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XCZU7EV-2FFVC1156I

Xilinx

XCZU7EV-2FFVC1156I by Xilinx

The Xilinx XCZU7EV-2FFVC1156I is a CMOS microprocessor circuit with 1156 terminals in a grid array package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high-performance processing capabilities.

Median Price

$5,628.480

Lifecycle Status

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DigiKey

USA . 3 parts In-Stock

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Digiode

USA . 184 parts In-Stock

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$4,860.409

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VNN

France . 675 parts In-Stock

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$5,116.220

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Nova Conductors

Japan . 870 parts In-Stock

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Vyrian

USA . 4,051 parts In-Stock

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Chip Stock

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RLX Solution Inc.

Canada . 198 parts In-Stock

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Cyclops Electronics Ltd

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Microchip USA

USA . 1,526 parts In-Stock

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AZTECH Wire

Italy . 212 parts In-Stock

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$10.793

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Corohmni

South Africa . 265 parts In-Stock

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$24.959

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Modulus Dynamics

Lithuania . 1,319 parts In-Stock

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$58.226

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MARBEL Systems

Belgium . 3,353 parts In-Stock

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$72.825

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$69.912

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Texas Native Microelectronics

USA . 100 parts In-Stock

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$83.707

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$80.359

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$77.848

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Kenton Components

USA . 954 parts In-Stock

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$100.448

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$88.395

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One Stop Electronics

USA . 130 parts In-Stock

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$4,348.790

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Ampacity Inc.

Singapore . 130 parts In-Stock

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Semicontronic

India . 64 parts In-Stock

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$4,348.790

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$4,240.070

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$4,218.326

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Corphita

USA . 314 parts In-Stock

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$4,604.598

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Argo Parts USA

USA . 3,645 parts In-Stock

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$5,065.345

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$5,014.180

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$4,963.014

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$4,963.014

Continental Prestige Electronics

USA . 605 parts In-Stock

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$5,116.510

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$5,014.180

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Netroflash

USA . 50 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

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Qasali Group International

UK . 522 parts In-Stock

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$216.969

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$198.888

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A-Z Elektronik GmbH

Germany . 500 parts In-Stock

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Vigor

Singapore . 150 parts In-Stock

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RC Electronics

USA . 116 parts In-Stock

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Futuretech Components

Singapore . 100 parts In-Stock

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Overview

Unlock boundless possibilities with the XCZU7EV-2FFVC1156I by Xilinx, a leader in cutting-edge technology. This versatile microprocessor circuit offers unparalleled quality and reliability for a wide range of applications, from industrial automation to data processing. With its advanced features and industrial-grade components, this product ensures optimal performance in any environment. Experience the value and benefits of Xilinx's expertise in semiconductor innovation with the XCZU7EV-2FFVC1156I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the integrated circuits inside, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable makes this product easy to integrate onto PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage allows for flexibility in power input options, accommodating various system requirements.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the PCB, optimizing layout and design.

No. of Terminals: 1156

With a large number of terminals, this product supports complex circuit configurations and connectivity needs.

Package Style (Meter): GRID ARRAY

The grid array package style offers high density and improved thermal performance, making it suitable for high-performance applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance in various environmental conditions, including extreme cold temperatures.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of devices, making this product energy efficient and versatile.

Moisture Sensitivity Level (MSL): 4

With a MSL of 4, this product is suitable for reflow soldering processes and has a moderate level of moisture sensitivity, ensuring proper handling during assembly.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7EV-2FFVC1156I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU7EV-2FFVC1156I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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