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66AK2G12ABY100

Texas Instruments

66AK2G12ABY100 by Texas Instruments

The Texas Instruments 66AK2G12ABY100 is a System on Chip with CMOS technology. It operates b/w 0-70°C, with supply voltage range of 0.95-1.05V. With 625 terminals in a low profile grid array package, it's ideal for various commercial applications requiring high performance and integration capabilities.

Median Price

$55.141

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 823 parts In-Stock

1+ parts

$55.141

100+ parts

$49.014

1k+ parts

$36.040

10k+ parts

-

823

$55.141

$49.014

$36.040

-

Mouser Electronics

USA . 21 parts In-Stock

1+ parts

$78.310

100+ parts

$59.320

1k+ parts

$58.160

10k+ parts

-

21

$78.310

$59.320

$58.160

-

Chip1Stop

Japan . 120 parts In-Stock

1+ parts

-

100+ parts

$43.400

1k+ parts

-

10k+ parts

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120

-

$43.400

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$47.980

100+ parts

-

1k+ parts

-

10k+ parts

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10

$47.980

-

-

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Digiode

USA . 1,495 parts In-Stock

1+ parts

$52.384

100+ parts

-

1k+ parts

-

10k+ parts

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1,495

$52.384

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-

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VNN

France . 5,655 parts In-Stock

1+ parts

-

100+ parts

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5,655

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-

-

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Vyrian

USA . 4,195 parts In-Stock

1+ parts

-

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4,195

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-

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Chip Stock

USA . 269 parts In-Stock

1+ parts

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269

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 561 parts In-Stock

1+ parts

$17.682

100+ parts

-

1k+ parts

-

10k+ parts

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561

$17.682

-

-

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Ampacity Inc.

Singapore . 328 parts In-Stock

1+ parts

$36.890

100+ parts

-

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328

$36.890

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-

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Netroflash

USA . 500 parts In-Stock

1+ parts

$47.980

100+ parts

-

1k+ parts

$45.581

10k+ parts

$44.621

500

$47.980

-

$45.581

$44.621

Corphita

USA . 2,859 parts In-Stock

1+ parts

$49.627

100+ parts

-

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10k+ parts

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2,859

$49.627

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-

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Parana Technologies

USA . 2,363 parts In-Stock

1+ parts

$50.807

100+ parts

$4,718.158

1k+ parts

$45.726

10k+ parts

-

2,363

$50.807

$4,718.158

$45.726

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DigiPath Technology Company

USA . 1,043 parts In-Stock

1+ parts

$55.944

100+ parts

-

1k+ parts

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10k+ parts

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1,043

$55.944

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-

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ChromeModa Solutions

Germany . 6,601 parts In-Stock

1+ parts

$57.086

100+ parts

$46.811

1k+ parts

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10k+ parts

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6,601

$57.086

$46.811

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IDEA Electronic Components Group

UK . 1,197 parts In-Stock

1+ parts

$57.086

100+ parts

$54.232

1k+ parts

$51.377

10k+ parts

-

1,197

$57.086

$54.232

$51.377

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Corohmni

South Africa . 4,948 parts In-Stock

1+ parts

$71.436

100+ parts

-

1k+ parts

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10k+ parts

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4,948

$71.436

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Overview

Experience the next level of performance with the Texas Instruments 66AK2G12ABY100. Crafted by a renowned manufacturer, this versatile system on chip offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides customers with exceptional value, benefits, and advantages. Elevate your projects with the innovative technology and cutting-edge features of the 66AK2G12ABY100.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good protection and insulation for the components inside, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology makes it easier to assemble and integrate the product onto circuit boards, saving space and simplifying production processes.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05 V ensures safe operation of the product without risking damage from high voltage input.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, optimizing layout and design.

No. of Terminals: 625

With a high number of terminals, this product offers increased connectivity and functionality for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style provides a compact and high-density solution for complex electronic systems.

Minimum Supply Voltage: 0.95 V

The minimum supply voltage of 0.95 V allows for efficient power consumption and operation at lower voltage levels, potentially saving energy.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product is suitable for a wide range of environmental conditions and applications.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance even in cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity and resistance to corrosion, prolonging the lifespan of the product.

Terminal Position: BOTTOM

Having the terminals positioned at the bottom allows for easy access and connectivity with external components or circuitry.

Maximum Seated Height: 1.56 mm

The low maximum seated height of 1.56 mm enables a slim and compact design, suitable for space-constrained applications.

Width: 21 mm

The width of 21 mm contributes to the overall size and form factor of the product, making it suitable for specific design requirements.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature ensures proper soldering and mounting of the product during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures effective soldering and bonding of the components onto the circuit board.

Length: 21 mm

The length of 21 mm complements the width and height dimensions, providing a compact and balanced form factor for the product.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this product meets standard temperature requirements for typical operating environments.

Peripheral IC Type: SYSTEM ON CHIP

As a system-on-chip peripheral IC type, this product integrates multiple functions and features in a single chip, reducing complexity and improving efficiency.

Technology: CMOS

Using CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: BALL

The ball terminal form provides reliable connections and solder joints for secure and stable operation of the product.

Nominal Supply Voltage: 1 V

With a nominal supply voltage of 1 V, this product operates efficiently and effectively within the specified voltage range.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8 mm allows for precise and compact integration of the product onto circuit boards, ensuring reliable connectivity.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product has a moderate level of moisture sensitivity, indicating proper handling and storage requirements to prevent damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs 66AK2G12ABY100 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B625

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

625

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.56 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

66AK2G12ABY100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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