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66AK2G12ABYA60

Texas Instruments

66AK2G12ABYA60 by Texas Instruments

The Texas Instruments 66AK2G12ABYA60 is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.855V to 0.945V. With 625 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring low profile and fine pitch components.

Median Price

$66.368

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 187 parts In-Stock

1+ parts

$51.096

100+ parts

$45.419

1k+ parts

$33.396

10k+ parts

-

187

$51.096

$45.419

$33.396

-

Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$81.640

100+ parts

$61.760

1k+ parts

$60.830

10k+ parts

-

2

$81.640

$61.760

$60.830

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$38.157

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$38.157

-

-

-

Digiode

USA . 3,210 parts In-Stock

1+ parts

$48.541

100+ parts

-

1k+ parts

-

10k+ parts

-

3,210

$48.541

-

-

-

Vyrian

USA . 2,145 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,145

-

-

-

-

VNN

France . 1,359 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,359

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 556 parts In-Stock

1+ parts

$6.679

100+ parts

-

1k+ parts

-

10k+ parts

-

556

$6.679

-

-

-

Parana Technologies

USA . 1,740 parts In-Stock

1+ parts

$30.460

100+ parts

-

1k+ parts

$69.105

10k+ parts

-

1,740

$30.460

-

$69.105

-

ChromeModa Solutions

Germany . 3,551 parts In-Stock

1+ parts

$34.225

100+ parts

$28.064

1k+ parts

-

10k+ parts

-

3,551

$34.225

$28.064

-

-

IDEA Electronic Components Group

UK . 2,310 parts In-Stock

1+ parts

$34.225

100+ parts

$32.514

1k+ parts

$30.802

10k+ parts

-

2,310

$34.225

$32.514

$30.802

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Corohmni

South Africa . 688 parts In-Stock

1+ parts

$35.470

100+ parts

-

1k+ parts

-

10k+ parts

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688

$35.470

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-

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$37.394

100+ parts

-

1k+ parts

$35.898

10k+ parts

-

50

$37.394

-

$35.898

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Continental Prestige Electronics

USA . 3,735 parts In-Stock

1+ parts

$38.157

100+ parts

-

1k+ parts

-

10k+ parts

$37.394

3,735

$38.157

-

-

$37.394

Ampacity Inc.

Singapore . 43 parts In-Stock

1+ parts

$43.430

100+ parts

-

1k+ parts

-

10k+ parts

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43

$43.430

-

-

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Corphita

USA . 4,726 parts In-Stock

1+ parts

$45.986

100+ parts

-

1k+ parts

-

10k+ parts

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4,726

$45.986

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,000

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-

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Argo Parts USA

USA . 2,442 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,442

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-

-

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DigiPath Technology Company

USA . 1,369 parts In-Stock

1+ parts

-

100+ parts

$30.857

1k+ parts

-

10k+ parts

-

1,369

-

$30.857

-

-

Overview

Experience exceptional performance and reliability with the Texas Instruments 66AK2G12ABYA60. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Other Function uP, uCs & Peripheral ICs that are perfect for a wide range of applications. This innovative product offers unmatched value, benefits, and advantages to customers looking for cutting-edge technology without compromising on quality. Upgrade your projects with the 66AK2G12ABYA60 and discover a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for electronic devices.

Surface Mount: YES

This feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 0.945 V

With a high maximum supply voltage, this product can handle various power requirements, enhancing its versatility.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space in electronic devices.

No. of Terminals: 625

The high number of terminals allows for multiple connections, making this product suitable for complex circuitry applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers a high level of integration and connectivity, enhancing performance.

Minimum Supply Voltage: 0.855 V

This low minimum supply voltage ensures efficient power consumption, making this product energy-efficient.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows this product to withstand harsh environmental conditions, increasing its reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures this product can function in cold environments, expanding its usability.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper offers excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position simplifies connections and facilitates circuit board layout, improving overall design efficiency.

Maximum Seated Height: 1.56 mm

The low maximum seated height minimizes the overall profile of the product, making it suitable for compact electronic devices.

Width: 21 mm

The moderate width of 21 mm provides a balance between space-saving design and sufficient surface area for terminal connections.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes the risk of thermal damage during assembly, ensuring product integrity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering and bonding, ensuring secure connections.

Length: 21 mm

The length of 21 mm offers a compact form factor, ideal for space-constrained electronic applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures this product can operate in demanding industrial environments, making it a reliable choice for industrial applications.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip peripheral IC type integrates multiple functions into a single chip, simplifying system design and reducing overall cost.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, enhancing its performance and reliability.

Terminal Form: BALL

The ball terminal form provides secure connections and high contact reliability, ensuring stable performance in various applications.

Nominal Supply Voltage: 0.9 V

The nominal supply voltage of 0.9 V offers a balance between power efficiency and performance, making this product suitable for a wide range of applications.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8 mm allows for high-density mounting, maximizing space utilization on circuit boards.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this product has moderate sensitivity to moisture, requiring standard handling and storage procedures.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs 66AK2G12ABYA60 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B625

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

625

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.56 mm

Maximum Supply Voltage:

.945 V

Minimum Supply Voltage:

.855 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

66AK2G12ABYA60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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