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AM4378BZDN100

Texas Instruments

AM4378BZDN100 by Texas Instruments

AM4378BZDN100 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w 0-90°C with supply voltage range of 1.272-1.378V, making it ideal for embedded applications requiring high performance and compact design.

Median Price

$17.742

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 352 parts In-Stock

1+ parts

$14.125

100+ parts

$12.338

1k+ parts

$8.509

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352

$14.125

$12.338

$8.509

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Verical

USA . 73 parts In-Stock

1+ parts

$17.742

100+ parts

$12.304

1k+ parts

$11.720

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73

$17.742

$12.304

$11.720

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Chip1Stop

Japan . 73 parts In-Stock

1+ parts

$18.500

100+ parts

$13.600

1k+ parts

$12.200

10k+ parts

$11.000

73

$18.500

$13.600

$12.200

$11.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,773 parts In-Stock

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$13.419

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$13.419

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Nova Conductors

Japan . 50 parts In-Stock

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$14.800

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50

$14.800

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Vyrian

USA . 4,504 parts In-Stock

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4,504

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VNN

France . 1,692 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 171 parts In-Stock

1+ parts

$12.010

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171

$12.010

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Semicontronic

India . 171 parts In-Stock

1+ parts

$12.010

100+ parts

$11.710

1k+ parts

$11.650

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171

$12.010

$11.710

$11.650

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AZTECH Wire

Italy . 762 parts In-Stock

1+ parts

$12.321

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$12.321

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Corphita

USA . 1,642 parts In-Stock

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$12.712

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$12.712

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Corohmni

South Africa . 513 parts In-Stock

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$14.800

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$14.800

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Continental Prestige Electronics

USA . 6,997 parts In-Stock

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$14.800

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$14.504

6,997

$14.800

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$14.504

Parana Technologies

USA . 822 parts In-Stock

1+ parts

$24.975

100+ parts

$2,319.324

1k+ parts

$22.478

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822

$24.975

$2,319.324

$22.478

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DigiPath Technology Company

USA . 1,576 parts In-Stock

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$27.501

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1,576

$27.501

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IDEA Electronic Components Group

UK . 1,269 parts In-Stock

1+ parts

$28.062

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$26.659

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$25.256

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1,269

$28.062

$26.659

$25.256

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ChromeModa Solutions

Germany . 342 parts In-Stock

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$28.062

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$23.011

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342

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$23.011

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A-Z Elektronik GmbH

Germany . 6,056 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,037 parts In-Stock

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Argo Parts USA

USA . 3,292 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

USA . 403 parts In-Stock

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Overview

Elevate your electronic designs with the AM4378BZDN100 by Texas Instruments, a cutting-edge System on Chip that delivers unmatched performance and reliability. With a package body material of PLASTIC/EPOXY and a terminal finish of TIN SILVER COPPER, this innovative technology offers a wide range of applications in the world of Other Function uPs,uCs & Peripheral ICs. From its low profile design to its high-quality construction, this product ensures seamless integration and maximum efficiency in your projects. Experience the value and benefits of Texas Instruments' superior craftsmanship with the AM4378BZDN100, where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient integration into circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.378 V

The high maximum supply voltage ensures compatibility with power sources, enhancing the versatility of the product.

Package Shape: SQUARE

The square shape offers a compact design, optimizing space utilization in electronic devices.

No. of Terminals: 491

The high number of terminals allows for multiple connections, enabling complex functionalities and capabilities.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a low-profile design with fine pitch, providing high-density integration and improved signal integrity.

Minimum Supply Voltage: 1.272 V

The low minimum supply voltage ensures efficient power consumption, making the product energy-efficient.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature allows for reliable performance in extreme environments or conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures functionality even in cold environments, expanding the product's range of use.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and maintenance, offering convenience in various applications.

Maximum Seated Height: 1.3 mm

The low maximum seated height allows for a slim profile, ideal for compact electronic designs.

Width: 17 mm

The width of 17mm offers a balanced size for easy integration into different electronic setups.

Maximum Time At Peak Reflow Temperature (s): 30

This quick reflow time of 30 seconds ensures efficient and reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables secure soldering connections for durable and robust performance.

Length: 17 mm

The length of 17mm provides a standard size for seamless integration into various electronic devices.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip design offers integrated functionality, reducing the need for additional components and simplifying system design.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections, enhancing the durability and longevity of the product.

Nominal Supply Voltage: 1.325 V

The nominal supply voltage of 1.325 V offers stable and consistent power delivery, ensuring reliable performance in different applications.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65mm allows for fine spacing between terminals, enabling high-density integration and compact designs.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates a moderate level of sensitivity to moisture, requiring standard handling procedures for optimal performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4378BZDN100 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.378 V

Minimum Supply Voltage:

1.272 V

Nominal Supply Voltage:

1.325 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4378BZDN100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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