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AM4376BZDND100

Texas Instruments

AM4376BZDND100 by Texas Instruments

AM4376BZDND100 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 90°C, with supply voltage ranging from 1.272V to 1.378V. Ideal for industrial applications requiring high performance and compact design.

Median Price

$18.646

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,105 parts In-Stock

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$14.683

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$12.825

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$8.845

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1,105

$14.683

$12.825

$8.845

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DigiKey

USA . 94 parts In-Stock

1+ parts

$22.610

100+ parts

$15.808

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$14.748

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94

$22.610

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$14.748

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Mouser Electronics

USA . 9 parts In-Stock

1+ parts

$22.610

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$15.330

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$14.740

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9

$22.610

$15.330

$14.740

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Chip1Stop

Japan . 180 parts In-Stock

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$11.783

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Distributors (In-Stock)

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Digiode

USA . 3,764 parts In-Stock

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$13.949

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$13.949

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Nova Conductors

Japan . 33 parts In-Stock

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$17.290

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Vyrian

USA . 8,598 parts In-Stock

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Chip Stock

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VNN

France . 612 parts In-Stock

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Bristol Electronics

USA . 24 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 14 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 134 parts In-Stock

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$10.020

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$10.020

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Corphita

USA . 3,982 parts In-Stock

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$13.215

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Continental Prestige Electronics

USA . 2,383 parts In-Stock

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$15.859

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$15.542

2,383

$15.859

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$15.542

Corohmni

South Africa . 902 parts In-Stock

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$17.290

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$17.290

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Netroflash

USA . 2,000 parts In-Stock

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$17.290

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$16.426

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$16.080

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$17.290

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$16.426

$16.080

Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$17.809

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$16.918

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$16.918

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$17.809

$16.918

$16.918

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Modulus Dynamics

Lithuania . 50 parts In-Stock

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$19.192

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$19.000

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$18.424

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$19.192

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$18.424

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Semicontronic

India . 389 parts In-Stock

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$21.800

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$21.255

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$21.146

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$21.800

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$21.146

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Parana Technologies

USA . 1,879 parts In-Stock

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$76.778

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DigiPath Technology Company

USA . 997 parts In-Stock

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$84.542

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IDEA Electronic Components Group

UK . 904 parts In-Stock

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$86.267

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$81.954

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$77.640

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904

$86.267

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ChromeModa Solutions

Germany . 463 parts In-Stock

1+ parts

$86.267

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$70.739

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Lixinc

USA . 14,310 parts In-Stock

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Argo Parts USA

USA . 3,450 parts In-Stock

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Kepictronics

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Overview

Experience the cutting-edge technology of Texas Instruments with the AM4376BZDND100, a high-quality Other Function uPs,uCs & Peripheral ICs. With a package style of GRID ARRAY, LOW PROFILE, FINE PITCH, and a temperature grade of INDUSTRIAL, this product is perfect for a wide range of applications. From industrial automation to consumer electronics, the AM4376BZDND100 offers unparalleled value with its reliable performance and innovative design. Trust Texas Instruments to deliver top-notch products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuits inside, ensuring a long lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, reducing assembly time and costs.

Maximum Supply Voltage: 1.378 V

This high maximum supply voltage allows for flexibility in power supply options, making the product suitable for a wide range of applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, maximizing component density.

No. of Terminals: 491

A high number of terminals allows for versatile connectivity options and enables the product to interface with a variety of other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with a low profile and fine pitch, ideal for space-constrained applications where high component density is required.

Minimum Supply Voltage: 1.272 V

The low minimum supply voltage ensures efficient power consumption, making the product suitable for energy-efficient designs.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and operate reliably in industrial settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in cold environments, increasing its versatility.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: BOTTOM

The terminal position at the bottom simplifies the installation process and enhances the overall aesthetic of the product.

Maximum Seated Height: 1.3 mm

The low maximum seated height reduces the overall profile of the product, making it suitable for compact designs.

Width: 17 mm

The compact width allows for efficient use of space on a circuit board, enabling high component density and flexibility in design.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature helps prevent damage to the product during the manufacturing process, ensuring high reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and bonding of the components, contributing to the overall quality and durability of the product.

Length: 17 mm

The compact length allows for efficient use of space on a circuit board, enabling high component density and flexibility in design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments, making the product suitable for a wide range of industrial applications.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip design integrates multiple functions into a single IC, reducing the need for additional components and simplifying the overall system design.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and facilitates efficient manufacturing processes, ensuring high quality and durability.

Nominal Supply Voltage: 1.325 V

The nominal supply voltage ensures stable and consistent power supply to the integrated circuits, optimizing performance and reliability.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for high component density and precise placement on a circuit board, making the product suitable for compact designs.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level indicates the product's resistance to moisture, ensuring reliability in humid environments and during manufacturing processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4376BZDND100 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.378 V

Minimum Supply Voltage:

1.272 V

Nominal Supply Voltage:

1.325 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4376BZDND100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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