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AM4376BZDN100

Texas Instruments

AM4376BZDN100 by Texas Instruments

AM4376BZDN100 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-90°C, has 491 terminals in a GRID ARRAY package style, and supports a supply voltage range of 1.272-1.378 V. Ideal for applications requiring low profile, fine pitch ICs in surface mount packages.

Median Price

$18.475

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Texas Instruments

USA . 265 parts In-Stock

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$13.600

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$11.880

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Mouser Electronics

USA . 3 parts In-Stock

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$23.350

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$14.230

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$13.680

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$23.350

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Distributors (In-Stock)

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Digiode

USA . 2,596 parts In-Stock

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$12.920

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Nova Conductors

Japan . 300 parts In-Stock

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VNN

France . 2,819 parts In-Stock

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Chip Stock

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Vyrian

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Corphita

USA . 1,238 parts In-Stock

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$12.240

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Continental Prestige Electronics

USA . 2,246 parts In-Stock

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$16.020

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$15.700

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Netroflash

USA . 100 parts In-Stock

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$16.020

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$16.020

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AZTECH Wire

Italy . 754 parts In-Stock

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$19.089

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Ampacity Inc.

Singapore . 123 parts In-Stock

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$25.160

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Corohmni

South Africa . 969 parts In-Stock

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Parana Technologies

USA . 528 parts In-Stock

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ChromeModa Solutions

Germany . 3,736 parts In-Stock

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$62.709

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$51.421

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IDEA Electronic Components Group

UK . 604 parts In-Stock

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$62.709

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$59.574

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$56.438

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Lixinc

USA . 14,621 parts In-Stock

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A-Z Elektronik GmbH

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Argo Parts USA

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Alle Elektronik GmbH

Germany . 3,256 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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DigiPath Technology Company

USA . 695 parts In-Stock

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Overview

Experience the cutting-edge technology and reliability of Texas Instruments with the AM4376BZDN100. This high-quality system on chip offers unparalleled performance in a compact package, making it ideal for a wide range of applications. With its innovative design and advanced features, this product provides exceptional value and benefits to customers looking for top-of-the-line solutions. Trust Texas Instruments to deliver the quality and excellence you deserve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides a cost-effective and lightweight solution for the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards.

Maximum Supply Voltage: 1.378 V

The maximum supply voltage of 1.378 V ensures safe operation and prevents overvoltage issues.

Package Shape: SQUARE

The square package shape allows for more efficient use of space on the circuit board.

No. of Terminals: 491

With a large number of terminals, this product can support a wide range of functions and connectivity options.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density and excellent electrical performance.

Minimum Supply Voltage: 1.272 V

The minimum supply voltage of 1.272 V ensures reliable operation under varying power conditions.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature of 90 °C, this product can withstand demanding thermal conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C ensures the product can function in cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Having terminals at the bottom makes it easier to mount and connect the product to the circuit board.

Maximum Seated Height: 1.3 mm

The low maximum seated height of 1.3 mm helps in compact and slim designs of electronic devices.

Width: 17 mm

The width of 17 mm provides a balance between compact size and ease of handling/installation.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 C ensures proper soldering and reliability during the manufacturing process.

Length: 17 mm

The length of 17 mm complements the overall compact design of the product.

Peripheral IC Type: SYSTEM ON CHIP

The use of System on Chip technology integrates multiple functions onto a single chip, reducing cost and complexity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the product.

Terminal Form: BALL

The ball terminal form provides reliable connections and is suitable for fine pitch applications.

Nominal Supply Voltage: 1.325 V

The nominal supply voltage of 1.325 V is optimal for stable and efficient operation of the product.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high density packaging and space-saving on the circuit board.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the product can withstand moderate exposure to humidity during storage and assembly processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4376BZDN100 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.378 V

Minimum Supply Voltage:

1.272 V

Nominal Supply Voltage:

1.325 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4376BZDN100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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