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XCZU5EV-2SFVC784I

Xilinx

XCZU5EV-2SFVC784I by Xilinx

XCZU5EV-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

Median Price

$3,098.445

Lifecycle Status

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7

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1k+

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Mouser Electronics

USA . 3 parts In-Stock

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$3,032.220

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DigiKey

USA . 3 parts In-Stock

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Digiode

USA . 112 parts In-Stock

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$2,732.808

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VNN

France . 787 parts In-Stock

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$2,876.640

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Nova Conductors

Japan . 500 parts In-Stock

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$2,876.970

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Vyrian

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AZTECH Wire

Italy . 493 parts In-Stock

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$19.439

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Corohmni

South Africa . 31 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,683 parts In-Stock

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MARBEL Systems

Belgium . 200 parts In-Stock

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$60.319

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Modulus Dynamics

Lithuania . 124 parts In-Stock

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Texas Native Microelectronics

USA . 40 parts In-Stock

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$69.332

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Kenton Components

USA . 737 parts In-Stock

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Vigor

Singapore . 1 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 3 parts In-Stock

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Semicontronic

India . 3 parts In-Stock

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$2,372.009

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Corphita

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Argo Parts USA

USA . 4,044 parts In-Stock

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$2,876.970

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$2,848.200

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$2,819.431

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$2,790.661

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$2,790.661

Continental Prestige Electronics

USA . 447 parts In-Stock

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$2,876.970

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Authorized Procurement Solutions

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Supply Digital

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Qasali Group International

UK . 477 parts In-Stock

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Overview

Discover the power and innovation of the XCZU5EV-2SFVC784I by Xilinx, a cutting-edge microprocessor circuit that pushes the boundaries of technology. Designed with precision and expertise by Xilinx, this product offers unparalleled performance and reliability in various applications. From industrial automation to IoT devices, this versatile IC delivers exceptional value and benefits to customers looking for top-quality solutions. Embrace the future of technology with the XCZU5EV-2SFVC784I and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides good protection for the components inside, making this product durable and reliable.

Surface Mount: YES

Being surface mountable makes this product easy to integrate onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage allows for flexibility in power requirements, accommodating a variety of applications.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easy to handle, making this product compatible with standard assembly processes.

No. of Terminals: 784

With a high number of terminals, this product offers a wide range of connectivity options, enabling complex circuit designs.

Package Style (Meter): GRID ARRAY

The grid array package style provides excellent thermal performance and electrical connections, enhancing the overall performance of the product.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range allows this product to function reliably in extreme environments, increasing its versatility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage is close to the average voltage range used in many electronic devices, making this product compatible with a wide range of applications.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this product can withstand moderate exposure to moisture during storage or assembly, ensuring its performance and reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU5EV-2SFVC784I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B784

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU5EV-2SFVC784I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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