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XCZU5CG-2SFVC784I

Xilinx

XCZU5CG-2SFVC784I by Xilinx

XCZU5CG-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an industrial temperature range from -40 to 100 °C and has a nominal voltage of 0.85 V. This device, featuring a GRID ARRAY package style, is suitable for various applications requiring high-performance processing capabilities.

Median Price

$2,588.950

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Mouser Electronics

USA . 3 parts In-Stock

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$2,512.490

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DigiKey

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Digiode

USA . 459 parts In-Stock

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$2,302.078

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

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AZTECH Wire

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

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Modulus Dynamics

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Microchip USA

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Semicontronic

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Corphita

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Aranea Global

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$2,279.399

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Continental Prestige Electronics

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Argo Parts USA

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$2,354.982

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$2,331.195

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$2,307.407

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One Stop Electronics

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Supply Digital

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Overview

Unlock the power of cutting-edge technology with the XCZU5CG-2SFVC784I by Xilinx. Renowned for their superior quality and innovation, Xilinx delivers industry-leading solutions in the category of Other Function uPs, uCs, and Peripheral ICs. This versatile microprocessor circuit offers unparalleled performance and reliability, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this product provides customers with value, benefits, and advantages that set them apart from the competition. Experience the difference with Xilinx and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and protection for the IC, making it suitable for various industrial applications.

Surface Mount

YES - Allows for easy and efficient installation on printed circuit boards, saving time and effort during assembly.

Package Shape

SQUARE - Maximizes space efficiency on the PCB, allowing for more components to be placed in a compact layout.

No. of Terminals

784 - Offers a high level of connectivity, enabling the IC to perform complex functions and tasks effectively.

Package Style (Meter)

GRID ARRAY - Ensures a secure and reliable connection between the IC and the PCB, reducing the risk of signal loss or interference.

Maximum Operating Temperature

100 °C - Can withstand high temperature environments, making it suitable for use in harsh industrial settings.

Minimum Operating Temperature

40 °C - Can operate in low temperature conditions, ensuring reliable performance in a variety of environments.

Terminal Finish

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) - Provides a stable and corrosion-resistant surface for the terminals, ensuring long-term reliability.

Terminal Position

BOTTOM - Simplifies the PCB design and layout, making it easier to integrate the IC into different systems.

Maximum Time At Peak Reflow Temperature (s)

30 - Allows for efficient soldering during assembly, ensuring a secure connection between the IC and the PCB.

Peak Reflow Temperature °C

250 - Withstands high temperature soldering processes, ensuring the IC remains intact during assembly.

Temperature Grade

INDUSTRIAL - Designed to meet the rigorous demands of industrial applications, ensuring reliable performance in challenging environments.

Peripheral IC Type

MICROPROCESSOR CIRCUIT - Incorporates advanced microprocessor technology, enabling the IC to execute complex functions and tasks efficiently.

Technology

CMOS - Utilizes CMOS technology, offering low power consumption and high speed operation, ideal for energy-efficient applications.

Terminal Form

BALL - Provides a reliable and secure connection between the IC and the PCB, minimizing the risk of signal loss or interference.

Nominal Supply Voltage

0.85 V - Operates at a low supply voltage, reducing power consumption and heat dissipation, ideal for portable or battery-operated devices.

Moisture Sensitivity Level (MSL)

4 - Has a moderate moisture sensitivity level, making it suitable for a wide range of environments while still requiring some precautions during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU5CG-2SFVC784I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU5CG-2SFVC784I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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