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XC7Z045-2FFG900I

Xilinx

XC7Z045-2FFG900I by Xilinx

The Xilinx XC7Z045-2FFG900I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it's ideal for applications requiring high-performance processing in compact spaces.

Median Price

$2,955.990

Lifecycle Status

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Digiode

USA . 487 parts In-Stock

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VNN

France . 236 parts In-Stock

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Nova Conductors

Japan . 83 parts In-Stock

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Vyrian

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Touchstone Systems

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Cyclops Electronics Ltd

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EPE Components Inc.

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Bristol Electronics

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AZTECH Wire

Italy . 863 parts In-Stock

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$12.364

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Modulus Dynamics

Lithuania . 788 parts In-Stock

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MARBEL Systems

Belgium . 10 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 5,617 parts In-Stock

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$43.614

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Aztec Data Supply Inc.

USA . 152 parts In-Stock

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Corohmni

South Africa . 162 parts In-Stock

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Qasali Group International

UK . 500 parts In-Stock

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$98.132

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Advanced Electronics

New Zealand . 370 parts In-Stock

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$171.444

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iodParts Technologies Inc.

India . 40 parts In-Stock

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$229.900

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One Stop Electronics

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Ampacity Inc.

Singapore . 18 parts In-Stock

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Semicontronic

India . 18 parts In-Stock

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$2,449.775

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Corphita

USA . 229 parts In-Stock

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Argo Parts USA

USA . 4,884 parts In-Stock

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Continental Prestige Electronics

USA . 3,101 parts In-Stock

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Netroflash

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India . 15,100 parts In-Stock

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Lixinc

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Vigor

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RC Electronics

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Overview

Revolutionize your electronic designs with the XC7Z045-2FFG900I by Xilinx. As a leader in the industry, Xilinx is known for their high-quality products and cutting-edge technology. This versatile system on chip offers endless possibilities for applications in various industries. From automotive to aerospace, this product provides unmatched performance and reliability. Experience seamless integration and optimal functionality with the XC7Z045-2FFG900I, delivering exceptional value and benefits to customers looking for the best in class solution for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for various environments and applications.

Maximum Supply Voltage: 1.05 V

Allows for a higher supply voltage, providing flexibility in power input requirements.

Package Shape: SQUARE

Square package shape helps in efficient layout and space utilization on circuit boards.

Package Style (Meter): GRID ARRAY

Grid array package style offers enhanced connectivity and thermal performance.

Peripheral IC Type: SYSTEM ON CHIP

System on Chip design integrates multiple functionalities into a single chip, reducing complexity and improving efficiency.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology provides low power consumption and high noise immunity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z045-2FFG900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B900

Length:

27 mm

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA900,30X30,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.24 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z045-2FFG900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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