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XCZU7EG-3FFVC1156E

Xilinx

XCZU7EG-3FFVC1156E by Xilinx

XCZU7EG-3FFVC1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.873-0.927 V. This GRID ARRAY package is ideal for applications requiring high-performance processing in compact form factors.

Median Price

$5,808.947

Lifecycle Status

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1k+

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Nova Conductors

Japan . 150 parts In-Stock

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Vyrian

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VNN

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Digiode

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Semicontronic

India . 639 parts In-Stock

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$3.000

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$2.925

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$2.910

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AZTECH Wire

Italy . 318 parts In-Stock

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One Stop Electronics

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$21.900

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$19.929

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$17.958

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Ampacity Inc.

Singapore . 1,259 parts In-Stock

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MARBEL Systems

Belgium . 3,522 parts In-Stock

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Texas Native Microelectronics

USA . 50 parts In-Stock

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Kenton Components

USA . 4,037 parts In-Stock

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Corohmni

South Africa . 709 parts In-Stock

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Qasali Group International

UK . 79 parts In-Stock

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Modulus Dynamics

Lithuania . 488 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

USA . 6,922 parts In-Stock

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Argo Parts USA

USA . 1,461 parts In-Stock

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$5,750.858

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$5,692.768

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$5,634.679

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Netroflash

USA . 100 parts In-Stock

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Corphita

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Vigor

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Supply Digital

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Overview

Unlock endless possibilities with the XCZU7EG-3FFVC1156E by Xilinx. This cutting-edge microprocessor circuit offers unparalleled quality and reliability, backed by Xilinx's reputation for innovation. Ideal for a wide range of applications, this versatile chip is a game-changer for any project. Experience seamless performance, efficiency, and flexibility like never before with the XCZU7EG-3FFVC1156E. Elevate your technology to new heights today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and ability to protect the internal circuits from external factors.

Surface Mount: YES

Surface mount technology allows for more compact and efficient designs, making this product suitable for applications where space is limited.

Maximum Supply Voltage: 0.927 V

This higher supply voltage allows for better performance and efficiency in handling power requirements.

Package Shape: RECTANGULAR

Rectangular packages are easier to handle and integrate into circuit designs, making the product user-friendly for engineers and technicians.

No. of Terminals: 1156

Having a large number of terminals allows for more connections and functionalities, making this product versatile for a wide range of applications.

Package Style: GRID ARRAY

Grid array packages provide better thermal and electrical performance, ensuring the reliability and durability of the product in various operating conditions.

Minimum Operating Temperature: 0 °C

This wide operating temperature range allows the product to function effectively even in extreme temperature environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This terminal finish combination provides both good electrical conductivity and corrosion resistance, ensuring long-term reliability and performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Having a microprocessor circuit allows for advanced processing capabilities, making the product suitable for complex applications that require high-speed data processing.

Technology: CMOS

CMOS technology is known for its low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Nominal Supply Voltage: 0.9 V

This nominal supply voltage is optimal for maintaining stable operation and efficient power consumption in the product.

Moisture Sensitivity Level (MSL): 4

A moisture sensitivity level of 4 indicates that the product is moderately sensitive to moisture, requiring proper handling and storage to prevent damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7EG-3FFVC1156E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.927 V

Minimum Supply Voltage:

.873 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU7EG-3FFVC1156E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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