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TMS320DM369ZCEDF

Texas Instruments

TMS320DM369ZCEDF by Texas Instruments

TMS320DM369ZCEDF by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating at temperatures from -40 to 85°C. It features 32768 RAM words, a 32-bit external data bus width, and supports Ethernet, I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile package with fine pitch grid array style.

Median Price

$35.011

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 640 parts In-Stock

1+ parts

$35.011

100+ parts

$31.121

1k+ parts

$22.883

10k+ parts

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640

$35.011

$31.121

$22.883

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$29.691

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500

$29.691

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Digiode

USA . 766 parts In-Stock

1+ parts

$33.260

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766

$33.260

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Vyrian

USA . 6,663 parts In-Stock

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6,663

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Chip Stock

USA . 2,682 parts In-Stock

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2,682

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Distributors (Availability)

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AZTECH Wire

Italy . 291 parts In-Stock

1+ parts

$18.567

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291

$18.567

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Continental Prestige Electronics

USA . 788 parts In-Stock

1+ parts

$29.691

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$29.097

788

$29.691

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-

$29.097

Ampacity Inc.

Singapore . 379 parts In-Stock

1+ parts

$29.760

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379

$29.760

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Corphita

USA . 1,050 parts In-Stock

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$31.510

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$31.510

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Parana Technologies

USA . 2,192 parts In-Stock

1+ parts

$46.993

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2,192

$46.993

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DigiPath Technology Company

USA . 155 parts In-Stock

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$51.745

100+ parts

$47.605

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155

$51.745

$47.605

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ChromeModa Solutions

Germany . 2,912 parts In-Stock

1+ parts

$52.801

100+ parts

$43.297

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2,912

$52.801

$43.297

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IDEA Electronic Components Group

UK . 1,644 parts In-Stock

1+ parts

$52.801

100+ parts

$50.161

1k+ parts

$47.521

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1,644

$52.801

$50.161

$47.521

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Microchip USA

USA . 2,437 parts In-Stock

1+ parts

$80.130

100+ parts

$78.740

1k+ parts

$78.040

10k+ parts

$77.340

2,437

$80.130

$78.740

$78.040

$77.340

Corohmni

South Africa . 840 parts In-Stock

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$85.102

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840

$85.102

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Component Stockers USA

USA . 68 parts In-Stock

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$558.630

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68

$558.630

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Argo Parts USA

USA . 347 parts In-Stock

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347

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Overview

Experience the cutting-edge performance and reliability of the TMS320DM369ZCEDF by Texas Instruments, a top-tier manufacturer known for quality products. This versatile microprocessor circuit is perfect for a wide range of applications in the industrial sector, offering customers unparalleled value and benefits. With its advanced technology and flexible bus compatibility, the TMS320DM369ZCEDF delivers seamless integration and efficiency, making it an ideal choice for your project needs. Trust in Texas Instruments to provide you with the best solution for your electronic design requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Easy to install on PCBs, saving time and effort during assembly.

Bit Size: 32

High processing power and data handling capabilities.

Power Supplies (V): 1.35,1.8,3.3

Multiple voltage options for flexibility in power management.

No. of Terminals: 338

Sufficient connectivity options for interfacing with other components.

Maximum Operating Temperature: 85 °C

Suitable for operation in a wide range of environmental conditions.

RAM Words: 32768

Sufficient memory capacity for storing and processing data efficiently.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Advanced peripheral capabilities for enhanced functionality.

Technology: CMOS

Low power consumption and high noise immunity for reliable performance.

Bus Compatibility: ETHERNET; I2C; SPI; UART; USB

Versatile communication options for seamless integration with various devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM369ZCEDF attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Bus Compatibility:

ETHERNET; I2C; SPI; UART; USB

External Data Bus Width:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA338,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.35,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM369ZCEDF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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