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AM4377BZDND100

Texas Instruments

AM4377BZDND100 by Texas Instruments

AM4377BZDND100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 90°C. It features a low profile grid array package style, 0.65mm terminal pitch, and 1.272-1.378V supply voltage range. Ideal for industrial applications requiring high-performance computing in compact spaces.

Median Price

$23.664

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 336 parts In-Stock

1+ parts

$18.527

100+ parts

$16.468

1k+ parts

$12.109

10k+ parts

-

336

$18.527

$16.468

$12.109

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Mouser Electronics

USA . 93 parts In-Stock

1+ parts

$28.800

100+ parts

$19.110

1k+ parts

-

10k+ parts

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93

$28.800

$19.110

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 2 parts In-Stock

1+ parts

$12.950

100+ parts

-

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-

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2

$12.950

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DF Sales Co.

USA . 2 parts In-Stock

1+ parts

$12.950

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-

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-

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2

$12.950

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-

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Digiode

USA . 1,700 parts In-Stock

1+ parts

$17.601

100+ parts

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1,700

$17.601

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Vyrian

USA . 4,812 parts In-Stock

1+ parts

-

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4,812

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Chip Stock

USA . 515 parts In-Stock

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515

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,034 parts In-Stock

1+ parts

$16.674

100+ parts

-

1k+ parts

-

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3,034

$16.674

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Corohmni

South Africa . 402 parts In-Stock

1+ parts

$22.080

100+ parts

-

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402

$22.080

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Parana Technologies

USA . 1,805 parts In-Stock

1+ parts

$28.940

100+ parts

-

1k+ parts

$53.467

10k+ parts

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1,805

$28.940

-

$53.467

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DigiPath Technology Company

USA . 1,127 parts In-Stock

1+ parts

$31.867

100+ parts

$29.317

1k+ parts

-

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1,127

$31.867

$29.317

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ChromeModa Solutions

Germany . 6,338 parts In-Stock

1+ parts

$32.517

100+ parts

$26.664

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6,338

$32.517

$26.664

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IDEA Electronic Components Group

UK . 1,024 parts In-Stock

1+ parts

$32.517

100+ parts

$30.891

1k+ parts

$29.265

10k+ parts

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1,024

$32.517

$30.891

$29.265

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$57.780

100+ parts

$52.580

1k+ parts

$47.380

10k+ parts

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1,000

$57.780

$52.580

$47.380

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Native Components

USA . 254 parts In-Stock

1+ parts

$1,216.710

100+ parts

$1,192.376

1k+ parts

$1,180.209

10k+ parts

$1,168.042

254

$1,216.710

$1,192.376

$1,180.209

$1,168.042

Northwest PG Solutions

USA . 1,937 parts In-Stock

1+ parts

$1,338.381

100+ parts

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1,937

$1,338.381

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Overview

Experience the cutting-edge technology of Texas Instruments with the AM4377BZDND100, a high-quality System on Chip peripheral IC designed for industrial applications. With its advanced features and reliable performance, this product offers unparalleled value to customers seeking top-notch solutions for their electronic devices. From its innovative design to its wide range of functions, the AM4377BZDND100 by Texas Instruments is the perfect choice for those looking for superior performance and efficiency in their projects. Trust in Texas Instruments to deliver excellence in every aspect of your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and heat resistance.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making this product suitable for space-constrained applications.

Maximum Supply Voltage: 1.378 V

Offers a high maximum supply voltage, providing flexibility in power supply options.

Package Shape: SQUARE

Square packages are easy to handle and provide efficient use of PCB space.

No. of Terminals: 491

A high number of terminals allow for versatile connectivity options and integration with other components.

Minimum Supply Voltage: 1.272 V

The low minimum supply voltage ensures efficient power consumption and can operate with a wide range of power sources.

Maximum Operating Temperature: 90 °C

With a high operating temperature range, this product can withstand harsh environmental conditions or extended use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance for long-lasting connections.

Terminal Position: BOTTOM

Bottom terminal position aids in PCB layout and routing for efficient design implementation.

Maximum Seated Height: 1.3 mm

Low profile design allows for compact integration in space-constrained applications.

Width: 17 mm

Compact width enables efficient board space utilization and ease of placement.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures proper soldering and robust construction.

Length: 17 mm

Compact length contributes to a small form factor and efficient board space usage.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where reliability and durability are essential.

Peripheral IC Type: SYSTEM ON CHIP

Integration of multiple functions into a single chip simplifies system design and reduces component count.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for energy-efficient and reliable operation.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and reliable electrical connections.

Nominal Supply Voltage: 1.325 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 0.65 mm

Fine terminal pitch enables dense packaging and high interconnect density for complex circuitry.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard handling and storage precautions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4377BZDND100 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.378 V

Minimum Supply Voltage:

1.272 V

Nominal Supply Voltage:

1.325 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4377BZDND100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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