Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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AM4376BZDND100 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 90°C, with supply voltage ranging from 1.272V to 1.378V. Ideal for industrial applications requiring high performance and compact design.
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This material provides durability and protection for the integrated circuits inside, ensuring a long lifespan for the product.
Surface mount technology allows for easy and efficient installation on circuit boards, reducing assembly time and costs.
This high maximum supply voltage allows for flexibility in power supply options, making the product suitable for a wide range of applications.
The square package shape allows for efficient use of space on a circuit board, maximizing component density.
A high number of terminals allows for versatile connectivity options and enables the product to interface with a variety of other components.
This package style offers a compact design with a low profile and fine pitch, ideal for space-constrained applications where high component density is required.
The low minimum supply voltage ensures efficient power consumption, making the product suitable for energy-efficient designs.
With a high maximum operating temperature, the product can withstand harsh environmental conditions and operate reliably in industrial settings.
The low minimum operating temperature allows the product to function in cold environments, increasing its versatility.
This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.
The terminal position at the bottom simplifies the installation process and enhances the overall aesthetic of the product.
The low maximum seated height reduces the overall profile of the product, making it suitable for compact designs.
The compact width allows for efficient use of space on a circuit board, enabling high component density and flexibility in design.
The short maximum time at peak reflow temperature helps prevent damage to the product during the manufacturing process, ensuring high reliability.
The high peak reflow temperature ensures proper soldering and bonding of the components, contributing to the overall quality and durability of the product.
The compact length allows for efficient use of space on a circuit board, enabling high component density and flexibility in design.
The industrial temperature grade ensures reliable operation in harsh environments, making the product suitable for a wide range of industrial applications.
The system-on-chip design integrates multiple functions into a single IC, reducing the need for additional components and simplifying the overall system design.
CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.
The ball terminal form provides reliable electrical connections and facilitates efficient manufacturing processes, ensuring high quality and durability.
The nominal supply voltage ensures stable and consistent power supply to the integrated circuits, optimizing performance and reliability.
The fine terminal pitch allows for high component density and precise placement on a circuit board, making the product suitable for compact designs.
The moisture sensitivity level indicates the product's resistance to moisture, ensuring reliability in humid environments and during manufacturing processes.
Other Function uPs,uCs & Peripheral ICs AM4376BZDND100 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments
JESD-30 Code:
JESD-609 Code:
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Maximum Operating Temperature:
Minimum Operating Temperature:
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Peak Reflow Temperature (C):
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Surface Mount:
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Temperature Grade:
Terminal Finish:
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AM4376BZDND100 Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - AM4372-AM4379 23/Jan/2019 Device marking change 10/May/2023
PCN Assembly/Origin - Multiple Parts 28/Jul/2022
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
LM317LMX/NOPB
LM317LMX/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max input-output voltage differential of 40V. It operates in temperatures ranging from -40°C to 125°C and has a max output current of 0.1A, making it suitable for various applications requiring precise voltage regulation.
NE555D
STMicroelectronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SMBJ18CA
Bytesonic Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Jinan Jingheng Electronics
FDN5618P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
1N4148WT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
AB26TRB-32.768KHZ--T
Abracon
AB26TRB-32.768KHZ--T by Abracon is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 35000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency in surface mount configurations.
LL4148
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
1N4148
Dc Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358N
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Eic Semiconductor
LM107H
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
Hitano Enterprise
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
NE555DR
NE555DR by Texas Instruments is an Analog Waveform Generation IC with 8 terminals, operating voltage of 5V, and power supplies ranging from 5-15V. It is a versatile component for pulse generation applications due to its small outline package and commercial temperature grade suitability.
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
M85049/85-08W02
Amphenol
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
XC7Z015-L1CLG485I
Xilinx
XC7Z015-L1CLG485I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package style features a grid array, low profile design ideal for various applications in the electronics industry.
MIMXRT1051CVJ5BR
NXP Semiconductors
The NXP Semiconductors MIMXRT1051CVJ5BR is a System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring a low profile, fine pitch package style and grid array configuration.
CC1310F32RSMT
CC1310F32RSMT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C, with a supply voltage range of 1.8-3.8 V. This MICROPROCESSOR CIRCUIT is ideal for industrial applications requiring low power consumption and compact design.
CY8C3246PVI-147
Infineon Technologies
CY8C3246PVI-147 by Infineon Technologies is an Industrial-grade PSoC with 524288 ROM bits. Operating at 1.8/5V, it features Nickel Palladium Gold finish and MSL of 3. Ideal for applications requiring ultraviolet erasable memory and peak reflow temperature of 260°C within 20s.
NRF52811-QFAA-R7
Nordic Semiconductor Asa
NRF52811-QFAA-R7 by Nordic Semiconductor is a 48-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85 °C and supports supply voltage range of 1.7V to 3.6V. Ideal for applications requiring low-profile, surface-mountable chips in various electronic devices.
QT60160-ISG
Quantum Research Group
Other uPs/uCs/Peripheral ICs;
XC7Z020-2CLG400E
The Xilinx XC7Z020-2CLG400E is a System on Chip with 400 terminals in a low profile, fine pitch grid array package. It operates b/w 0-100°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact designs.
MCIMX6Q7CVT08AD
Freescale Semiconductor
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
XC7Z014S-1CLG400C
The Xilinx XC7Z014S-1CLG400C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. With 400 terminals in a low profile grid array package, it's ideal for various embedded applications.
CC3200MODR1M2AMOBR
CC3200MODR1M2AMOBR by Texas Instruments is a 63-terminal chip carrier with 3.6V max supply voltage, ideal for commercial-grade microprocessor circuits. Featuring 4-Ch 12-Bit ADC channels and I2C/SPI/UART bus compatibility, it operates b/w -20 to 70°C with a compact size of 20.5mm x 17.5mm x 2.45mm for various IoT applications.
MSP430F67641AIPZ
MSP430F67641AIPZ by Texas Instruments is a 100-terminal microprocessor circuit with 8192 bytes of RAM. Operating at -40 to 85°C, it supports I2C, SPI, and UART bus compatibility for industrial applications requiring a low-profile package style with a max seated height of 1.6mm.
MIMX8QX6AVLFZAC
The NXP Semiconductors MIMX8QX6AVLFZAC is a System on Chip with 609 terminals, operating at -40 to 125 °C. It features a supply voltage range of 1.05V to 1.15V and uses CMOS technology. Ideal for automotive applications requiring high performance in a compact grid array package style.
CY8C21434-24LKXI
Cypress Semiconductor
CY8C21434-24LKXI by Cypress is a 32-terminal IC with max supply voltage of 5.25V and temp range -40 to 85°C. Ideal for industrial applications, it's a CMOS technology-based programmable SoC with no-lead terminals and quad position, suitable for surface mount in compact spaces.
MCIMX6S5DVM10AB
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Maximum Seated Height: 1.5 mm;
XCZU3CG-1SFVC784I
XCZU3CG-1SFVC784I by Xilinx is a CMOS MICROPROCESSOR CIRCUIT with 784 BALL terminals. It operates in industrial temperature range (-40 to 100 °C) and has a supply voltage of 0.85 V. Ideal for applications requiring high-performance computing in harsh environments.
MPFS250T-FCSG536I
Microchip Technology
MPFS250T-FCSG536I by Microchip: 536 terminals, 1.03V max supply voltage, -40 to 100°C operating temp range. Ideal for applications requiring a low profile, fine pitch grid array package style with programmable SoC technology.
MPFS250T-1FCG1152E
Microchip Technology's MPFS250T-1FCG1152E is a programmable SoC with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.97-1.03V. This square GRID ARRAY package has 1152 terminals and is suitable for various Other Function uPs,uCs applications.
SCANSTA112VS
National Semiconductor
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC7Z020-2CLG484E
The Xilinx XC7Z020-2CLG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 484 terminals in a low profile grid array package, it's ideal for various embedded applications requiring high-performance processing capabilities.
OMAPL138EZWTD4
OMAPL138EZWTD4 by Texas Instruments is a low profile, fine pitch microprocessor circuit with 361 terminals. It operates at a max clock frequency of 50 MHz and has a data bus width of 32. This industrial-grade IC is suitable for applications requiring I2C, SPI, UART, and USB bus compatibility.
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TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
AM4376BZDNA100
AM4376BZDNA100 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105°C, has 491 terminals in a GRID ARRAY package style, and supports a supply voltage range of 1.272V to 1.378V. Ideal for industrial applications requiring low profile and fine pitch components.
AM4378BZDND100
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 491; Package Code: LFBGA; Package Shape: SQUARE;
AM4372BZDNA80
AM4372BZDNA80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.21V to 1.326V. This low profile, fine pitch GRID ARRAY package with 491 terminals is ideal for industrial applications requiring high performance and reliability.
AM4376BZDN80
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 491; Package Code: LFBGA; Package Shape: SQUARE;
AM4376BZDND80
AM4378BZDN100
AM4378BZDN100 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w 0-90°C with supply voltage range of 1.272-1.378V, making it ideal for embedded applications requiring high performance and compact design.
AM4378BZDNA100
AM4372BZDNA60
AM4377BZDNA100
AM4376BZDN100
AM4376BZDNA80
AM4376BZDNA80 by Texas Instruments is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, has 491 terminals in a low profile grid array package. Ideal for industrial applications requiring high performance and reliability.
AM4376BZDND30
AM4378BZDN80
AM4378BZDN80 by Texas Instruments is a CMOS system-on-chip with a max supply voltage of 1.326V and a min operating temperature of 0°C. It is used in applications requiring low-profile, fine-pitch grid array packages with 491 terminals.
AM4378BZDNA80
AM4379BZDNA100
AM4372BZDN80
AM4377BZDNA80
AM4372BZDN60
AM4377BZDND100
Supply Digital Components
$106.00
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