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MIMX8MN5DVPIZAA

NXP Semiconductors

MIMX8MN5DVPIZAA by NXP Semiconductors

The NXP Semiconductors MIMX8MN5DVPIZAA is a SoC with CMOS technology, featuring 306 terminals in a grid array package. It operates b/w 0-95°C, with supply voltage ranging from 0.9-1V. Ideal for applications requiring high performance and low power consumption.

Median Price

$24.345

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 68 parts In-Stock

1+ parts

$15.900

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$13.200

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68

$15.900

$13.200

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Verical

USA . 336 parts In-Stock

1+ parts

$21.680

100+ parts

$14.950

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$13.450

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336

$21.680

$14.950

$13.450

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Arrow

USA . 336 parts In-Stock

1+ parts

$22.510

100+ parts

$16.000

1k+ parts

$13.580

10k+ parts

-

336

$22.510

$16.000

$13.580

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Mouser Electronics

USA . 58 parts In-Stock

1+ parts

$26.180

100+ parts

$17.950

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$17.500

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58

$26.180

$17.950

$17.500

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DigiKey

USA . 19 parts In-Stock

1+ parts

$26.180

100+ parts

$19.759

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$17.266

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19

$26.180

$19.759

$17.266

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Farnell

UK . 273 parts In-Stock

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$26.812

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$18.385

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273

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$18.385

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Element14

Singapore . 198 parts In-Stock

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$28.780

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$22.700

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198

$28.780

$22.700

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Rochester

USA . 3,083 parts In-Stock

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$11.850

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$10.600

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$9.980

3,083

-

$11.850

$10.600

$9.980

Distributors (In-Stock)

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Digiode

USA . 578 parts In-Stock

1+ parts

$12.502

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578

$12.502

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$20.640

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10

$20.640

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Flip Electronics

USA . 3,696 parts In-Stock

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Anansix

USA . 2,434 parts In-Stock

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Vyrian

USA . 893 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 839 parts In-Stock

1+ parts

$11.190

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839

$11.190

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Semicontronic

India . 555 parts In-Stock

1+ parts

$11.190

100+ parts

$10.910

1k+ parts

$10.854

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555

$11.190

$10.910

$10.854

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Corphita

USA . 4,172 parts In-Stock

1+ parts

$11.844

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$11.844

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Component Stockers USA

USA . 1,893 parts In-Stock

1+ parts

$19.010

100+ parts

$18.020

1k+ parts

$17.370

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1,893

$19.010

$18.020

$17.370

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Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

$20.640

100+ parts

$19.608

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$18.370

120

$20.640

$19.608

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$18.370

Continental Prestige Electronics

USA . 286 parts In-Stock

1+ parts

$22.920

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286

$22.920

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$23.942

100+ parts

$22.027

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$20.640

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500

$23.942

$22.027

$20.640

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Corohmni

South Africa . 2,026 parts In-Stock

1+ parts

$38.875

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2,026

$38.875

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Aztec Data Supply Inc.

USA . 3,233 parts In-Stock

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$61.720

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$61.720

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Microchip USA

USA . 2,141 parts In-Stock

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$64.377

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UNI Independent Distributors

Spain . 1,584 parts In-Stock

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Argo Parts USA

USA . 1,156 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

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500

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Overview

Unleash the power of cutting-edge technology with the MIMX8MN5DVPIZAA by NXP Semiconductors. This innovative product belongs to the category of Other Function uPs, uCs & Peripheral ICs, offering unparalleled quality and reliability. With a wide range of applications, this product is designed to deliver exceptional performance and efficiency. Experience the value of seamless integration and superior functionality, making it the perfect choice for your next project. Upgrade your devices with the MIMX8MN5DVPIZAA and witness the difference it can make in enhancing your overall user experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and thermal resistance, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Maximum Supply Voltage: 1 V

Having a maximum supply voltage of 1V ensures compatibility with a wide range of power sources, making it versatile in various applications.

Package Shape: SQUARE

Square shape package allows for efficient use of space on circuit boards, optimizing layout and design.

No. of Terminals: 306

Having 306 terminals enables connectivity to a large number of external components, expanding the product's capabilities.

Minimum Supply Voltage: 0.9 V

With a low minimum supply voltage of 0.9V, the product can operate efficiently even with limited power sources.

Maximum Operating Temperature: 95 °C

High maximum operating temperature of 95C ensures reliable performance in various environmental conditions, enhancing product durability.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0C allows the product to function effectively in colder environments, increasing its versatility.

Terminal Position: BOTTOM

Bottom terminal position simplifies installation and maintenance procedures, making the product user-friendly.

Maximum Seated Height: 1.01 mm

Low maximum seated height of 1.01mm reduces the overall profile of the product, saving space in compact designs.

Width: 11 mm

Narrow width of 11mm allows for easy integration into tight spaces or densely populated PCBs, improving overall design flexibility.

Maximum Time At Peak Reflow Temperature (s): 40

Allowing a maximum time of 40s at peak reflow temperature enables efficient soldering processes, reducing the risk of damage to the product.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260C, the product can withstand high-temperature soldering processes, ensuring robust and reliable connections.

Length: 11 mm

Compact length of 11mm further enhances the product's space-saving design, ideal for applications with limited board space.

Peripheral IC Type: SoC

System-on-Chip (SoC) integration enables multiple functions to be combined into a single IC, reducing overall component count and enhancing efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the product's efficiency and reliability in operation.

Terminal Form: BALL

Ball terminal form provides reliable connections and simplifies the assembly process, ensuring consistent performance.

Nominal Supply Voltage: 0.95 V

Having a nominal supply voltage of 0.95V ensures stable operation within a specific voltage range, improving overall performance.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5mm allows for high-density packaging and precise connections, optimizing PCB layout and design.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the product can withstand multiple reflows without damage, ensuring reliability in manufacturing processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMX8MN5DVPIZAA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B306

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

306

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA306,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.01 mm

Maximum Supply Voltage:

1 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

11 mm

Peripheral IC Type:

SoC

Trade Compliance

MIMX8MN5DVPIZAA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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