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66AK2G12ABY60

Texas Instruments

66AK2G12ABY60 by Texas Instruments

The Texas Instruments 66AK2G12ABY60 is a System on Chip with CMOS technology. It operates b/w 0-70°C, has a supply voltage range of 0.855-0.945V, and features a grid array package with 625 terminals. Ideal for applications requiring low profile, fine pitch ICs in commercial-grade environments.

Median Price

$42.580

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,060 parts In-Stock

1+ parts

$42.580

100+ parts

$37.849

1k+ parts

$27.830

10k+ parts

-

5,060

$42.580

$37.849

$27.830

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,611 parts In-Stock

1+ parts

$40.451

100+ parts

-

1k+ parts

-

10k+ parts

-

1,611

$40.451

-

-

-

Nova Conductors

Japan . 36 parts In-Stock

1+ parts

$42.230

100+ parts

-

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-

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36

$42.230

-

-

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Vyrian

USA . 3,758 parts In-Stock

1+ parts

-

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-

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3,758

-

-

-

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VNN

France . 951 parts In-Stock

1+ parts

-

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951

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Bristol Electronics

USA . 60 parts In-Stock

1+ parts

-

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60

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Atlantic Semiconductor

USA . 60 parts In-Stock

1+ parts

-

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-

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60

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 44 parts In-Stock

1+ parts

$17.690

100+ parts

-

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-

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44

$17.690

-

-

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Corohmni

South Africa . 250 parts In-Stock

1+ parts

$22.312

100+ parts

-

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250

$22.312

-

-

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Semicontronic

India . 4,591 parts In-Stock

1+ parts

$36.190

100+ parts

$35.285

1k+ parts

$35.104

10k+ parts

-

4,591

$36.190

$35.285

$35.104

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Ampacity Inc.

Singapore . 4,573 parts In-Stock

1+ parts

$36.190

100+ parts

-

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4,573

$36.190

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Corphita

USA . 395 parts In-Stock

1+ parts

$38.322

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-

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395

$38.322

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$40.009

100+ parts

$36.408

1k+ parts

$32.807

10k+ parts

-

2,000

$40.009

$36.408

$32.807

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Continental Prestige Electronics

USA . 6,130 parts In-Stock

1+ parts

$42.230

100+ parts

-

1k+ parts

-

10k+ parts

$41.385

6,130

$42.230

-

-

$41.385

Netroflash

USA . 100 parts In-Stock

1+ parts

$42.230

100+ parts

$41.385

1k+ parts

-

10k+ parts

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100

$42.230

$41.385

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Parana Technologies

USA . 326 parts In-Stock

1+ parts

$48.703

100+ parts

$4,522.856

1k+ parts

$43.833

10k+ parts

-

326

$48.703

$4,522.856

$43.833

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DigiPath Technology Company

USA . 2,301 parts In-Stock

1+ parts

$53.629

100+ parts

$49.338

1k+ parts

-

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2,301

$53.629

$49.338

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ChromeModa Solutions

Germany . 6,130 parts In-Stock

1+ parts

$54.723

100+ parts

$44.873

1k+ parts

-

10k+ parts

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6,130

$54.723

$44.873

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IDEA Electronic Components Group

UK . 1,314 parts In-Stock

1+ parts

$54.723

100+ parts

$51.987

1k+ parts

$49.251

10k+ parts

-

1,314

$54.723

$51.987

$49.251

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Argo Parts USA

USA . 3,177 parts In-Stock

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3,177

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Overview

Unlock the power of cutting-edge technology with the 66AK2G12ABY60 by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments brings unmatched quality and reliability to the table. The 66AK2G12ABY60 falls under the category of Other Function uPs,uCs & Peripheral ICs, making it versatile for a wide range of applications. From industrial automation to automotive systems, this product offers exceptional value and benefits to customers looking for top-notch performance and efficiency. Experience next-level innovation with the 66AK2G12ABY60 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable and long-lasting applications.

Surface Mount: YES

Surface mount technology allows for efficient assembly, saving space and enabling high-density designs.

Maximum Supply Voltage: 0.945 V

Optimal maximum supply voltage for stable operation without risking damage.

Package Shape: SQUARE

Square shape is space-efficient and promotes easy routing of traces on a PCB.

No. of Terminals: 625

High number of terminals allows for versatile connectivity options and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array packaging with low profile and fine pitch enhances electrical performance and thermal management.

Minimum Supply Voltage: 0.855 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for use in cold environments without performance degradation.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and assembly.

Maximum Seated Height: 1.56 mm

Low seated height saves space and enables compact designs.

Width: 21 mm

Optimal width for balance between size and functionality.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for reliable soldering during assembly process.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and component reliability.

Length: 21 mm

Balanced length for overall product design and layout.

Temperature Grade: COMMERCIAL

Suitable for commercial applications where performance and reliability are key factors.

Peripheral IC Type: SYSTEM ON CHIP

Integration of multiple functions into a single chip enhances efficiency and reduces board space.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminal form enables easy and reliable connections during assembly.

Nominal Supply Voltage: 0.9 V

Stable nominal supply voltage for consistent performance.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting and compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the level of moisture sensitivity during storage and assembly, ensuring proper handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs 66AK2G12ABY60 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B625

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

625

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.56 mm

Maximum Supply Voltage:

.945 V

Minimum Supply Voltage:

.855 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

66AK2G12ABY60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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