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TMS320F28PLC84PNT

Texas Instruments

TMS320F28PLC84PNT by Texas Instruments

TMS320F28PLC84PNT by Texas Instruments is an 80-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 105°C, suitable for industrial applications. With a supply voltage range of 2.97-3.63V, it is designed for surface mount assembly in compact spaces.

Median Price

$11.773

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

USA . 7,628 parts In-Stock

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Digiode

USA . 3,502 parts In-Stock

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Holdelec - ElecDif-Pro

France . 104 parts In-Stock

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One Stop Electronics

USA . 1,386 parts In-Stock

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$5.000

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Continental Prestige Electronics

USA . 6,941 parts In-Stock

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$11.538

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Semicontronic

India . 1,335 parts In-Stock

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$12.000

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$11.700

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$11.640

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AZTECH Wire

Italy . 793 parts In-Stock

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$13.541

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$13.657

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$12.564

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$11.773

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$13.657

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Parana Technologies

USA . 1,284 parts In-Stock

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$21.016

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$21.247

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Ampacity Inc.

Singapore . 855 parts In-Stock

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$23.000

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DigiPath Technology Company

USA . 1,574 parts In-Stock

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ChromeModa Solutions

Germany . 5,113 parts In-Stock

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$23.614

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$19.363

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IDEA Electronic Components Group

UK . 423 parts In-Stock

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$22.433

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Microchip USA

USA . 1,717 parts In-Stock

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$28.840

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$28.430

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$28.230

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$28.020

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$28.020

Corohmni

South Africa . 1,898 parts In-Stock

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$41.315

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Lixinc

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Authorized Procurement Solutions

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Corphita

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Argo Parts USA

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Netroflash

USA . 500 parts In-Stock

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$11.185

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$10.949

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$10.949

Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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Overview

Elevate your projects with the TMS320F28PLC84PNT by Texas Instruments, a top-tier manufacturer known for delivering high-quality products. This cutting-edge microprocessor circuit offers a wide range of applications in the industrial sector, providing unparalleled performance and reliability. With a nominal supply voltage of 3.3V and a maximum operating temperature of 105°C, this device ensures seamless functionality even in the most demanding environments. Experience the value and benefits that this innovative technology brings to your designs, setting you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product a good choice for long-term use.

Surface Mount: YES

With surface mount capability, this product is easy to install and saves valuable space on the PCB.

Maximum Supply Voltage: 3.63 V

Operating at a high supply voltage ensures reliable performance in a variety of applications.

Package Shape: SQUARE

The square shape allows for efficient use of space on the PCB, making the product versatile in design.

No. of Terminals: 80

With a high number of terminals, this product offers connectivity options for complex circuits.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This style provides a slim profile and precise placement on the PCB, enhancing overall design flexibility.

Minimum Supply Voltage: 2.97 V

The low minimum supply voltage allows for energy efficiency and optimal performance in low-power applications.

Maximum Operating Temperature: 105 °C

Operating at high temperatures ensures reliability in harsh environments, making this product suitable for industrial use.

Minimum Operating Temperature: -40 °C

With a wide range of operating temperatures, this product is suitable for both extreme cold and hot conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal position offers stability and secure connection, making the product ideal for high vibration environments.

Maximum Seated Height: 1.6 mm

The low seated height allows for compact design and easy integration into tight spaces.

Width: 12 mm

The moderate width of the product enables easy PCB layout and efficient use of space.

Maximum Time At Peak Reflow Temperature: 30s

With a quick reflow time, this product is easy to assemble and reduces production time.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature ensures proper soldering and long-term durability of the product.

Length: 12 mm

The moderate length of the product allows for versatility in design and easy integration into various applications.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand harsh conditions and ensure reliable operation.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

With a microprocessor circuit, this product offers advanced functionality and processing capabilities.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high-speed operation, making the product efficient and reliable.

Terminal Form: GULL WING

The gull-wing terminal form offers secure connection and easy soldering, enhancing overall reliability of the product.

Nominal Supply Voltage: 3.3 V

Operating at a stable supply voltage ensures consistent performance in various applications.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and flexibility in PCB design.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, this product is resistant to moisture and suitable for use in diverse environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320F28PLC84PNT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320F28PLC84PNT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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