FBG484E

Xilinx

XC7Z030-3FBG484E by Xilinx

The Xilinx XC7Z030-3FBG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 484 terminals in a square grid array package, it's ideal for various applications requiring high-performance microprocessors and peripheral ICs.

Median Price

$449.750

Lifecycle Status

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Digiode

USA . 115 parts In-Stock

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Nova Conductors

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AZTECH Wire

Italy . 306 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

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Modulus Dynamics

Lithuania . 1,345 parts In-Stock

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Texas Native Microelectronics

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Advanced Electronics

New Zealand . 1,074 parts In-Stock

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Kenton Components

USA . 840 parts In-Stock

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Vigor

Singapore . 198 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

USA . 2,413 parts In-Stock

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Qasali Group International

UK . 723 parts In-Stock

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Semicontronic

India . 3 parts In-Stock

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Lucentia Tech

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Overview

Experience the power of innovation with the Xilinx XC7Z030-3FBG484E. Crafted by the industry-leading manufacturer Xilinx, this cutting-edge System on Chip offers unparalleled quality and performance in the realm of Other Function uPs, uCs & Peripheral ICs. From its compact package body material to its advanced CMOS technology, this product is designed to exceed expectations. Elevate your projects with seamless integration, maximum supply voltage of 1.05V, and a temperature range of 0-100°C. Discover endless possibilities with the XC7Z030-3FBG484E and unlock a world of potential for your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components due to its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic circuits.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage allows for flexibility in power requirements.

Package Shape: SQUARE

The square shape makes it easy to integrate into various electronic designs.

No. of Terminals: 484

Having a large number of terminals allows for more connectivity options and functionality.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and organized layout for the ICs.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage helps optimize power consumption in electronic devices.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures the reliability of the IC in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for the IC to function in cold environments.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to connect the IC in circuit designs.

Maximum Seated Height: 2.54 mm

The low seated height allows for a slim and compact design for electronic devices.

Width: 23 mm

The standard width makes it compatible with various board layouts and designs.

Length: 23 mm

The standard length provides a balanced size for the IC in electronic applications.

Peripheral IC Type: SYSTEM ON CHIP

The System on Chip design integrates multiple functions into a single IC, reducing the need for additional components.

Technology: CMOS

CMOS technology is known for its low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: BALL

The ball terminal form allows for easier and more reliable connections in the assembly process.

Nominal Supply Voltage: 1 V

The nominal supply voltage provides a stable operating voltage for the IC.

Terminal Pitch: 1 mm

The small terminal pitch allows for high-density packaging and more terminals in a limited space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z030-3FBG484E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B484

Length:

23 mm

No. of Terminals:

484

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA484,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

XC7Z030-3FBG484E Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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