Loading...

AM4376BZDND80

Texas Instruments

AM4376BZDND80 by Texas Instruments

AM4376BZDND80 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 90°C and has a supply voltage range of 1.21V to 1.326V. Ideal for industrial applications requiring high performance and compact design.

Median Price

$22.320

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 89 parts In-Stock

1+ parts

$22.320

100+ parts

$14.240

1k+ parts

$13.540

10k+ parts

-

89

$22.320

$14.240

$13.540

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EXC GmbH

Germany . 90 parts In-Stock

1+ parts

$15.042

100+ parts

-

1k+ parts

-

10k+ parts

-

90

$15.042

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$15.310

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$15.310

-

-

-

Digiode

USA . 1,097 parts In-Stock

1+ parts

$15.760

100+ parts

-

1k+ parts

-

10k+ parts

-

1,097

$15.760

-

-

-

Vyrian

USA . 1,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,940

-

-

-

-

VNN

France . 1,462 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,462

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,175 parts In-Stock

1+ parts

$14.039

100+ parts

-

1k+ parts

-

10k+ parts

$13.758

2,175

$14.039

-

-

$13.758

Ampacity Inc.

Singapore . 89 parts In-Stock

1+ parts

$14.100

100+ parts

-

1k+ parts

-

10k+ parts

-

89

$14.100

-

-

-

Semicontronic

India . 89 parts In-Stock

1+ parts

$14.100

100+ parts

$13.748

1k+ parts

$13.677

10k+ parts

-

89

$14.100

$13.748

$13.677

-

Corphita

USA . 3,033 parts In-Stock

1+ parts

$14.931

100+ parts

-

1k+ parts

-

10k+ parts

-

3,033

$14.931

-

-

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

$15.004

100+ parts

-

1k+ parts

$14.404

10k+ parts

-

500

$15.004

-

$14.404

-

AZTECH Wire

Italy . 393 parts In-Stock

1+ parts

$18.649

100+ parts

-

1k+ parts

-

10k+ parts

-

393

$18.649

-

-

-

Corohmni

South Africa . 585 parts In-Stock

1+ parts

$36.834

100+ parts

-

1k+ parts

-

10k+ parts

-

585

$36.834

-

-

-

Parana Technologies

USA . 244 parts In-Stock

1+ parts

$68.927

100+ parts

-

1k+ parts

-

10k+ parts

-

244

$68.927

-

-

-

DigiPath Technology Company

USA . 855 parts In-Stock

1+ parts

$75.897

100+ parts

-

1k+ parts

-

10k+ parts

-

855

$75.897

-

-

-

ChromeModa Solutions

Germany . 4,646 parts In-Stock

1+ parts

$77.446

100+ parts

$63.506

1k+ parts

-

10k+ parts

-

4,646

$77.446

$63.506

-

-

IDEA Electronic Components Group

UK . 1,578 parts In-Stock

1+ parts

$77.446

100+ parts

$73.574

1k+ parts

$69.701

10k+ parts

-

1,578

$77.446

$73.574

$69.701

-

Lixinc

USA . 8,087 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,087

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,435

-

-

-

-

Alle Elektronik GmbH

Germany . 4,290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,290

-

-

-

-

Argo Parts USA

USA . 2,632 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,632

-

-

-

-

Futuretech Components

Singapore . 1,710 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,710

-

-

-

-

Kepictronics

USA . 176 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

176

-

-

-

-

Overview

Experience the unparalleled quality and innovation of Texas Instruments with the AM4376BZDND80. As a leader in semiconductor manufacturing, Texas Instruments delivers cutting-edge solutions across various applications. This product, part of the Other Function uPs,uCs & Peripheral ICs category, offers customers exceptional value and reliability. With its advanced technology and industrial-grade design, the AM4376BZDND80 provides superior performance and efficiency. Trust Texas Instruments to meet your needs and exceed your expectations with this exceptional system on chip.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, ensuring longevity and ease of handling.

Surface Mount: YES

Easily mountable on printed circuit boards, saving assembly time and space.

Maximum Supply Voltage: 1.326 V

Supports a high supply voltage, allowing for versatile application and compatibility.

Package Shape: SQUARE

Efficient use of space and easy to align during assembly.

No. of Terminals: 491

High number of terminals for connectivity options and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array design with fine pitch for compact footprint and optimal signal routing.

Minimum Supply Voltage: 1.21 V

Supports a low supply voltage, enhancing energy efficiency and reducing power consumption.

Maximum Operating Temperature: 90 °C

Wide operating temperature range for reliability in various environments.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, suitable for industrial and outdoor applications.

Terminal Finish: TIN SILVER COPPER

High-quality terminal finish for improved conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position for ease of PCB layout and soldering.

Maximum Seated Height: 1.3 mm

Low profile design for space-constrained applications.

Width: 17 mm

Compact width for efficient board space utilization.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time for quick and reliable soldering process.

Peak Reflow Temperature °C: 260

High peak reflow temperature for secure and durable solder joints.

Length: 17 mm

Symmetrical length for uniformity in design and placement.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating for reliable performance in harsh conditions.

Peripheral IC Type: SYSTEM ON CHIP

Integration of multiple functions into a single chip, simplifying system design and reducing component count.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for reliable solder connections.

Nominal Supply Voltage: 1.26 V

Optimal nominal supply voltage for efficient operation and performance.

Terminal Pitch: 0.65 mm

Fine terminal pitch for high-density interconnects and space-saving layout.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for safe handling and storage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4376BZDND80 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4376BZDND80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19