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66AK2G12ABYA100

Texas Instruments

66AK2G12ABYA100 by Texas Instruments

The Texas Instruments 66AK2G12ABYA100 is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, with supply voltage ranging from 0.95V to 1.05V. With 625 terminals in a low profile grid array package, it's ideal for industrial applications requiring high performance and compact design.

Median Price

$80.788

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 518 parts In-Stock

1+ parts

$63.657

100+ parts

$56.584

1k+ parts

$41.606

10k+ parts

-

518

$63.657

$56.584

$41.606

-

Mouser Electronics

USA . 16 parts In-Stock

1+ parts

$97.920

100+ parts

$74.830

1k+ parts

-

10k+ parts

-

16

$97.920

$74.830

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 991 parts In-Stock

1+ parts

$60.474

100+ parts

-

1k+ parts

-

10k+ parts

-

991

$60.474

-

-

-

Vyrian

USA . 5,707 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,707

-

-

-

-

Component Sense

UK . 1,215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,215

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 38 parts In-Stock

1+ parts

$28.460

100+ parts

-

1k+ parts

-

10k+ parts

-

38

$28.460

-

-

-

Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$36.402

100+ parts

$33.126

1k+ parts

$29.850

10k+ parts

-

900

$36.402

$33.126

$29.850

-

Native Components

USA . 1 parts In-Stock

1+ parts

$42.798

100+ parts

-

1k+ parts

-

10k+ parts

$41.086

1

$42.798

-

-

$41.086

Parana Technologies

USA . 819 parts In-Stock

1+ parts

$46.785

100+ parts

-

1k+ parts

-

10k+ parts

-

819

$46.785

-

-

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Northwest PG Solutions

USA . 2,031 parts In-Stock

1+ parts

$47.078

100+ parts

-

1k+ parts

-

10k+ parts

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2,031

$47.078

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-

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DigiPath Technology Company

USA . 847 parts In-Stock

1+ parts

$51.516

100+ parts

$47.394

1k+ parts

-

10k+ parts

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847

$51.516

$47.394

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-

IDEA Electronic Components Group

UK . 2,164 parts In-Stock

1+ parts

$52.567

100+ parts

$49.939

1k+ parts

$47.310

10k+ parts

-

2,164

$52.567

$49.939

$47.310

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ChromeModa Solutions

Germany . 401 parts In-Stock

1+ parts

$52.567

100+ parts

$43.105

1k+ parts

-

10k+ parts

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401

$52.567

$43.105

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Corphita

USA . 2,472 parts In-Stock

1+ parts

$57.291

100+ parts

-

1k+ parts

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10k+ parts

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2,472

$57.291

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-

-

Overview

Experience unparalleled performance and efficiency with the 66AK2G12ABYA100 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge solutions in the category of Other Function uPs, uCs & Peripheral ICs. This versatile product is designed to meet the demands of industrial applications, offering customers the value of seamless integration and optimal functionality. Elevate your projects with Texas Instruments and unlock a world of possibilities with the 66AK2G12ABYA100.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the internal components of the IC, ensuring reliability in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly on PCBs, saving space and enabling automated manufacturing processes.

Maximum Supply Voltage: 1.05 V

Operating at a maximum supply voltage of 1.05 V helps in minimizing power consumption and heat dissipation, making the product energy-efficient.

Package Shape: SQUARE

Square package shape facilitates uniform heat dissipation and efficient layout on circuit boards, optimizing the overall performance of the IC.

No. of Terminals: 625

With a high number of terminals, this IC offers increased connectivity options and integration possibilities for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enables high-density packaging, leading to compact designs and improved signal integrity.

Minimum Supply Voltage: 0.95 V

The ability to operate at a minimum supply voltage of 0.95 V allows for efficient power management and extended battery life in portable devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this IC is suitable for demanding industrial environments where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance in cold environments or during startup conditions.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper terminal finish offers excellent solderability and resistance to corrosion, enhancing the overall reliability of the IC connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, making it easier to design and assemble complex circuits with this IC.

Maximum Seated Height: 1.56 mm

The low maximum seated height of 1.56 mm allows for slim and compact device designs, ideal for space-constrained applications.

Width: 21 mm

A width of 21 mm provides a balance between compactness and accessibility for handling and mounting the IC on PCBs.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reflow processes during PCB assembly, reducing the risk of thermal damage.

Peak Reflow Temperature °C: 260

Operating at a peak reflow temperature of 260°C ensures reliable solder joints and assembly integrity, critical for the long-term performance of the IC.

Length: 21 mm

A length of 21 mm complements the square package shape, offering a compact form factor that is conducive to efficient PCB layout and design.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures that the IC can withstand harsh environmental conditions and stringent reliability requirements in industrial applications.

Peripheral IC Type: SYSTEM ON CHIP

Being a system-on-chip peripheral IC type, this product provides integrated functionality and reduced system complexity, leading to cost savings and improved performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making this IC suitable for diverse applications.

Terminal Form: BALL

Ball terminal form enables easy and reliable connections during assembly, ensuring robust electrical contacts and enhancing the overall durability of the IC.

Nominal Supply Voltage: 1 V

Operating at a nominal supply voltage of 1 V strikes a balance between performance and power efficiency, making this IC suitable for various voltage-sensitive applications.

Terminal Pitch: 0.8 mm

A fine terminal pitch of 0.8 mm allows for high-density mounting and precise connection of the IC, enabling intricate circuit designs and optimized signal routing.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that proper handling and storage procedures are required to prevent moisture-related damage during assembly and operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs 66AK2G12ABYA100 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B625

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

625

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.56 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

66AK2G12ABYA100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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