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MIMXRT1062CVJ5A

NXP Semiconductors

MIMXRT1062CVJ5A by NXP Semiconductors

MIMXRT1062CVJ5A by NXP Semiconductors is a CMOS SoC with 196 terminals in a low profile, fine pitch grid array package. It operates in industrial temperature range (-40 to 105 °C) and has a max supply voltage of 1.26 V. This IC is suitable for various applications requiring high-performance microcontrollers.

Median Price

$10.017

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Nova Conductors

Japan . 45 parts In-Stock

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Vyrian

USA . 7,223 parts In-Stock

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Digiode

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Anansix

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Semicontronic

India . 1,294 parts In-Stock

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$3.000

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$2.925

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$2.910

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Continental Prestige Electronics

USA . 1,911 parts In-Stock

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$9.816

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Netroflash

USA . 50 parts In-Stock

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$9.816

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Modulus Dynamics

Lithuania . 450 parts In-Stock

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$11.118

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$11.007

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$10.674

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AZTECH Wire

Italy . 864 parts In-Stock

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$14.837

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Corohmni

South Africa . 92 parts In-Stock

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One Stop Electronics

USA . 453 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,182 parts In-Stock

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Ampacity Inc.

Singapore . 172 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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Component Stockers USA

USA . 1,187 parts In-Stock

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Microchip USA

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Authorized Procurement Solutions

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Argo Parts USA

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Lucentia Tech

USA . 150 parts In-Stock

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$4.445

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Overview

Experience the power and versatility of the MIMXRT1062CVJ5A, brought to you by NXP Semiconductors. As a leader in semiconductor technology, NXP ensures top-notch quality and reliability in every product. This cutting-edge device falls under the category of Other Function uPs,uCs & Peripheral ICs, making it perfect for a range of applications. From smart devices to automotive systems, this product excels in delivering exceptional performance and efficiency. With its advanced features and state-of-the-art technology, the MIMXRT1062CVJ5A offers unparalleled value and benefits to our customers. Discover a world of endless possibilities with this remarkable solution from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable makes it easier and more efficient to integrate this product onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26V allows for safe and stable operation within this range, preventing damage to the components.

Package Shape: SQUARE

The square package shape allows for easy orientation and placement on the circuit board, making it user-friendly for assembly.

No. of Terminals: 196

With 196 terminals, this product offers a high level of connectivity and flexibility for various applications and interfaces.

Minimum Supply Voltage: 1.15 V

The minimum supply voltage of 1.15V ensures that the product can operate efficiently even at lower power inputs.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105 °C allows for reliable performance even in hot environments or under heavy loads.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures that the product can function effectively in cold conditions without any issues.

Terminal Finish: TIN SILVER

The tin silver terminal finish provides good conductivity and corrosion resistance, ensuring stable connections and signal transmission.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to solder and mount the product onto the circuit board, simplifying the assembly process.

Maximum Seated Height: 1.52 mm

With a low maximum seated height of 1.52mm, this product is compact and suitable for applications with space constraints.

Width: 12 mm

The width of 12mm provides a balance between size and functionality, making it versatile for a range of electronic designs.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum time at peak reflow temperature of 40 seconds, this product can withstand soldering processes without damage or degradation.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C ensures proper soldering and bonding of the components, leading to reliable connections and performance.

Length: 12 mm

The length of 12mm contributes to the overall compactness and efficiency of the product, making it suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can operate reliably in harsh environments and industrial settings without any issues.

Peripheral IC Type: SoC

The System on Chip (SoC) peripheral IC type integrates multiple functions onto a single chip, providing high performance and efficiency in a compact package.

Technology: CMOS

The CMOS technology offers low power consumption, high speed, and compatibility with a wide range of electronic devices, making it a versatile choice for various applications.

Terminal Form: BALL

The ball terminal form provides a reliable and secure connection for the product, ensuring stable signal transmission and performance.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, this product offers a high level of connectivity and compatibility with various circuit boards and components.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this product can withstand moderate exposure to moisture during storage and handling, ensuring its reliability and longevity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMXRT1062CVJ5A attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e2

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.52 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Peripheral IC Type:

SoC

Trade Compliance

MIMXRT1062CVJ5A Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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