Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The NXP Semiconductors MIMX8MM1DVTLZAA is a low-profile, fine-pitch SoC with 486 terminals. It operates b/w 0-95°C, with supply voltage ranging from 0.95-1.05V. Ideal for applications requiring high performance in compact spaces.
Median Price
$25.700
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$20.870
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$30.530
$21.170
$20.230
Chip1Stop
$31.200
$22.100
$19.600
Digiode
$19.095
Nova Conductors
$28.290
Vyrian
Chip Stock
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Martec Srl
Semicontronic
$17.090
$16.663
$16.577
Corphita
$18.090
Aztec Data Supply Inc.
$21.880
Continental Prestige Electronics
$27.724
Netroflash
Ampacity Inc.
$37.190
Corohmni
$50.538
Advanced Electronics
$78.854
$74.911
Microchip USA
$90.528
UNI Independent Distributors
Argo Parts USA
GreenTree Electronics
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Speed Components Ltd (Excess)
Plastic/Epoxy package body material offers high durability and reliability, making this product suitable for harsh environments.
Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.
Operates efficiently within a safe maximum supply voltage range, ensuring stability and longevity of the product.
Square package shape allows for more efficient use of PCB space, making it ideal for compact electronic devices.
High number of terminals enables more connectivity options and functions to be integrated into the product, enhancing its versatility.
Grid array, low profile, fine pitch package style provides high density integration and improved signal integrity, making it suitable for advanced electronics.
Low minimum supply voltage requirement allows for energy-efficient operation, reducing power consumption and heat generation.
High maximum operating temperature range ensures stable performance in various environmental conditions.
Low minimum operating temperature allows for reliable operation even in cold environments, making it suitable for a wide range of applications.
Tin silver terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of connections.
Bottom terminal position facilitates easier PCB layout and assembly, reducing the complexity of the manufacturing process.
Low maximum seated height allows for slim and compact design of the product, making it suitable for space-constrained applications.
Moderate width dimension provides a balance between space-saving and ease of handling during assembly and installation.
Extended time at peak reflow temperature ensures proper soldering and connection reliability during the manufacturing process.
High peak reflow temperature tolerance allows for reliable soldering in industrial processes, ensuring long-term durability of the product.
Moderate length dimension provides a balance between space-saving and accommodating necessary components for functionality.
System-on-Chip (SoC) peripheral IC type integrates multiple functions into a single chip, reducing component count and overall system complexity.
Complementary Metal-Oxide-Semiconductor (CMOS) technology allows for low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.
Ball terminal form provides reliable and robust connections, suitable for applications that require high mechanical stress tolerance.
Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.
Fine terminal pitch allows for high-density packaging and improved signal routing, enhancing the overall functionality and performance of the product.
Moisture Sensitivity Level 3 indicates a moderate level of sensitivity to moisture, requiring proper handling and storage to maintain product integrity.
Other Function uPs,uCs & Peripheral ICs MIMX8MM1DVTLZAA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
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MIMX8MM1DVTLZAA Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - Datasheet 14/Dec/2022 Mult Dev 26/May/2023
PCN Assembly/Origin - Test Location 17/Jul/2023
PCN Packaging - All Dev Label Update 15/Dec/2020 Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N7002
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
1N4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
Promax-johnton
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Terminal Form: GULL WING; Maximum Drain-Source On Resistance: 7.5 ohm; Minimum DS Breakdown Voltage: 60 V;
MMBT3904-7-F
Diodes Incorporated
Diodes Inc. MMBT3904-7-F is a NPN BJT transistor for switching applications. Features include VCEsat of 0.3V, hFE of 30, and IC of 0.2A. With a max operating temp of 150°C, it's ideal for small outline SMT designs in automotive electronics.
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
SMBJ18CA
Bytesonic Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBT3904LT1G
Onsemi
MMBT3904LT1G by Onsemi is a NPN BJT with max. collector-emitter voltage of 40V, hFE of 30, and fT of 300MHz. Ideal for small signal applications in electronics due to its compact size, high transition frequency, and low power dissipation capabilities.
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
MBR0520L-T1
Won-top Electronics
MBR0520L-T1 by Won-top Electronics is a Schottky rectifier diode with 20V peak reverse voltage and 0.5A output current. It is a single-config, surface-mount diode in a small outline package, suitable for applications requiring high-speed switching and low forward voltage drop. Operating temperature range from -65°C to 125°C makes it ideal for various electronic circuits.
BAV99
Gec Plessey Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
New Jersey Semiconductor Products
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
Formosa Microsemi
LL4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358DT
STMicroelectronics
LM358DT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 9000 uV. It operates at a nominal voltage of 5V and has a min voltage gain of 25000. This amplifier is commonly used in applications requiring high precision and low power consumption.
SLM9670AQ20FW1311XTMA1
Infineon Technologies
SLM9670AQ20FW1311XTMA1 by Infineon is a 32-terminal IC with max supply voltage of 1.95V and min operating temp of -40°C. Ideal for cryptographic authentication applications due to its CMOS technology, quad terminal position, and compact square package style.
MCIMX6X4CVM08AB
Freescale Semiconductor
SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 529; Package Code: LFBGA; Package Shape: SQUARE;
ESP32-WROOM-32E-H4
Espressif Systems (Shanghai)
ESP32-WROOM-32E-H4 by Espressif Systems is a 38-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 3-3.6 V. Ideal for IoT applications due to its compact size (25.5mm x 18mm) and peak reflow temp of 250C.
ATWINC1500-MR210PB1961-T
Microchip Technology
ATWINC1500-MR210PB1961-T by Microchip operates at 3-4.2V, with temp range -40 to 85°C. It is a CMOS microprocessor circuit in a rectangular package style for industrial applications. This surface-mount IC has 28 terminals and measures 21.72mm x 14.73mm x 2.113mm, suitable for various uP/uC functions.
TW8804-LC3-GRSH
Intersil
Other uPs/uCs/Peripheral ICs;
MTFC8GLVEA-4MIT
Micron Technology
MTFC8GLVEA-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.65V to 1.95V. This IC has 153 terminals in a GRID ARRAY package suitable for industrial applications.
CY8C5268AXI-LP047
Infineon's CY8C5268AXI-LP047 is an Industrial-grade PSoC with Pure Tin finish. It can withstand peak reflow temp of 260°C for 30s. Ideal for various applications in Other Function uPs,uCs & Peripheral ICs due to its MSL level of 3.
1433
Ndk America
XC7Z030-2FBG676I
Xilinx
The Xilinx XC7Z030-2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.
ST33HTPH2E28AAF0
ST33HTPH2E28AAF0 by STMicroelectronics is a 28-terminal IC with CMOS technology, operating b/w -40 to 105°C. It features a cryptographic authenticator for industrial applications. The small outline package has a thin profile and gull wing terminals, suitable for surface mount assembly at 0.65mm pitch.
SLS32AIA010MSUSON10XTMA2
SLS32AIA010MSUSON10XTMA2 by Infineon is a cryptographic authenticator IC with 10 terminals, CMOS technology, and 3.3V nominal voltage. It operates b/w -25 to 85 °C and has a small outline square package style suitable for surface mount applications. The IC's terminal pitch is 0.5mm, making it ideal for compact electronic devices.
MSP430F67641AIPZ
Texas Instruments
MSP430F67641AIPZ by Texas Instruments is a 100-terminal microprocessor circuit with 8192 bytes of RAM. Operating at -40 to 85°C, it supports I2C, SPI, and UART bus compatibility for industrial applications requiring a low-profile package style with a max seated height of 1.6mm.
XAZU2EG-L1SFVA625I
Xilinx XAZU2EG-L1SFVA625I is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 625 terminals in a GRID ARRAY, FINE PITCH package style. Operating from -40 to 100 °C, it's ideal for industrial applications requiring low power consumption at 0.72 V supply voltage.
MCIMX257CJM4A
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6QP7CVT8AB
NXP Semiconductors
MCIMX6QP7CVT8AB by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.275V to 1.5V. Ideal for applications requiring high performance in compact form factors.
BGM13S22F512GA-V3R
Silicon Labs
SoC;
ST4SI2M0007AKIFW
ST4SI2M0007AKIFW by STMicroelectronics is a 8-terminal IC with max operating temp of 105°C. It's a small outline, heat sink package used as cryptographic authenticator in various applications. With CMOS technology and no-lead terminals, it's ideal for secure data authentication needs.
XCZU7EV-L2FFVF1517E
XCZU7EV-L2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-110 °C, with supply voltage range of 0.698-0.742 V. This GRID ARRAY package is ideal for applications requiring high performance uPs/uCs & Peripheral ICs in various industries.
MIMXRT1062CVL5A
The NXP Semiconductors MIMXRT1062CVL5A is a SoC with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105 °C and has a supply voltage range of 1.15V to 1.26V. Ideal for industrial applications requiring high performance uPs/uCs & peripheral ICs in compact form factors.
PEX8606-BA50BCG
Plx Technology
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MIMXRT1062CVL5B
The NXP Semiconductors MIMXRT1062CVL5B is a low-profile, fine-pitch grid array SoC with 196 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.15-1.26V. Ideal for applications requiring high-performance microcontrollers in compact designs.
MIMXRT1062CVJ5A
MIMXRT1062CVJ5A by NXP Semiconductors is a CMOS SoC with 196 terminals in a low profile, fine pitch grid array package. It operates in industrial temperature range (-40 to 105 °C) and has a max supply voltage of 1.26 V. This IC is suitable for various applications requiring high-performance microcontrollers.
MIMXRT1062CVJ5B
The NXP MIMXRT1062CVJ5B is a SoC with CMOS technology. It operates b/w -40 to 105°C, with a supply voltage range of 1.15-1.26V. With 196 terminals in a low-profile grid array package, it's ideal for applications requiring high performance and compact design.
MIMXRT1176CVM8A
The NXP MIMXRT1176CVM8A is a SoC with CMOS technology, featuring 289 terminals in a low-profile grid array package. Operating b/w -40 to 105°C, it has a supply voltage range of 1.1-1.15V and peak reflow temp of 260°C. Ideal for applications requiring high-performance microcontrollers in compact form factors.
MIMX8MM6DVTLZAA
MIMX8MM6DVTLZAA by NXP Semiconductors is a low-profile, fine-pitch SoC with 486 terminals. It operates at a voltage range of 0.95V to 1.05V and can withstand temperatures up to 95°C. This versatile chip is commonly used in various applications requiring high-performance microcontrollers and peripheral ICs.
MIMX8MQ6DVAJZAB
SoC; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; Moisture Sensitivity Level (MSL): 3;
MIMXRT1064CVJ5B
MIMXRT1064CVJ5B by NXP Semiconductors is a CMOS SoC with 196 terminals in a low profile, fine pitch grid array package. It operates at temperatures ranging from -40 to 105 °C and has a max supply voltage of 1.26 V. This IC is commonly used in industrial applications requiring high-performance microcontrollers.
MIMXRT1064CVL5B
SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;
MIMXRT1173CVM8A
NXP Semiconductors' MIMXRT1173CVM8A is a low-profile, fine-pitch SoC with 289 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.1V to 1.15V. Ideal for applications requiring high-performance uPs and uCs in compact designs.
MIMXRT1171CVM8A
The NXP Semiconductors MIMXRT1171CVM8A is a SoC with CMOS technology, featuring 289 terminals in a low-profile grid array package. Operating b/w -40 to 105°C, it has a supply voltage range of 1.1-1.15V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance microcontrollers in compact form factors.
MIMXRT1052CVL5B
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;
MIMX8MM6DVTLZAAR
The NXP Semiconductors MIMX8MM6DVTLZAAR is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and uses CMOS technology. Ideal for applications requiring high processing power in compact spaces.
MIMXRT1021CAG4A
The NXP Semiconductors MIMXRT1021CAG4A is an SoC with a peak reflow temperature of 260°C and industrial-grade temperature tolerance. It has a max time at peak reflow temperature of 40s, making it suitable for applications requiring high-performance processing in harsh environments.
MIMX8MQ6DVAJZAA
SoC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
MIMXRT117FCVM8A
SoC; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; Maximum Seated Height: 1.52 mm;
MIMXRT1064CVL5A
The NXP MIMXRT1064CVL5A is a SoC with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring high performance and compact design.
MIMX8QX6AVLFZAC
The NXP Semiconductors MIMX8QX6AVLFZAC is a System on Chip with 609 terminals, operating at -40 to 125 °C. It features a supply voltage range of 1.05V to 1.15V and uses CMOS technology. Ideal for automotive applications requiring high performance in a compact grid array package style.
MIMXRT1052CVJ5B
The NXP Semiconductors MIMXRT1052CVJ5B is a System on Chip with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring high performance and reliability.
MIMX8MN6DVTJZAA
The NXP Semiconductors MIMX8MN6DVTJZAA is a low-profile, fine-pitch grid array SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.
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