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XAZU7EV-1FBVB900Q

Xilinx

XAZU7EV-1FBVB900Q by Xilinx

Xilinx XAZU7EV-1FBVB900Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in automotive grade temperature range (-40 to 125 °C) and supports CAN, I2C, SPI, UART bus compatibility. The package has 900 terminals in a GRID ARRAY style suitable for surface mount applications.

Median Price

$6,136.470

Lifecycle Status

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4

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1k+

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Nova Conductors

Japan . 25 parts In-Stock

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Vyrian

USA . 3,417 parts In-Stock

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Semicontronic

India . 1,538 parts In-Stock

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$5.000

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$4.875

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$4.850

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AZTECH Wire

Italy . 633 parts In-Stock

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Ampacity Inc.

Singapore . 1,270 parts In-Stock

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One Stop Electronics

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Corohmni

South Africa . 2,721 parts In-Stock

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Aztec Data Supply Inc.

USA . 281 parts In-Stock

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MARBEL Systems

Belgium . 3,070 parts In-Stock

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Texas Native Microelectronics

USA . 50 parts In-Stock

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Kenton Components

USA . 1,349 parts In-Stock

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Argo Parts USA

USA . 2,792 parts In-Stock

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$6,075.105

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$6,013.741

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$5,952.376

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Continental Prestige Electronics

USA . 1,551 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Netroflash

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Supply Digital

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Microchip USA

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Qasali Group International

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Corphita

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Overview

Elevate your projects to the next level with the XAZU7EV-1FBVB900Q by Xilinx. Known for their top-notch quality and reliability, Xilinx delivers cutting-edge technology in the category of Other Function uPs, uCs & Peripheral ICs. This versatile microprocessor circuit offers a wide range of applications, from automotive to industrial settings. With a compact square package style and a grid array design, this product is easy to integrate into any project. Experience the seamless performance and efficiency that Xilinx is renowned for, and unlock endless possibilities for innovation with the XAZU7EV-1FBVB900Q.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product a reliable choice.

Surface Mount: YES

This feature allows for easy installation and soldering, increasing efficiency.

Package Shape: SQUARE

The square shape helps with space-saving design and efficient layout on circuit boards.

No. of Terminals: 900

With a high number of terminals, this product allows for versatile connectivity options.

Package Style: GRID ARRAY

The grid array style enables a compact and organized layout, improving overall performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product offers reliable performance in various conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in extreme environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, enhancing product longevity.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB design and reduces interference with other components.

Maximum Seated Height: 2.97 mm

A low seated height allows for compact and slim device designs.

Width: 31 mm

The moderate width offers a balance between space-saving and ease of use.

Maximum Time At Peak Reflow Temperature: 30s

This product can withstand high reflow temperatures for efficient soldering processes.

Peak Reflow Temperature: 245C

The high peak reflow temperature ensures reliable solder joints for lasting performance.

Length: 31 mm

The length of 31 mm provides a compact form factor for versatile installation options.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets industry standards for durability and reliability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit enhances the product's processing power and functionality.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, ideal for efficiency and battery life.

Terminal Form: BALL

The ball terminal form provides secure connections and efficient heat dissipation.

Nominal Supply Voltage: 0.85 V

With a nominal supply voltage of 0.85 V, this product is energy-efficient and compatible with various power sources.

Bus Compatibility: CAN, I2C, SPI, UART

This product supports multiple bus protocols, allowing for flexible communication options.

Terminal Pitch: 1 mm

The 1 mm terminal pitch enables precise connections and compact design layouts.

Moisture Sensitivity Level (MSL): 4

A moisture sensitivity level of 4 indicates excellent resistance to environmental factors, ensuring product longevity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XAZU7EV-1FBVB900Q attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

Bus Compatibility:

CAN, I2C, SPI, UART

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Length:

31 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA900,30X30,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

2.97 mm

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

31 mm

Peripheral IC Type:

Trade Compliance

XAZU7EV-1FBVB900Q Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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