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FCM8531RQY

Onsemi

FCM8531RQY by Onsemi

FCM8531RQY by Onsemi is a 32-terminal MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, compatible with I2C, SPI, UART buses. Ideal for industrial applications requiring low profile FLATPACK package and 4.5-5.5 V supply voltage range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,955 parts In-Stock

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2,955

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Vyrian

USA . 658 parts In-Stock

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658

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Nova Conductors

Japan . 26 parts In-Stock

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26

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Distributors (Availability)

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Ampacity Inc.

Singapore . 725 parts In-Stock

1+ parts

$8.000

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725

$8.000

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AZTECH Wire

Italy . 535 parts In-Stock

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$14.291

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535

$14.291

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SupplyDigital Components

Austria . 5,196 parts In-Stock

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TANS Electronics

Latvia . 4,521 parts In-Stock

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4,521

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Kulean Microsystems

USA . 3,328 parts In-Stock

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Corphita

USA . 2,082 parts In-Stock

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2,082

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Supply Digital

USA . 1,995 parts In-Stock

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Microchip USA

USA . 1,245 parts In-Stock

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Problanco Electronics

Mexico . 1,213 parts In-Stock

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Corohmni

South Africa . 303 parts In-Stock

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303

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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UHIMA Technologies

Türkiye . 5 parts In-Stock

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5

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Overview

Unleash the power of innovation with the FCM8531RQY by Onsemi. This cutting-edge product is designed to exceed expectations, offering unparalleled quality and reliability. From industrial applications to microprocessor circuits, this versatile device delivers superior performance and seamless integration. Elevate your projects with the precision engineering and advanced technology that only Onsemi can provide. Experience the value and benefits of the FCM8531RQY today and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the integrated circuits, making it suitable for industrial applications.

Surface Mount:

YES - Allows for easy and secure mounting on PCBs, saving space and making assembly more efficient.

Maximum Supply Voltage:

5.5 V - Offers a wide operating range for flexibility in power supply options.

Package Shape:

SQUARE - Provides a compact footprint, ideal for applications with limited space constraints.

No. of Terminals:

32 - Offers a sufficient number of connections for interfacing with other components and peripherals.

Package Style (Meter):

FLATPACK, LOW PROFILE - Ensures a low profile design, saving vertical space in compact electronic systems.

Minimum Supply Voltage:

4.5 V - Supports operation at lower voltages, conserving power and enhancing energy efficiency.

Maximum Operating Temperature:

85 °C - Allows for reliable performance in high-temperature environments.

Minimum Operating Temperature:

40 °C - Ensures operation in extreme cold conditions without performance degradation.

Terminal Position:

QUAD - Facilitates easy soldering and connection with a standardized terminal layout.

Maximum Seated Height:

1.6 mm - Enables a slim design profile for applications with height restrictions.

Width:

7 mm - Offers a compact width for PCB integration in space-constrained designs.

Length:

7 mm - Provides a square form factor for uniform footprint and efficient layout in PCB designs.

Temperature Grade:

INDUSTRIAL - Designed to operate reliably in industrial environments with extended temperature ranges.

Peripheral IC Type:

MICROPROCESSOR CIRCUIT - Integrates key functions for processing data and controlling peripherals in a single chip.

Technology:

CMOS - Uses Complementary Metal-Oxide-Semiconductor technology for low power consumption and high-speed operation.

Terminal Form:

GULL WING - Enables secure and reliable solder connections for robust performance in various conditions.

Nominal Supply Voltage:

5 V - Standard voltage level for compatibility with common power sources and components in the system.

Bus Compatibility:

I2C; SPI; UART - Supports multiple communication protocols for versatile connectivity with other devices.

Terminal Pitch:

0.8 mm - Provides a standardized pitch for easy assembly and compatibility with standard PCB layouts.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs FCM8531RQY attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

Bus Compatibility:

I2C; SPI; UART

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

FCM8531RQY Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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