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FCM8531QY

Onsemi

FCM8531QY by Onsemi

FCM8531QY by Onsemi is a 32-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85 °C, compatible with I2C, SPI, and UART buses. This low-profile flatpack IC is ideal for industrial applications requiring a supply voltage of 4.5-5.5 V.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Chip Stock

USA . 21,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,905 parts In-Stock

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3,905

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Digiode

USA . 2,237 parts In-Stock

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2,237

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Vyrian

USA . 534 parts In-Stock

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534

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Nova Conductors

Japan . 48 parts In-Stock

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48

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Distributors (Availability)

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Ampacity Inc.

Singapore . 928 parts In-Stock

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$5.000

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928

$5.000

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Semicontronic

India . 1,389 parts In-Stock

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$6.000

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$5.850

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$5.820

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1,389

$6.000

$5.850

$5.820

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AZTECH Wire

Italy . 769 parts In-Stock

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$18.893

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769

$18.893

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Advanced Electronics

New Zealand . 15 parts In-Stock

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$39.904

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$37.909

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$37.909

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15

$39.904

$37.909

$37.909

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Aztec Data Supply Inc.

USA . 218 parts In-Stock

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$41.570

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218

$41.570

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A-Z Elektronik GmbH

Germany . 6,906 parts In-Stock

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SupplyDigital Components

Austria . 6,138 parts In-Stock

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Continental Prestige Electronics

USA . 5,888 parts In-Stock

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Problanco Electronics

Mexico . 5,495 parts In-Stock

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Argo Parts USA

USA . 4,612 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,604 parts In-Stock

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TANS Electronics

Latvia . 3,341 parts In-Stock

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Corphita

USA . 2,678 parts In-Stock

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Kulean Microsystems

USA . 1,824 parts In-Stock

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Microchip USA

USA . 1,653 parts In-Stock

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Infinite Electronics LLP (Excess)

. 1,338 parts In-Stock

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1,338

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Corohmni

South Africa . 280 parts In-Stock

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280

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UHIMA Technologies

Türkiye . 122 parts In-Stock

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Supply Digital

USA . 98 parts In-Stock

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Kepictronics

USA . 93 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Discover the FCM8531QY by Onsemi, a cutting-edge peripheral IC that promises unmatched quality and reliability. Manufactured by industry leader Onsemi, this product is designed for a wide range of applications in the electronics industry. With advanced technology and a durable design, the FCM8531QY ensures smooth operation and seamless integration into any project. Experience the value and benefits of this top-tier product, providing customers with a superior performance that exceeds expectations. Unlock new possibilities with the FCM8531QY by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to environmental factors, ensuring reliability in various operating conditions.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly processes in electronic devices, saving space and reducing production costs.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power sources, making it versatile for different applications.

No. of Terminals: 32

Having a good number of terminals provides flexibility in connecting to other components, enabling complex functionality and communication.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this product to perform reliably in industrial environments with elevated heat levels.

Width: 7 mm

The compact width of 7 mm contributes to saving space on PCBs, enabling more components to be integrated into a smaller area.

Bus Compatibility: I2C; SPI; UART

Compatibility with multiple bus protocols such as I2C, SPI, and UART allows for easy integration with various systems and devices, enhancing connectivity options.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs FCM8531QY attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

Bus Compatibility:

I2C; SPI; UART

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

FCM8531QY Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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