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MCIMX6Q6AVT10ACR

NXP Semiconductors

MCIMX6Q6AVT10ACR by NXP Semiconductors

MCIMX6Q6AVT10ACR by NXP Semiconductors is a SYSTEM ON CHIP with 624 terminals, operating at -40 to 125 °C. It has a supply voltage range of 1.35V to 1.5V and uses BALL terminal form for automotive applications.

Median Price

$101.559

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

MCIMX6Q6AVT10ACR by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 622 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Vyrian

USA . 8,561 parts In-Stock

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Digiode

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Chip Stock

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Anansix

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Martec Srl

Italy . 1,725 parts In-Stock

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Bristol Electronics

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USA . 622 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 650 parts In-Stock

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$9.119

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Ampacity Inc.

Singapore . 160 parts In-Stock

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Aztec Data Supply Inc.

USA . 126 parts In-Stock

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Corohmni

South Africa . 355 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 443 parts In-Stock

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$35.000

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$34.125

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$33.950

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Continental Prestige Electronics

USA . 6,413 parts In-Stock

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$99.528

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Microchip USA

USA . 1,754 parts In-Stock

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Argo Parts USA

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Netroflash

USA . 1,000 parts In-Stock

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$96.481

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Corphita

USA . 380 parts In-Stock

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Overview

Unlock the power of seamless integration with the MCIMX6Q6AVT10ACR by NXP Semiconductors. Designed with cutting-edge technology, this System on Chip offers unmatched performance and reliability for a wide range of applications. From automotive systems to industrial automation, this product delivers unparalleled value and efficiency. Trust in NXP Semiconductors' reputation for quality and innovation, and experience the benefits of superior connectivity and functionality with the MCIMX6Q6AVT10ACR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection to the internal components of the product.

Surface Mount: YES

Surface mount technology enables easy and efficient installation on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.5 V

The maximum supply voltage of 1.5 V ensures safe and stable operation within specified limits.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy integration into designs.

No. of Terminals: 624

The high number of terminals provides ample connectivity options for various applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style offers high density mounting and improved signal integrity.

Minimum Supply Voltage: 1.35 V

The minimum supply voltage of 1.35 V ensures compatibility with low voltage applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows for reliable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures operation in a wide range of temperature conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper offers good conductivity and reliability for the connections.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to integrate into circuit board layouts and designs.

Maximum Seated Height: 2.16 mm

The maximum seated height of 2.16 mm allows for slim and compact designs.

Width: 21 mm

The width of 21 mm provides a balance between space-saving and ease of handling.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum time at peak reflow temperature of 40 seconds, it ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures reliable and secure soldering connections.

Length: 21 mm

The length of 21 mm offers a compact form factor suitable for various device applications.

Temperature Grade: AUTOMOTIVE

Being automotive-grade ensures reliability and durability for use in automotive electronic systems.

Peripheral IC Type: SYSTEM ON CHIP

The system on chip peripheral IC type offers integrated functionality, reducing the need for external components.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for efficient operation.

Terminal Form: BALL

The ball terminal form facilitates easy soldering and reliable connections during installation.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm allows for high-density mounting and compact PCB designs.

Moisture Sensitivity Level (MSL): 3

With a MSL of 3, the product can withstand moderate exposure to moisture during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6Q6AVT10ACR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6Q6AVT10ACR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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